Prosecution Insights
Prosecution Insights
Tech Center 3700 • Art Units: 2891 2892 3729
This examiner grants 78% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18456934 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | Final Rejection | Samsung Electronics Co., Ltd. |
| 18237013 | FILM PACKAGE AND DISPLAY MODULE INCLUDING SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18453283 | SENSING DEVICE AND METHOD OF MANUFACTURING SENSING DEVICE | Non-Final OA | Innolux Corporation |
| 18364262 | CHIP PACKAGE STRUCTURE AND FABRICATION | Non-Final OA | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 18455066 | CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF | Non-Final OA | Garuda Technology Co., Ltd. |
| 18455078 | Arrangement of carbon nanotubes and a method for manufacturing the arrangement | Non-Final OA | Technische Universität Darmstadt |
| 18070941 | PROTECTIVE HEAT SHIELDS FOR THERMALLY SENSITIVE COMPONENTS AND METHODS FOR PROTECTING THERMALLY SENSITIVE COMPONENTS | Non-Final OA | FLEX LTD |
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