Tech Center 2800 • Art Units: 2171 2812 2826
This examiner grants 76% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18522244 | HEAT RADIATING MEMBER AND SEMICONDUCTOR MODULE | Non-Final OA | NIDEC CORPORATION |
| 18495467 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18544689 | STACKED FET WITH A ROBUST CONTACT | Non-Final OA | International Business Machines Corporation |
| 17856620 | CAPPING SOURCE AND DRAIN REGIONS OF TRANSISTORS TO PREVENT DIFFUSION OF DOPANTS DURING FABRICATION | Non-Final OA | Intel Corporation |
| 18194509 | DISPLAY MODULE AND DISPLAY PANEL | Non-Final OA | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| 18476591 | DIE STRUCTURES AND METHODS OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18535715 | MATERIAL LAYER DEPOSITION METHODS, MATERIAL LAYER STACKS, SEMICONDUCTOR PROCESSING SYSTEMS, AND RELATED COMPUTER PROGRAM PRODUCTS | Non-Final OA | ASM IP Holding B.V. |
| 18507528 | LIGHT EMITTING DEVICE | Non-Final OA | Oki Electric Industry Co., Ltd. |
| 18506375 | SYSTEMS AND METHODS FOR REDUCING SEMICONDUCTOR DEVICE DELAMINATION | Non-Final OA | Advanced Micro Devices, Inc. |
| 18388386 | DIODE LAYER STACK FLIP-CHIP MOUNTED TO A LEADFRAME BY USE OF A COPPER NICKEL TIN METALLIZATION STACK AND DIFFUSION SOLDERING | Non-Final OA | Infineon Technologies Austria AG |
| 18304414 | SiC MOSFET POWER SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME | Non-Final OA | DB HiTek Co., Ltd. |
| 18531805 | Semiconductor Package | Non-Final OA | DUKSAN HI METAL CO., LTD. |
| 18518457 | APPARATUS FOR BONDING ELECTRONIC COMPONENT, METHOD FOR BONDING ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING LIGHT-EMITTING DIODE DISPLAY | Non-Final OA | Stroke Precision Advanced Engineering Co., Ltd. |
| 18509292 | HIGH THERMAL CONDUCTIVITY SUBSTRATE | Non-Final OA | Phononics Ltd |
| 18554858 | SEMICONDUCTOR LIGHT EMITTING ELEMENT AND MANUFACTURE METHOD THEREOF | Non-Final OA | XIAMEN SILAN ADVANCED COMPOUND SEMICONDUCTOR CO., LTD. |
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