Prosecution Insights
Prosecution Insights
Tech Center 3700 • Art Units: 2829 2893 2899 3745
This examiner grants 92% of resolved cases
Examiner Michael Lebentritt, in Tech Center 3700 and Art Unit 2829, has an allowance rate of 92.2% across 1014 resolved cases. The interview lift is 6.2%, showing that interviews provide a small increase in the probability of a grant above the 92.2% baseline. This 6.2% lift suggests that while the baseline is already high, interviews can still be beneficial for resolving specific issues in Art Unit 2829.
The median days to allowance for this examiner is 839. This 839-day timeframe is a key indicator of the speed of prosecution. With 1014 resolved cases, the data is robust and reflects a consistent pattern of performance. Practitioners can expect the 92.2% allowance rate to be a reliable guide, and the 839-day median pendency highlights the efficiency of the process. The 6.2% interview lift remains a useful tactical option.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18887445 | SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18820590 | SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18698012 | Packaging Member and Manufacturing Method therefor, Backlight Source Assembly, and Display Apparatus | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18830852 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18738293 | DISPLAY DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18669031 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 18632390 | Thick Film Single Layer Capacitor | Non-Final OA | KYOCERA AVX Components Corporation |
| 18686543 | Power Electronics Assembly | Final Rejection | Siemens Aktiengesellschaft |
| 18748250 | CONTACT AND VIA STRUCTURES | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18743957 | MULTIZONE THERMAL DEVICE FOR SEMICONDUCTOR STRUCTURES | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18402935 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18493768 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18773367 | UNDERLAYER OF MULTILAYER STRUCTURE AND METHODS OF USE THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18637265 | SEMICONDUCTOR DEVICE WITH NON-PLANAR MOSFET DEVICE DIE AND PLANAR MOSFET DEVICE DIE | Non-Final OA | Silicon Storage Technology, Inc. |
| 18160508 | Composite Materials, Devices, and Methods of Encapsulating Perovskites | Non-Final OA | The Florida State University Research Foundation, Inc. |
| 18129865 | Flexible Solar Panels and Photovoltaic Devices, and Methods and Systems of Producing Them | Non-Final OA | SOLARPAINT LTD. |
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