Tech Center 2800 • Art Units: 2898
This examiner grants 75% of resolved cases
Kenneth Stephen Stephenson is an examiner in Art Unit 2898 within Tech Center 2800. The examiner has resolved 8 cases, maintaining an allowance rate of 75.0%. This 75.0% rate serves as a strong baseline for applicants, indicating a high frequency of successful outcomes. The median days to allowance for these cases is 1301.
The interview lift is currently 0.0%. This 0.0% figure means that, for the 8 cases resolved so far, interviews have not shown a statistical impact on the 75.0% allowance rate. While the sample size is small, practitioners should focus on the 1301 day median pendency as the primary factor in their prosecution planning. The 1301 day timeline reflects the duration from filing to grant.
With 8 resolved cases, the data provides an initial look at the examiner's tendencies in Tech Center 2800. The 75.0% allowance rate is a positive indicator, even without an additional lift from interviews. Practitioners can use the 1301 day median to set realistic expectations for the length of the prosecution process under this examiner.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18243251 | METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18366922 | INTEGRATED CIRCUIT DEVICE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18522563 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Samsung Display Co., LTD. |
| 18509087 | DISPLAY MODULE AND METHOD OF MANUFACTURING DISPLAY MODULE | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18374284 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18467904 | FIELD EFFECT TRANSISTOR DEVICE | Final Rejection | HUAWEI TECHNOLOGIES CO., LTD. |
| 17557579 | DUMMY DIE PLACEMENT WITHIN A DICING STREET OF A WAFER | Final Rejection | Intel Corporation |
| 18738635 | DOG BONE CHANNEL FET WITH NO INNER SPACER | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18499209 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | Non-Final OA | SK hynix Inc. |
| 18453949 | SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Final Rejection | Kioxia Corporation |
| 18775591 | Fin Field-Effect Transistor With Void and Method of Forming The Same | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18592029 | Source/Drains for Stacked Device Structures and Methods of Fabrication Thereof | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18366937 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18474179 | ADVANCED PROCESS IN PROCESS PAIR WITHOUT FUSES | Non-Final OA | ATI Technologies ULC |
| 17876467 | RESISTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | UNITED MICROELECTRONICS CORP. |
| 18446127 | COPPER PAD METALLIZATION SYSTEMS AND RELATED METHODS | Final Rejection | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
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