Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2814 2815 2893
This examiner grants 67% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18397231 | ORGANIC LIGHT-EMITTING DEVICE AND ELECTRONIC APPARATUS INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18066206 | Integrated circuit FLUID sensor | Non-Final OA | Texas Instruments Incorporated |
| 18270891 | OHMIC-CONTACT-GATED CARBON NANOTUBE TRANSISTORS, FABRICATING METHODS AND APPLICATIONS OF SAME | Final Rejection | NORTHWESTERN UNIVERSITY |
| 18551643 | LIGHT-RECEIVING ELEMENT AND ELECTRONIC APPARATUS | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18551264 | SOLID-STATE IMAGING ELEMENT AND ELECTRONIC DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18465376 | CIRCULAR-SHAPED RESISTOR | Non-Final OA | International Business Machines Corporation |
| 18062031 | POWER GATING TRANSISTOR FOR BSPDN | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18367136 | METHODS OF FORMING SILICON NITRIDE FILMS | Final Rejection | Applied Materials, Inc. |
| 18459524 | SELECTIVE CAPPING FOR GATE-ALL-AROUND FIELD EFFECT TRANSISTORS | Non-Final OA | Applied Materials, Inc. |
| 18107326 | LOW STRESS TUNGSTEN LAYER DEPOSITION | Non-Final OA | Applied Materials, Inc. |
| 18244175 | SEMICONDUCTOR POWER MODULE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR POWER MODULE FOR A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE | Final Rejection | Hitachi Energy Ltd |
| 18177144 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18295656 | Silicidation Process for Semiconductor Devices | Non-Final OA | Tokyo Electron Limited |
| 18062449 | Methods for Etching Molybdenum | Final Rejection | Tokyo Electron Limited |
| 18364651 | Wafer Edge Protection Film Forming Method, Patterning Process, And Composition For Forming Wafer Edge Protection Film | Final Rejection | SHIN-ETSU CHEMICAL CO., LTD. |
| 18301991 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | SK hynix Inc. |
| 18327220 | 3D Stacking Structure and Method of Fabricating the Same | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17806329 | Packages Including Interconnect Die Embedded in Package Substrates | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18159457 | GAS SUPPLIER, PROCESSING APPARATUS, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Final Rejection | Kokusai Electric Corporation |
| 18006552 | LOW CEILING TEMPERATURE HOMOPOLYMERS AS SACRIFICIAL PROTECTION LAYERS FOR ENVIRONMENTALLY SENSITIVE SUBSTRATES | Non-Final OA | Lam Research Corporation |
| 18105340 | SEMICONDUCTOR DEVICE STRUCTURE WITH DIELECTRIC LINER PORTIONS AND METHOD FOR PREPARING THE SAME | Final Rejection | NANYA TECHNOLOGY CORPORATION |
| 18274010 | Thread-Based Transistors | Non-Final OA | Trustees of Tufts College |
| 18501295 | CAPACITORS WITH FLOATING METAL LAYERS | Non-Final OA | GlobalFoundries Singapore Pte. Ltd. |
| 18149200 | BACK GATE ION-SENSITIVE FIELD EFFECT TRANSISTOR SENSING WITH STACKED HIGH-K NANOSHEETS | Non-Final OA | GlobalFoundries Singapore Pte. Ltd. |
| 18387927 | THIN FILM TRANSISTOR AND MANUFACTURING METHOD FOR THE SAME | Non-Final OA | ADRC. CO. KR |
| 18224971 | Graphene nanoribbon with nanopore-based signal detection and genetic sequencing technology | Final Rejection | Acorn Genetics Inc. |
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