Prosecution Insights
Prosecution Insights
Tech Center 4100 • Art Units: 2800 2892 4100
This examiner grants 88% of resolved cases
Colin Russell McCutcheon is an examiner in Tech Center 4100, working in Art Unit 2800. Based on 56 resolved cases, the examiner has a high allowance rate of 87.5%. This suggests a very positive environment for applicants, as the vast majority of cases reach issuance. The 87.5% allowance rate indicates that the examiner is generally receptive to the technical merits of the applications in this art unit.
The interview lift is 21.2%, which shows that direct communication is a beneficial strategy. An interview increases the likelihood of allowance significantly, providing a useful path for resolving any outstanding rejections. The median days to allowance is 1209, which is a standard duration for the prosecution cycle. This 1209-day timeline, combined with the 87.5% allowance rate, suggests a predictable path to issuance. For practitioners, the 21.2% interview lift is a valuable tool to further improve the already high chances of success. Given the 56 resolved cases, the data indicates that while most cases are allowed, proactive engagement can help navigate the 1209-day median pendency more effectively in Tech Center 4100.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18608130 | MAGNETIC MEMORY DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18220394 | IMAGE SENSOR MODULE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18580483 | DISPLAY SUBSTRATE, DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | BOE TECHNOLOGY GROUP CO., LTD. |
| 18743496 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 18735511 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Samsung Display Co., LTD. |
| 18525500 | PACKAGE, SEMICONDUCTOR DEVICE, AND APPARATUS | Non-Final OA | CANON KABUSHIKI KAISHA |
| 18715231 | ARRAY SUBSTRATE, DISPLAY PANEL, DISPLAY DEVICE AND REPAIR METHOD | Non-Final OA | Beijing BOE Technology Development Co., Ltd. |
| 18739666 | REPAIR STRUCTURE FOR BONDED SEMICONDUCTOR DEVICE | Non-Final OA | International Business Machines Corporation |
| 18783476 | ARRAY SUBSTRATE AND DISPLAY DEVICE | Non-Final OA | Sharp Display Technology Corporation |
| 18804598 | RF SWITCH | Non-Final OA | STMicroelectronics International N.V. |
| 18165669 | ETCHING PROCESS WITH PROTECTED REGION | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17849720 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE HAVING 2D MATERIAL LAYER | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18206885 | SUBSTRATE AND MANUFACTURING METHOD FOR THE SAME | Non-Final OA | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18673318 | SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18839924 | AN INTEGRATED CIRCUIT COMPRISING A RESISTIVE SWITCHING SECTION ENABLING PHOTON EMISSION | Non-Final OA | ETH ZURICH |
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