Prosecution Insights
Prosecution Insights
Tech Center 3700 • Art Units: 2891 2892 3729
This examiner grants 78% of resolved cases
Azm A. Parvez has overseen 653 resolved cases within Tech Center 3700 and Art Unit 2891. The examiner maintains a 78.4% allowance rate. Prosecution with this examiner typically takes 1132 median days to allowance. This 1132-day figure represents the time from filing to grant for the 653 resolved cases in the record.
The 27.0% interview lift suggests that interviews are a productive use of resources. For the 653 resolved cases, this lift indicates that applicants who engage in an interview see an increase in their chances of success. Practitioners should use this 27.0% lift to justify the costs of an interview during the 1132-day median prosecution period. The 78.4% allowance rate provides a baseline for predicting outcomes when developing a strategy for this examiner.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18627687 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18455922 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18237013 | FILM PACKAGE AND DISPLAY MODULE INCLUDING SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18640821 | VERTICAL POWER SEMICONDUCTOR DEVICE HAVING AN INTERLAYER DIELECTRIC STRUCTURE | Non-Final OA | Infineon Technologies AG |
| 18452567 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | Non-Final OA | SK hynix Inc. |
| 18649482 | IC PACKAGE WITH CONNECTION PADS FOR DIE | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18454084 | INTEGRATED CIRCUIT AND SEMICONDUCTOR DEVICE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18650603 | HALL ELEMENT | Non-Final OA | ROHM CO., LTD. |
| 18766663 | SEMICONDUCTOR CAPACITOR AND METHOD OF FORMING THE SAME | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18752823 | MULTICOLOR LIGHT SOURCE DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Hon Hai Precision Industry Co., Ltd. |
| 18493527 | SEMICONDUCTOR WAFER THINNED BY CRACK PROPAGATION | Non-Final OA | Sandisk Technologies, Inc. |
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