Tech Center 2800 • Art Units: 2825 2851
This examiner grants 87% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18479724 | TECHNIQUES FOR USING INVERSE DESIGN FOR COMBINED OPTIMIZATION OF OPTICAL AND ELECTRICAL COMPONENTS IN AN OPTOELECTRONIC RECEIVER | Non-Final OA | X Development LLC |
| 17835323 | AI-BASED FLOORPLANNING FOR PRINTED CIRCUIT BOARD DESIGN | Final Rejection | Intel Corporation |
| 18023213 | Device and Method for Determining the Overall Amount of Energy for a Charging Process | Non-Final OA | Bayerische Motoren Werke Aktiengesellschaft |
| 18447964 | METHOD OF GENERATING NETLIST INCLUDING PROXIMITY-EFFECT-INDUCER (PEI) PARAMETERS | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18365250 | METHOD AND NON-TRANSITORY COMPUTER-READABLE MEDIUM FOR GENERATING LAYOUT BASED ON PATH LABELED WITH MARKER | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 18337262 | METHODS OF SELECTING DEVICES IN CIRCUIT DESIGN | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18160697 | MULTI-BIT FLIP-FLOP REGION WITH SERPENTINE DATA FLOW PATH, SEMICONDUCTOR DEVICE INCLUDING SAME, METHOD OF OPERATING SAME AND METHOD OF MANUFACTURING SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18327557 | LEAKAGE ANALYSIS ON SEMICONDUCTOR DEVICE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
| 18295530 | ADAPTING A BATTERY CHARGING PROFILE BASED ON NORMAL OPERATION OF A BATTERY-POWERED DEVICE | Non-Final OA | Cirrus Logic International Semiconductor Ltd. |
| 18528879 | COMBINED FRONTSIDE/BACKSIDE POWER SUPPLY FOR CHARGE SHARING | Non-Final OA | International Business Machines Corporation |
| 18455083 | INSTRUMENTATION-ASSISTED EMULATION DEBUG OF ASPECT-ORIENTED HARDWARE WITH MIXED LEVELS OF ABSTRACTION | Non-Final OA | International Business Machines Corporation |
| 18458927 | LOW-SKEW SOLUTIONS FOR LOCAL CLOCK NETS IN INTEGRATED CIRCUITS | Non-Final OA | Xilinx, Inc. |
| 18278881 | METHOD OF PATTERN SELECTION FOR A SEMICONDUCTOR MANUFACTURING RELATED PROCESS | Non-Final OA | ASML NETHERLANDS B.V. |
| 18091716 | METHOD FOR DETERMINING AN ETCH PROFILE OF A LAYER OF A WAFER FOR A SIMULATION SYSTEM | Non-Final OA | ASML NETHERLANDS B.V. |
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