Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2811
This examiner grants 83% of resolved cases
Samuel A Gebremariam is an examiner in Tech Center 2800 and Art Unit 2811, with a high volume of 846 resolved cases. The examiner has an allowance rate of 83.2 percent, which is quite favorable for applicants. The median days to allowance is 1004, providing a benchmark for the expected duration of successful prosecution.
The interview lift for this examiner is 8.1 percent. While this indicates a positive impact from direct engagement, the benefit is more moderate than with some other examiners. However, an interview can still be a useful tool to refine claim language and potentially expedite the 1004-day process. The 846 resolved cases suggest a consistent and predictable examination style.
With an 83.2 percent allowance rate, well-supported applications have a strong chance of success. Practitioners should use the 8.1 percent interview lift as a tactical option when written communication does not lead to a quick resolution. The 1004-day timeline should be clearly communicated to clients as part of their IP planning.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18699894 | DISPLAY PANEL AND PREPARATION METHOD THEREFOR, AND DISPLAY DEVICE | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18211455 | SUBSTRATE PROCESS FLOW FOR ENABLING SUBSTRATE TO DIE HYBRID BONDING | Non-Final OA | Intel Corporation |
| 18524762 | REDUCED OPTICAL TRANSMITTANCE GLASSES FOR EMISSIVE DISPLAYS | Final Rejection | CORNING INCORPORATED |
| 18614794 | HYBRID INTERCONNECT STRUCTURE WITH TOPOLOGICAL CONDUCTOR INTERFACE LAYER | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18454242 | DYNAMIC PLATED METAL THICKNESS FOR SEMICONDUCTOR PACKAGE | Final Rejection | Texas Instruments Incorporated |
| 17852925 | INTEGRATED CIRCUIT WITH INDUCTOR IN MAGNETIC PACKAGE | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 17841838 | ARCHITECTURE AND PACKAGING FOR INTEGRATED CIRCUITS | Final Rejection | Cisco Technology, Inc. |
| 18776416 | 3DIC STRUCTURE FOR HIGH VOLTAGE DEVICE ON A SOI SUBSTRATE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18655466 | SEMICONDUCTOR DEVICES HAVING CONTACT FIELD PLATES AND METHODS FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18126701 | MICRO-LED STRUCTURES AND PHOTOLUMINESCENT MATERIALS HAVING UV LIGHT FILTERS | Final Rejection | Applied Materials, Inc. |
| 18429117 | INTEGRATED CIRCUIT DIE STACK WITH A BRIDGE DIE | Final Rejection | Advanced Micro Devices, Inc. |
| 18718313 | PROCESS FOR THE MANUFACTURE OF A SEMICONDUCTOR STRUCTURE COMPRISING A POLYCRYSTALLINE SILICON CARBIDE SUBSTRATE AND AN ACTIVE LAYER OF SINGLE-CRYSTAL SILICON CARBIDE | Non-Final OA | Soitec |
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