Tech Center 3600 • Art Units: 2846 2893 3645
This examiner grants 100% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18509493 | IMAGE SENSORS AND MANUFACTURING METHODS OF THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18367619 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18465405 | SEMICONDUCTOR DEVICES HAVING GATE ELECTRODES WITH RING-SHAPED SEGMENTS THEREIN | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18540992 | Avalanche Photodiode With Field Plates | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18560567 | SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 18560858 | SOLID-STATE IMAGING ELEMENT, METHOD OF MANUFACTURING SOLID-STATE IMAGING ELEMENT, AND ELECTRONIC EQUIPMENT | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18523455 | OXIDATION CONFORMALITY IMPROVEMENT WITH IN-SITU INTEGRATED PROCESSING | Non-Final OA | Applied Materials, Inc. |
| 18565918 | WIRING BOARD ASSEMBLY, LID ASSEMBLY, PACKAGE SET, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT | Non-Final OA | KYOCERA Corporation |
| 18466223 | SEMICONDUCTOR ELEMENT WITH SHIELDING | Non-Final OA | Robert Bosch GmbH |
| 18388275 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME | Non-Final OA | MEDIATEK INC. |
| 17364930 | 3D PRINTED INTERCONNECTS AND RESONATORS FOR SEMICONDUCTOR DEVICES | Non-Final OA | MACOM Technology Solutions Holdings, Inc. |
| 18468181 | Fabrication of Through-Silicon Vias | Non-Final OA | IMEC VZW |
| 18504143 | MEMORY DEVICE HAVING REDUCED CIRCUIT AREA | Non-Final OA | UNITED MICROELECTRONICS CORP. |
| 18001862 | PROXIMITY SENSING FOR OPTICAL EMITTER SAFETY | Non-Final OA | ams Sensors Asia Pte. Ltd. |
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