Prosecution Insights
Prosecution Insights
Tech Center 3600 • Art Units: 2814 2846 2893 3645
This examiner grants 100% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18607941 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18607826 | DISPLAY INCLUDING OPAQUE MATERIAL FOR REDUCING AMOUNT OF LIGHT AND ELECTRONIC DEVICE INCLUDING SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18414655 | SEMICONDUCTOR DEVICES | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18510209 | SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18465405 | SEMICONDUCTOR DEVICES HAVING GATE ELECTRODES WITH RING-SHAPED SEGMENTS THEREIN | Final Rejection | Samsung Electronics Co., Ltd. |
| 18560858 | SOLID-STATE IMAGING ELEMENT, METHOD OF MANUFACTURING SOLID-STATE IMAGING ELEMENT, AND ELECTRONIC EQUIPMENT | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18397137 | DISPLAY DEVICE | Non-Final OA | LG Display Co., Ltd. |
| 18589769 | SEMICONDUCTOR DEVICE | Non-Final OA | KABUSHIKI KAISHA TOSHIBA |
| 18731422 | DISPLAY DEVICE AND MANUFACTURING METHOD OF DISPLAY DEVICE | Non-Final OA | Magnolia White Corporation |
| 18417411 | HIGH-DENSITY SYSTEM-ON-CHIP PARTITIONING | Non-Final OA | Meta Platforms Technologies, LLC |
| 18560567 | SEMICONDUCTOR DEVICE | Final Rejection | Mitsubishi Electric Corporation |
| 18436030 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | Non-Final OA | SK hynix Inc. |
| 18540992 | Avalanche Photodiode With Field Plates | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18403103 | SEMICONDUCTOR DEVICE WITH VERTICAL BODY CONTACT AND METHODS FOR MANUFACTURING THE SAME | Non-Final OA | Micron Technology, Inc. |
| 19282255 | Backside Via and Dual Side Power Rail For Epitaxial Source/Drain Structure | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18393283 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18523455 | OXIDATION CONFORMALITY IMPROVEMENT WITH IN-SITU INTEGRATED PROCESSING | Final Rejection | Applied Materials, Inc. |
| 18504143 | MEMORY DEVICE HAVING REDUCED CIRCUIT AREA | Non-Final OA | UNITED MICROELECTRONICS CORP. |
| 18368025 | Etching method of semiconductor structure | Non-Final OA | United Semiconductor (Xiamen) Co., Ltd. |
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