Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2431 2836 2899
This examiner grants 50% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18394750 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18394575 | HEAT DISSIPATION STRUCTURES | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18486396 | DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 17968830 | ELECTRONIC PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE | Final Rejection | Intel Corporation |
| 18486367 | VERTICAL SEMICONDUCTOR COMPONENT ON THE BASIS OF GALLIUM NITRIDE WITH A FRONT-SIDE MEASURING ELECTRODE | Non-Final OA | Robert Bosch GmbH |
| 18462222 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 18552463 | INTERCONNECT ALIGNMENT SYSTEM AND METHOD | Non-Final OA | SAMTEC, INC. |
| 18394719 | SYSTEM-ON-CHIP GAP FILL METHOD AND STRUCTURE | Non-Final OA | Advanced Micro Devices, Inc. |
| 18281672 | HEAT-DISSIPATING STRUCTURE FOR ELECTRONIC DEVICE | Non-Final OA | NEC Platforms, Ltd. |
| 18524195 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME | Non-Final OA | MIRISE Technologies Corporation |
| 18152191 | SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | Final Rejection | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| 18486180 | MEMORY CELL ARRANGEMENT AND METHODS | Non-Final OA | Ferroelectric Memory GmbH |
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