Prosecution Insights
Last updated: August 17, 2026

Examiner: GARCES, NELSON Y

Tech Center 2800 • Art Units: 2814 2892

This examiner grants 80% of resolved cases

Performance Statistics

80.4%
Allow Rate
+12.4% vs TC avg
634
Total Applications
+2.9%
Interview Lift
909
Avg Prosecution Days
Based on 591 resolved cases, 2023–2026

Rejection Statute Breakdown

0.2%
§101 Eligibility
32.5%
§102 Novelty
50.6%
§103 Obviousness
13.7%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18412026 IMAGE SENSOR AND ELECTRONIC APPARATUS INCLUDING THE IMAGE SENSOR Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18549470 IMAGING DEVICE Final Rejection SONY SEMICONDUCTOR SOLUTIONS CORPORATION
18291983 DISPLAY PANEL AND DISPLAY DEVICE Non-Final OA BOE Technology Group Co., Ltd.
18531037 COLOR FILTERING DBR FOR MICRO-LEDS Non-Final OA Snap Inc.
17972937 PIXELATED FILTER COMPRISING AN INTERFERENCE FILTER Non-Final OA Commissariat à l'Énergie Atomique et aux Énergies Alternatives
18422572 DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE Non-Final OA Samsung Display Co., LTD.
18470250 PACKAGE COMPRISING A SUBSTRATE WITH VIA INTERCONNECT WITH VERTICAL WALLS Final Rejection QUALCOMM Incorporated
18115711 LOW-PROFILE MEMORY APPARATUS COMPATIBLE WITH SYSTEM THERMAL SOLUTIONS AND METHOD FOR MAKING SAME Non-Final OA Intel Corporation
18174007 NANORIBBON-BASED TRANSISTORS WITH ETCH STOP LAYER TO ASSIST SUBFIN REMOVAL Non-Final OA Intel Corporation
18475566 SYSTEMS AND METHODS FOR POWER DELIVERY FOR SEMICONDUCTOR DEVICES Final Rejection Avago Technologies International Sales Pte. Limited
18475563 QUAD FLAT NO-LEAD PACKAGE WITH ENHANCED CORNER PADS FOR BOARD LEVEL RELIABILITY Non-Final OA Texas Instruments Incorporated
18505928 SEMICONDUCTOR DEVICE ASSEMBLIES WITH AN ENCAPSULANT MATERIAL HAVING ENHANCED THERMAL CONDUCTIVITY, AND METHODS FOR MAKING THE SAME Non-Final OA Micron Technology, Inc.
18430868 SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF FABRICATING SAME Non-Final OA Taiwan Semiconductor Manufacturing Company,LTD.
18413062 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
18389020 METHOD OF FABRICATING AN ELECTRONIC DEVICE Non-Final OA STMicroelectronics (Crolles 2) SAS
18190893 MOS TRANSISTOR ON SOI STRUCTURE Final Rejection STMicroelectronics (Crolles 2) SAS
18150775 SEMICONDUCTOR STRUCTURE WITH GERMANIUM-SILICON/POLYSILICON HYBRID GATE AND METHOD FOR FABRICATING SAME Non-Final OA CHANGXIN MEMORY TECHNOLOGIES, INC.

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