Tech Center 2800 • Art Units: 2831 2835 2891
This examiner grants 68% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18389116 | POWER MODULE COOLING DEVICE | Final Rejection | Kia Corporation |
| 18688569 | ELECTRICAL SWITCHGEAR WITH IMPROVED COOLING | Non-Final OA | Eaton Intelligent Power Limited |
| 18432588 | CAGE DESIGN FOR VERTICAL LINE CARD | Final Rejection | Google LLC |
| 18574978 | Device for Dissipating Heat From Electronic Components in an Electronics Housing | Final Rejection | Siemens Aktiengesellschaft |
| 18565916 | IMMERSION COOLING SYSTEMS, APPARATUS, AND RELATED METHODS | Final Rejection | Intel Corporation |
| 18070433 | DIMM COOLING ASSEMBLY WITH HEAT SPREADER ANTI-ROTATION MECHANISM | Non-Final OA | Intel Corporation |
| 18627647 | ELECTRONIC DEVICE | Non-Final OA | Yokogawa Electric Corporation |
| 18688932 | THERMAL MANAGEMENT DEVICE FOR A MODULAR PLATFORM OF AN ELECTRIC MOTOR VEHICLE CHASSIS | Non-Final OA | VALEO SYSTEMES THERMIQUES |
| 18633152 | CARRIER FRAME FOR A PRINTED CIRCUIT BOARD ASSEMBLY | Non-Final OA | DELL PRODUCTS L.P. |
| 18611943 | INFORMATION HANDLING SYSTEM THERMAL FIN TO REDUCE DUST FIBER ACCUMULATION | Non-Final OA | Dell Products L.P. |
| 18388539 | HEAT EXCHANGE ENHANCED MODULE SHELL | Non-Final OA | Molex, LLC |
| 18527516 | HEAT DISSIPATION STRUCTURE AND UNMANNED AERIAL VEHICLE | Final Rejection | AUTEL ROBOTICS CO., LTD. |
| 17951075 | Phone Case with Thermal Ground Plane | Final Rejection | Kelvin Thermal Technologies, Inc. |
| 18649558 | COOLING APPARATUS FOR DISSIPATING HEAT IN AN ELECTRONIC DEVICE | Non-Final OA | Sandisk Technologies, Inc. |
| 18538781 | LIQUID-COOLED CABINET AND DATA CENTER COMPUTER ROOM | Non-Final OA | Hebei Qinhuai Data Co., Limited. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy