Prosecution Insights
Prosecution Insights
Tech Center 3600 • Art Units: 2846 2893 3645
This examiner grants 100% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18510209 | SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18367619 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18465405 | SEMICONDUCTOR DEVICES HAVING GATE ELECTRODES WITH RING-SHAPED SEGMENTS THEREIN | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18540992 | Avalanche Photodiode With Field Plates | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18560567 | SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 18534658 | SEMICONDUCTOR COMPONENT AND METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT | Non-Final OA | Robert Bosch GmbH |
| 18466223 | SEMICONDUCTOR ELEMENT WITH SHIELDING | Non-Final OA | Robert Bosch GmbH |
| 18565918 | WIRING BOARD ASSEMBLY, LID ASSEMBLY, PACKAGE SET, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT | Non-Final OA | KYOCERA Corporation |
| 18388275 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME | Non-Final OA | MEDIATEK INC. |
| 18524445 | Backside Via and Dual Side Power Rail For Epitaxial Source/Drain Structure | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17364930 | 3D PRINTED INTERCONNECTS AND RESONATORS FOR SEMICONDUCTOR DEVICES | Non-Final OA | MACOM Technology Solutions Holdings, Inc. |
| 18468181 | Fabrication of Through-Silicon Vias | Non-Final OA | IMEC VZW |
| 18504143 | MEMORY DEVICE HAVING REDUCED CIRCUIT AREA | Non-Final OA | UNITED MICROELECTRONICS CORP. |
| 18368025 | Etching method of semiconductor structure | Final Rejection | United Semiconductor (Xiamen) Co., Ltd. |
| 18001862 | PROXIMITY SENSING FOR OPTICAL EMITTER SAFETY | Non-Final OA | ams Sensors Asia Pte. Ltd. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy