Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2898
This examiner grants 80% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18371663 | SEMICONDUCTOR DEVICES HAVING BIT LINES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18366922 | INTEGRATED CIRCUIT DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18374284 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18467904 | FIELD EFFECT TRANSISTOR DEVICE | Non-Final OA | HUAWEI TECHNOLOGIES CO., LTD. |
| 17854305 | SELF-ALIGNED BACKSIDE GATE CONTACT FOR BACKSIDE SIGNAL LINE INTEGRATION | Final Rejection | International Business Machines Corporation |
| 18243085 | INTEGRATION APPROACH FOR INCREASE OF THE MOBILITY AND ON-CURRENT IN 3D NAND CELLS | Non-Final OA | Applied Materials, Inc. |
| 18319876 | EPITAXIAL SILICON CHANNEL GROWTH | Non-Final OA | Applied Materials, Inc. |
| 17557932 | SEMICONDUCTOR STRUCTURE FOR NANORIBBON ARCHITECTURES | Non-Final OA | Intel Corporation |
| 17552845 | PACKAGING ARCHITECTURE WITH INTEGRATED CIRCUIT DIES OVER INPUT/OUTPUT INTERFACES | Final Rejection | Intel Corporation |
| 17858001 | CASTELLATION, HATCHING, AND OTHER SURFACE PATTERNS IN DIELECTRIC SURFACES FOR HYBRID BONDING WITH INCREASED SURFACE AREA, BOND STRENGTH, AND ALIGNMENT | Final Rejection | Micron Technology, Inc. |
| 18453949 | SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Kioxia Corporation |
| 18181821 | SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | Kioxia Corporation |
| 18366937 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18231092 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE | Non-Final OA | SK hynix Inc. |
| 18474179 | ADVANCED PROCESS IN PROCESS PAIR WITHOUT FUSES | Non-Final OA | ATI Technologies ULC |
| 17836628 | FIN PROFILE MODULATION | Final Rejection | Taiwan Semiconductor Manufacturing CO., Ltd. |
| 18446127 | COPPER PAD METALLIZATION SYSTEMS AND RELATED METHODS | Non-Final OA | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 17876467 | RESISTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME | Final Rejection | UNITED MICROELECTRONICS CORP. |
| 18489098 | THREE-TERMINAL BIDIRECTIONAL ENHANCEMENT MODE GaN SWITCH | Non-Final OA | Efficient Power Conversion Corporation |
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