Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2431 2836 2899
This examiner grants 48% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18394750 | SEMICONDUCTOR PACKAGE | Final Rejection | Samsung Electronics Co., Ltd. |
| 18486367 | VERTICAL SEMICONDUCTOR COMPONENT ON THE BASIS OF GALLIUM NITRIDE WITH A FRONT-SIDE MEASURING ELECTRODE | Non-Final OA | Robert Bosch GmbH |
| 18702242 | DISPLAY DEVICE | Non-Final OA | Sharp Display Technology Corporation |
| 18734078 | ELECTRONIC DEVICE | Non-Final OA | InnoLux Corporation |
| 17968830 | ELECTRONIC PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE | Final Rejection | Intel Corporation |
| 18576494 | WAVEGUIDE-TYPE LIGHT-RECEIVING ELEMENT, WAVEGUIDE-TYPE LIGHT-RECEIVING ELEMENT ARRAY, AND METHOD FOR MANUFACTURING WAVEGUIDE-TYPE LIGHT-RECEIVING ELEMENT | Non-Final OA | Mitsubishi Electric Corporation |
| 18434215 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18504874 | ENABLING MULTI-VT IN CFETS WITH COMMON GATES AND A COMMON DIPOLE DOPANT | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18753020 | METHODS OF FORMING INTERCONNECT STRUCTURES | Non-Final OA | Applied Materials, Inc. |
| 18664536 | SEMICONDUCTOR STORAGE DEVICE | Non-Final OA | Kioxia Corporation |
| 18394719 | SYSTEM-ON-CHIP GAP FILL METHOD AND STRUCTURE | Non-Final OA | Advanced Micro Devices, Inc. |
| 17977281 | SEMICONDUCTOR STRUCTURE WITH DIELECTRIC PILLARS | Non-Final OA | International Business Machines Corporation |
| 18746090 | MAGNETORESISTIVE RANDOM ACCESS MEMORY AND METHOD FOR FABRICATING THE SAME | Non-Final OA | UNITED MICROELECTRONICS CORP. |
| 18685616 | SEMICONDUCTOR MATERIAL WAFERS OPTIMIZED FOR LINEAR AMPLIFIERS | Non-Final OA | MACOM Technology Solutions Holdings, Inc. |
| 18152191 | SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | CHANGXIN MEMORY TECHNOLOGIES, INC. |
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