Prosecution Insights
Prosecution Insights
Tech Center 4100 • Art Units: 2814 2892 4100
This examiner grants 81% of resolved cases
Nelson Y. Garces serves in Tech Center 4100 and Art Unit 2814. He has overseen 604 resolved cases, resulting in an allowance rate of 80.6 percent. This 80.6 percent allowance rate indicates a high frequency of patent grants for applications reaching a final decision. With 604 resolved cases, the data offers a robust view of his examination outcomes.
The interview lift for Garces is 3.6 percent. This 3.6 percent lift suggests a slight increase in the probability of allowance when an interview is conducted compared to cases without an interview. Given the high baseline allowance rate of 80.6 percent, the 3.6 percent lift indicates that most applications are successful regardless of whether an interview occurs. Practitioners may find that interviews are less critical for achieving an allowance in Art Unit 2814 than with other examiners.
The median time to allowance is 913 days. This 913 day duration represents the typical timeframe from filing to issuance for successful applications. Applicants can use this 913 day median to set realistic expectations for their prosecution timeline. The combination of an 80.6 percent allowance rate and this median pendency defines the current environment for this examiner.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18412026 | IMAGE SENSOR AND ELECTRONIC APPARATUS INCLUDING THE IMAGE SENSOR | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18443670 | MASK ASSEMBLY AND METHOD OF MANUFACTURING DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 18422572 | DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18421611 | DISPLAY DEVICE | Final Rejection | Samsung Display Co., LTD. |
| 18760808 | METHOD OF MANUFACTURING LIGHT-EMITTING ELEMENT | Non-Final OA | NICHIA CORPORATION |
| 17972937 | PIXELATED FILTER COMPRISING AN INTERFERENCE FILTER | Non-Final OA | Commissariat à l'Énergie Atomique et aux Énergies Alternatives |
| 18508827 | PANEL AND METHOD FOR MANUFACTURING THE SAME | Final Rejection | CANON KABUSHIKI KAISHA |
| 18115711 | LOW-PROFILE MEMORY APPARATUS COMPATIBLE WITH SYSTEM THERMAL SOLUTIONS AND METHOD FOR MAKING SAME | Non-Final OA | Intel Corporation |
| 18114120 | PROTECTION AGAINST ELECTROMIGRATION WITHIN A LAYER OF AN INTEGRATED CIRCUIT | Final Rejection | Intel Corporation |
| 17940195 | BARRIER LAYER FOR DIELECTRIC RECESS MITIGATION | Non-Final OA | Intel Corporation |
| 18475566 | SYSTEMS AND METHODS FOR POWER DELIVERY FOR SEMICONDUCTOR DEVICES | Final Rejection | Avago Technologies International Sales Pte. Limited |
| 18292529 | PHOTODIODE ARRAY AND METHOD FOR MANUFACTURING PHOTODIODE ARRAY | Non-Final OA | KYOCERA Corporation |
| 18475476 | CONTACTS FOR JOSEPHSON JUNCTION-BASED QUBITS | Non-Final OA | International Business Machines Corporation |
| 18505928 | SEMICONDUCTOR DEVICE ASSEMBLIES WITH AN ENCAPSULANT MATERIAL HAVING ENHANCED THERMAL CONDUCTIVITY, AND METHODS FOR MAKING THE SAME | Final Rejection | Micron Technology, Inc. |
| 18603113 | METHOD FOR MANUFACTURING A PLURALITY OF ELECTRONIC COMPONENTS | Non-Final OA | STMicroelectronics International N.V. |
| 18590785 | AIR-GAP IN TRENCH FIELD PLATE POWER MOSFET FOR REDUCED POWER LOSS PERFORMANCE | Non-Final OA | STMicroelectronics International N.V. |
| 18190893 | MOS TRANSISTOR ON SOI STRUCTURE | Non-Final OA | STMicroelectronics (Crolles 2) SAS |
| 18443616 | DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18430868 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF FABRICATING SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company,LTD. |
| 18413062 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18756313 | SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED |
| 18434981 | SEMICONDUCTOR DEVICE | Non-Final OA | ROHM Co., LTD. |
| 18735534 | METHOD FOR PREPARING PIXEL DEFINING LAYER | Non-Final OA | DUK SAN NEOLUX CO., LTD. |
| 18477635 | SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE | Final Rejection | FUJI ELECTRIC CO., LTD. |
| 17758011 | DISPLAY PANEL INCLUDING OXYGEN SUPPLEMENT FUNCTIONAL LAYER AND MANUFACTURING METHOD THEREOF, AND MOBILE TERMINAL | Non-Final OA | GUANGZHOU CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| 17173469 | IMAGE SENSOR HAVING A GRID STRUCTURE WITH SMALLER TOP WIDTH THAN BOTTOM WIDTH | Non-Final OA | VisEra Technologies Company Limited |
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