Tech Center 2800 • Art Units: 2431 2836 2899
This examiner grants 47% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18394750 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18385544 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18227064 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18486367 | VERTICAL SEMICONDUCTOR COMPONENT ON THE BASIS OF GALLIUM NITRIDE WITH A FRONT-SIDE MEASURING ELECTRODE | Non-Final OA | Robert Bosch GmbH |
| 18462222 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 18448600 | MEMS SENSOR AND MEMS SENSOR MANUFACTURING METHOD | Non-Final OA | ROHM CO., LTD. |
| 18226382 | LIGHT RECEIVING DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Sumitomo Electric Industries, Ltd. |
| 18394719 | SYSTEM-ON-CHIP GAP FILL METHOD AND STRUCTURE | Non-Final OA | Advanced Micro Devices, Inc. |
| 18524195 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME | Non-Final OA | MIRISE Technologies Corporation |
| 18552463 | INTERCONNECT ALIGNMENT SYSTEM AND METHOD | Non-Final OA | SAMTEC, INC. |
| 18281672 | HEAT-DISSIPATING STRUCTURE FOR ELECTRONIC DEVICE | Non-Final OA | NEC Platforms, Ltd. |
| 18497525 | LIGHT EMITTING DIODE | Non-Final OA | Taiwan-Asia Semiconductor Corporation |
| 18486172 | CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Unimicron Technology Corp. |
| 18385220 | SEMICONDUCTOR STRUCTURE AND PREPARATION METHOD THEREOF | Non-Final OA | Enkris Semiconductor, Inc. |
| 18486180 | MEMORY CELL ARRANGEMENT AND METHODS | Non-Final OA | Ferroelectric Memory GmbH |
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