Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2831 2835 2841 2891 2899
This examiner grants 70% of resolved cases
Examiner Matthew Sinclair Muir has resolved 136 cases in Art Unit 2831. Within Tech Center 2800, the examiner has an allowance rate of 69.9 percent. This 69.9 percent rate is derived from the 136 cases that have reached a final resolution, providing a benchmark for practitioners.
The median days to allowance is 961. This 961 day figure represents the median time from filing to grant for successful applications. Practitioners should consider this 961 day timeline when planning prosecution steps in Art Unit 2831.
The interview lift is 30.4 percent, which indicates an increase in the probability of allowance when an interview is conducted relative to the 69.9 percent base rate. This 30.4 percent lift suggests that interviews are associated with a higher likelihood of allowance. The 30.4 percent lift provides a statistical basis for engaging in direct communication with the examiner in Tech Center 2800.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18856279 | DISPLAY DEVICE | Non-Final OA | LG ELECTRONICS INC. |
| 18441504 | THERMOMAGNETIC COOLING USING MAGNETORHEOLOGICAL FLUID | Non-Final OA | Toyota Motor Engineering & Manufacturing North America, Inc. |
| 18851979 | THERMAL CHASSIS | Non-Final OA | Google LLC |
| 18432588 | CAGE DESIGN FOR VERTICAL LINE CARD | Non-Final OA | Google LLC |
| 18070433 | DIMM COOLING ASSEMBLY WITH HEAT SPREADER ANTI-ROTATION MECHANISM | Final Rejection | Intel Corporation |
| 18757596 | MULTI-DIRECTIONAL HEATSINK COOLING SYSTEM | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18574978 | Device for Dissipating Heat From Electronic Components in an Electronics Housing | Non-Final OA | Siemens Aktiengesellschaft |
| 18834335 | SEMICONDUCTOR DEVICE | Non-Final OA | HITACHI ASTEMO, LTD. |
| 18917052 | ELECTRONIC DEVICE | Non-Final OA | DENSO CORPORATION |
| 18962870 | HEAT DISSIPATION STRUCTURE, VEHICLE-MOUNTED DEVICE, AND TERMINAL DEVICE | Non-Final OA | Yinwang Intelligent Technologies Co., Ltd. |
| 18633152 | CARRIER FRAME FOR A PRINTED CIRCUIT BOARD ASSEMBLY | Non-Final OA | DELL PRODUCTS L.P. |
| 18723057 | IMMERSION-TYPE LIQUID-COOLING DEVICE AND IMMERSION-TYPE LIQUID-COOLING SYSTEM | Final Rejection | Beijing Bytedance Network Technology Co., Ltd. |
| 18649558 | COOLING APPARATUS FOR DISSIPATING HEAT IN AN ELECTRONIC DEVICE | Final Rejection | Sandisk Technologies, Inc. |
| 18897679 | ELECTRONIC DEVICE AND SERVER | Non-Final OA | xFusion Digital Technologies Co., Ltd. |
| 18868620 | Liquid Immersion Cooling Platform with Localized Cooling and Fluid Quality Detection | Non-Final OA | Modine LLC |
| 18403850 | COOLING MODULE, ELECTRONIC SYSTEM AND CONTROL METHOD THEREOF | Non-Final OA | Wiwynn Corporation |
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