Prosecution Insights
Last updated: April 19, 2026

Examiner: GEBREMARIAM, SAMUEL A

Tech Center 2800 • Art Units: 2811

This examiner grants 83% of resolved cases

Performance Statistics

83.0%
Allow Rate
+15.0% vs TC avg
844
Total Applications
+8.9%
Interview Lift
1031
Avg Prosecution Days
Based on 825 resolved cases, 2023–2026

Rejection Statute Breakdown

0.4%
§101 Eligibility
31.3%
§102 Novelty
36.5%
§103 Obviousness
21.2%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18332413 SEMICONDUCTOR DEVICES Non-Final OA Samsung Electronics Co., Ltd.
18454242 DYNAMIC PLATED METAL THICKNESS FOR SEMICONDUCTOR PACKAGE Non-Final OA Texas Instruments Incorporated
17852925 INTEGRATED CIRCUIT WITH INDUCTOR IN MAGNETIC PACKAGE Non-Final OA TEXAS INSTRUMENTS INCORPORATED
19285667 SCAN NEEDLE AND SCAN DISPLAY SYSTEM INCLUDING SAME Non-Final OA JADE BIRD DISPLAY (SHANGHAI) LIMITED
18360926 ENCAPSULATION STRUCTURE, SUBSTRATE, AND ENCAPSULATION METHOD Non-Final OA HUAWEI TECHNOLOGIES CO., LTD.
18126701 MICRO-LED STRUCTURES AND PHOTOLUMINESCENT MATERIALS HAVING UV LIGHT FILTERS Non-Final OA Applied Materials, Inc.
18193777 BOND STRUCTURES HAVING SHIELDING STRUCTURES FOR STACKED CHIPS Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
17744374 OPTIMIZED PHASE CHANGE MEMORY STRUCTURE TO IMPROVE NUCLEATION TIME VARIATION Non-Final OA Intel Corporation
18757659 SEMICONDUCTOR STRUCTURE HAVING BOTH GATE-ALL-AROUND DEVICES AND PLANAR DEVICES Non-Final OA Taiwan Semiconductor Manufacturing Co., Ltd.
18151689 MEMS Structure with Reduced Peeling and Methods Forming the Same Non-Final OA Taiwan Semiconductor Manufacturing Co., Ltd.
18302610 MEMS STRUCTURE INCLUDING A BURIED CAVITY WITH ANTISTICTION PROTUBERANCES, AND MANUFACTURING METHODS THEREOF Non-Final OA STMicroelectronics S.r.l.
18180588 SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME Non-Final OA Winbond Electronics Corp.
18524809 METHOD FOR MANUFACTURING SEMICONDUCTOR DIE Non-Final OA SK keyfoundry Inc.
18457867 COMPOSITE SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND SEMICONDUCTOR DEVICE STRUCTURE Non-Final OA ENKRIS SEMICONDUCTOR, INC.

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