Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2171 2812 2826
This examiner grants 77% of resolved cases
William C Trapanese serves in Tech Center 2800 and Art Unit 2171, with a record of 656 resolved cases. The allowance rate stands at 77.1 percent, indicating the frequency of successful outcomes. These 656 resolved cases offer a data set for understanding the examiner's approach. This volume of cases forms the basis for the current metrics.
The interview lift is 20.9 percent, which highlights the impact of oral advocacy during prosecution. A median days to allowance of 1159 provides a benchmark for the speed of the process. Within Art Unit 2171, these statistics reflect the examiner's typical workflow and decision-making timeline.
For practitioners, the 20.9 percent interview lift is a relevant metric when considering a request for a personal discussion. The 77.1 percent allowance rate and the 1159 median days to allowance are factors for setting realistic goals. Data from Tech Center 2800 suggests a predictable environment for patent applications.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18653157 | INTEGRATED CIRCUIT MEMORY DEVICES HAVING HIGHLY INTEGRATED MEMORY CELLS THEREIN WITH ENHANCED LANDING PAD STRUCTURES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18650189 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18544605 | QUANTUM DEVICE | Non-Final OA | NEC Corporation |
| 18750011 | ELECTRONIC DEVICE COMPRISING A LAYER OF 2D MATERIAL | Non-Final OA | Commissariat à l'Énergie Atomique et aux Énergies Alternatives |
| 18609555 | INTEGRATED DEVICE COMPRISING EXTENDED METALLIZATION REGION FOR PILLAR INTERCONNECTS | Non-Final OA | QUALCOMM Incorporated |
| 18327968 | INTEGRATED CIRCUIT DEVICES WITH FISHBONE CAPACITOR STRUCTURES | Non-Final OA | Intel Corporation |
| 18426040 | THREE-DIMENSIONAL MEMORY DEVICE WITH COMPACT STAIRCASES AND METHODS OF FORMING THE SAME | Non-Final OA | SANDISK TECHNOLOGIES LLC |
| 18426069 | THREE-DIMENSIONAL MEMORY DEVICE WITH COMPACT STAIRCASES AND METHODS OF FORMING THE SAME | Non-Final OA | SANDISK TECHNOLOGIES LLC |
| 18692926 | METHOD FOR PRODUCING HETEROEPITAXIAL WAFER | Non-Final OA | SHIN-ETSU HANDOTAI CO., LTD. |
| 18675186 | LAYOUT OF STATIC RANDOM ACCESS MEMORY | Non-Final OA | UNITED MICROELECTRONICS CORP. |
| 18518457 | APPARATUS FOR BONDING ELECTRONIC COMPONENT, METHOD FOR BONDING ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING LIGHT-EMITTING DIODE DISPLAY | Final Rejection | Stroke Precision Advanced Engineering Co., Ltd. |
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