Prosecution Insights
Prosecution Insights
Tech Center 3600 • Art Units: 1717 2898 3624
This examiner grants 73% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18226352 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18216632 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18302401 | LAYOUT METHOD OF SEMICONDUCTOR, INSPECTION METHOD OF WAFER, MANUFACTURING METHOD OF THE WAFER AND MANUFACTURING METHOD OF MULTI-CHIP PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18325599 | PACKAGE STRUCTURE AND PACKAGE METHOD | Non-Final OA | HUAWEI TECHNOLOGIES CO., LTD. |
| 18158090 | Selectively Dispensed Underfill and Edge Bond Patterns | Non-Final OA | Apple Inc. |
| 18125383 | ELECTRO-OPTICAL DEVICE AND ELECTRONIC APPARATUS | Final Rejection | SEIKO EPSON CORPORATION |
| 18528975 | U-SHAPED SPACER TO PROTECT THE INTRA-DEVICE SPACE REGION FOR STACKED FET | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 17451218 | CONVERTIBLE INTERCONNECT BARRIER | Non-Final OA | International Business Machines Corporation |
| 18391719 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Magnolia White Corporation |
| 17855961 | POCKETED COPPER IN FIRST LAYER INTERCONNECT AND METHOD | Final Rejection | Intel Corporation |
| 17950442 | GAS SUPPLY SYSTEM, SUBSTRATE PROCESSING APPARATUS, METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM | Non-Final OA | Kokusai Electric Corporation |
| 18236481 | SEMICONDUCTOR DEVICE WITH EMBEDDED LEADFRAME AND METHOD THEREFOR | Final Rejection | NXP B.V. |
| 18133248 | MULTI CHIP FRONT END MODULE WITH SHIELDING VIAS | Non-Final OA | Skyworks Solutions, Inc. |
| 18302804 | MEMORY DEVICE AND METHOD OF FABRICATING THE SAME | Final Rejection | MACRONIX International Co., Ltd. |
| 18379667 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | UNITED MICROELECTRONICS CORP. |
| 18244205 | INTERPOSER STRUCTURE AND PACKAGE STRUCTURE | Non-Final OA | Advanced Semiconductor Engineering, Inc. |
| 18090120 | Warpage Control of Component Carrier with Dummy Components | Final Rejection | AT & S Austria Technologie & Systemtechnik AG |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy