Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2814 2815 2893
This examiner grants 67% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18397231 | ORGANIC LIGHT-EMITTING DEVICE AND ELECTRONIC APPARATUS INCLUDING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18551643 | LIGHT-RECEIVING ELEMENT AND ELECTRONIC APPARATUS | Final Rejection | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18551264 | SOLID-STATE IMAGING ELEMENT AND ELECTRONIC DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18625348 | GATE SPACING IN INTEGRATED CIRCUIT STRUCTURES | Non-Final OA | Intel Corporation |
| 18713288 | SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| 18648202 | LEDs AND METHODS OF MANUFACTURE | Non-Final OA | THE REGENTS OF THE UNIVERSITY OF MICHIGAN |
| 18364651 | Wafer Edge Protection Film Forming Method, Patterning Process, And Composition For Forming Wafer Edge Protection Film | Non-Final OA | SHIN-ETSU CHEMICAL CO., LTD. |
| 18270891 | OHMIC-CONTACT-GATED CARBON NANOTUBE TRANSISTORS, FABRICATING METHODS AND APPLICATIONS OF SAME | Non-Final OA | NORTHWESTERN UNIVERSITY |
| 18066206 | Integrated circuit FLUID sensor | Final Rejection | Texas Instruments Incorporated |
| 18644231 | INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18459089 | STRESS AND WARPAGE MODULATING STRUCTURE FOR MULTI-STACKED WAFER AND DIE LEVEL BONDING PACKAGES | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 17887122 | METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18766246 | COAXIAL THROUGH VIA WITH NOVEL HIGH ISOLATION CROSS COUPLING METHOD FOR 3D INTEGRATED CIRCUITS | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18602392 | INTERCONNECT STRUCTURE AND FORMING METHOD THEREOF | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
| 18327220 | 3D Stacking Structure and Method of Fabricating the Same | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17806329 | Packages Including Interconnect Die Embedded in Package Substrates | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18459524 | SELECTIVE CAPPING FOR GATE-ALL-AROUND FIELD EFFECT TRANSISTORS | Final Rejection | Applied Materials, Inc. |
| 18107326 | LOW STRESS TUNGSTEN LAYER DEPOSITION | Final Rejection | Applied Materials, Inc. |
| 18244175 | SEMICONDUCTOR POWER MODULE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR POWER MODULE FOR A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE | Non-Final OA | Hitachi Energy Ltd |
| 18667255 | EMBEDDED COOLING FOR AN INTEGRATED CIRCUIT CONFIGURED WITH A BACKSIDE POWER RAIL | Non-Final OA | NVIDIA CORPORATION |
| 18605999 | MEMORY DEVICE | Non-Final OA | Kioxia Corporation |
| 18438642 | SEMICONDUCTOR BACKSIDE CONTACT SPACER ENGINEERING | Non-Final OA | International Business Machines Corporation |
| 18465376 | CIRCULAR-SHAPED RESISTOR | Final Rejection | International Business Machines Corporation |
| 18719575 | SILICON CARBIDE SUBSTRATE, METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SILICON CARBIDE SUBSTRATE | Non-Final OA | SUMITOMO ELECTRIC INDUSTRIES, LTD. |
| 18663014 | LOW RESISTIVITY FILMS CONTAINING MOLYBDENUM | Non-Final OA | Lam Research Corporation |
| 18006552 | LOW CEILING TEMPERATURE HOMOPOLYMERS AS SACRIFICIAL PROTECTION LAYERS FOR ENVIRONMENTALLY SENSITIVE SUBSTRATES | Non-Final OA | Lam Research Corporation |
| 18105340 | SEMICONDUCTOR DEVICE STRUCTURE WITH DIELECTRIC LINER PORTIONS AND METHOD FOR PREPARING THE SAME | Final Rejection | NANYA TECHNOLOGY CORPORATION |
| 18152130 | SEMICONDUCTOR DEVICE AND RELATED FABRICATION METHOD | Final Rejection | Wolfspeed, Inc. |
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