Prosecution Insights
Prosecution Insights
Tech Center 3700 • Art Units: 2891 2892 3729
This examiner grants 78% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18455922 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18649568 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 18453283 | SENSING DEVICE AND METHOD OF MANUFACTURING SENSING DEVICE | Final Rejection | Innolux Corporation |
| 18454084 | INTEGRATED CIRCUIT AND SEMICONDUCTOR DEVICE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18493527 | SEMICONDUCTOR WAFER THINNED BY CRACK PROPAGATION | Non-Final OA | Sandisk Technologies, Inc. |
| 18517428 | SHADOW EVAPORATION MASK FOR FABRICATING TUNNEL JUNCTION DEVICES | Non-Final OA | International Business Machines Corporation |
| 18766663 | SEMICONDUCTOR CAPACITOR AND METHOD OF FORMING THE SAME | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy