Prosecution Insights
Prosecution Insights
Tech Center 4100 • Art Units: 2891 4100
This examiner grants 90% of resolved cases
Nora Taylor Nix serves in Tech Center 4100 and Art Unit 2891. The data includes 88 resolved cases and an allowance rate of 89.8%. This 89.8% rate suggests a very favorable environment for applicants seeking a patent grant. The median days to allowance is 1126, which provides a benchmark for the expected duration of successful applications. With 88 resolved cases, the data offers a clear look at the examiner's historical performance.
The interview lift is 9.4%, showing that interviews provide a small additional benefit to the 89.8% baseline allowance rate. Practitioners can use this 9.4% lift to guide their tactical decisions during prosecution. The 1126 median days to allowance helps in managing client expectations regarding the total time to grant. Direct engagement with the examiner remains a useful option as shown by the 9.4% lift. This analysis of Art Unit 2891 is grounded in the 88 resolved cases recorded.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18345130 | SEMICONDUCTOR DEVICES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18555039 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | Final Rejection | BOE TECHNOLOGY GROUP CO., LTD. |
| 18395845 | DISPLAY PANEL | Final Rejection | Samsung Display Co., Ltd. |
| 18591188 | SEMICONDUCTOR DEVICE | Non-Final OA | KABUSHIKI KAISHA TOSHIBA |
| 18474859 | CHIP ON FILMS AND DISPLAY DEVICES | Final Rejection | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| 18757013 | CONTACT RESISTANCE REDUCTION IN TRANSISTOR DEVICES WITH METALLIZATION ON BOTH SIDES | Non-Final OA | Intel Corporation |
| 18555043 | SOLID-STATE IMAGING APPARATUS AND ELECTRONIC DEVICE | Final Rejection | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18539618 | TWO-DIMENSIONAL LAYER ASSISTED THREE-DIMENSIONAL TOP VIA INTERCONNECTS | Non-Final OA | International Business Machines Corporation |
| 18474703 | ELECTRONIC COMPONENT PACKAGE HAVING A METAL PLATE STRUCTURE THAT INCLUDES A TAPERED FOOT PORTION | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18419190 | SIDEWALL STRUCTURES FOR MEMORY CELLS IN VERTICAL STRUCTURES | Non-Final OA | Micron Technology, Inc. |
| 18780436 | METHOD OF FORMING PACKAGE STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18771311 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17504700 | Approaches for Fabricating N-Polar AlxGa1-xN Templates for Electronic and Optoelectronic Devices | Final Rejection | University of South Carolina |
| 17806832 | MANUFACTURING METHOD FOR DEVICE CHIP | Final Rejection | DISCO CORPORATION |
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