Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2171 2812 2826
This examiner grants 77% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18626272 | CONDUCTIVE STRUCTURE, SEMICONDUCTOR CHIP INCLUDING THE SAME AND MANUFACTURING METHOD OF THE CONDUCTIVE STRUCTURE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18601009 | THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18583125 | STANDARD CELLS, INTEGRATED CIRCUITS INCLUDING THE SAME AND DESIGN METHODS THEREOF | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18730425 | SEMICONDUCTOR DEVICE | Non-Final OA | Sony Semiconductor Solutions Corporation |
| 18734462 | DISPLAY PANEL, METHOD FOR MANUFACTURING DISPLAY PANEL, AND DISPLAY DEVICE | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18609555 | INTEGRATED DEVICE COMPRISING EXTENDED METALLIZATION REGION FOR PILLAR INTERCONNECTS | Non-Final OA | QUALCOMM Incorporated |
| 18327968 | INTEGRATED CIRCUIT DEVICES WITH FISHBONE CAPACITOR STRUCTURES | Non-Final OA | Intel Corporation |
| 18544605 | QUANTUM DEVICE | Non-Final OA | NEC Corporation |
| 18649367 | LATERALLY DIFFUSED DEPLETION MODE TRANSISTOR AND METHOD OF FABRICATING | Non-Final OA | Avago Technologies International Sales Pte. Limited |
| 18680621 | SEMICONDUCTOR STRUCTURE, AND METHOD FOR FABRICATING A STACKED DIE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18600931 | THERMAL STRUCTURE FOR SEMICONDUCTOR PACKAGE | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18600838 | SEMICONDUCTOR DEVICE INCLUDING A TEST LINE PORTION AND METHOD OF MAKING AND TESTING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18506375 | SYSTEMS AND METHODS FOR REDUCING SEMICONDUCTOR DEVICE DELAMINATION | Non-Final OA | Advanced Micro Devices, Inc. |
| 18675186 | LAYOUT OF STATIC RANDOM ACCESS MEMORY | Non-Final OA | UNITED MICROELECTRONICS CORP. |
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