Tech Center 2800 • Art Units: 2898
This examiner grants 80% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18366922 | INTEGRATED CIRCUIT DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18374284 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18319876 | EPITAXIAL SILICON CHANNEL GROWTH | Non-Final OA | Applied Materials, Inc. |
| 17807795 | METHOD AND STRUCTURE OF FORMING CONTACTS AND GATES FOR STAGGERED FET | Final Rejection | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18366937 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17552845 | PACKAGING ARCHITECTURE WITH INTEGRATED CIRCUIT DIES OVER INPUT/OUTPUT INTERFACES | Final Rejection | Intel Corporation |
| 18453949 | SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Kioxia Corporation |
| 17863594 | WAFER BONDING METHOD USING SELECTIVE DEPOSITION AND SURFACE TREATMENT | Final Rejection | Tokyo Electron Limited |
| 18231092 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE | Non-Final OA | SK hynix Inc. |
| 17836628 | FIN PROFILE MODULATION | Final Rejection | Taiwan Semiconductor Manufacturing CO., Ltd. |
| 18446127 | COPPER PAD METALLIZATION SYSTEMS AND RELATED METHODS | Non-Final OA | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 18238022 | SEMICONDUCTOR DEVICE WITH RESISTANCE MODIFICATION DOPED REGION | Final Rejection | NANYA TECHNOLOGY CORPORATION |
| 18489098 | THREE-TERMINAL BIDIRECTIONAL ENHANCEMENT MODE GaN SWITCH | Non-Final OA | Efficient Power Conversion Corporation |
| 17876467 | RESISTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME | Final Rejection | UNITED MICROELECTRONICS CORP. |
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