Tech Center 2800 • Art Units: 2814 2815
This examiner grants 66% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18397231 | ORGANIC LIGHT-EMITTING DEVICE AND ELECTRONIC APPARATUS INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18219244 | INTEGRATED CIRCUIT DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18148754 | METHOD AND STRUCTURE FOR REDUCED SUBSTRATE LOSS FOR GAN DEVICES | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18066206 | Integrated circuit FLUID sensor | Non-Final OA | Texas Instruments Incorporated |
| 18270891 | OHMIC-CONTACT-GATED CARBON NANOTUBE TRANSISTORS, FABRICATING METHODS AND APPLICATIONS OF SAME | Final Rejection | NORTHWESTERN UNIVERSITY |
| 18551643 | LIGHT-RECEIVING ELEMENT AND ELECTRONIC APPARATUS | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18551264 | SOLID-STATE IMAGING ELEMENT AND ELECTRONIC DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18459524 | SELECTIVE CAPPING FOR GATE-ALL-AROUND FIELD EFFECT TRANSISTORS | Non-Final OA | Applied Materials, Inc. |
| 18107326 | LOW STRESS TUNGSTEN LAYER DEPOSITION | Non-Final OA | Applied Materials, Inc. |
| 17062286 | NOVEL METHOD FOR GATE INTERFACE ENGINEERING | Final Rejection | Applied Materials, Inc. |
| 18062031 | POWER GATING TRANSISTOR FOR BSPDN | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 17446215 | CARBON-BASED LINER TO REDUCE CONTACT RESISTANCE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17829252 | Package Assembly and Method of Attaching Multi-Height Dies/Modules to Multi-Chip Active/Passive Substrate | Final Rejection | Chipletz, Inc. |
| 17840164 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18062449 | Methods for Etching Molybdenum | Non-Final OA | Tokyo Electron Limited |
| 18364651 | Wafer Edge Protection Film Forming Method, Patterning Process, And Composition For Forming Wafer Edge Protection Film | Final Rejection | SHIN-ETSU CHEMICAL CO., LTD. |
| 18301991 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | SK hynix Inc. |
| 18261558 | THIN FILM, BIOSENSOR, AND METHOD FOR PRODUCING THEM | Non-Final OA | THE UNIVERSITY OF TOKYO |
| 18327220 | 3D Stacking Structure and Method of Fabricating the Same | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17806329 | Packages Including Interconnect Die Embedded in Package Substrates | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18348602 | METHODS AND SYSTEMS FOR TOPOGRAPHY-SELECTIVE DEPOSITIONS | Final Rejection | ASM IP Holding, B.V. |
| 18159457 | GAS SUPPLIER, PROCESSING APPARATUS, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Final Rejection | Kokusai Electric Corporation |
| 18218751 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | SEMES CO., LTD. |
| 18006552 | LOW CEILING TEMPERATURE HOMOPOLYMERS AS SACRIFICIAL PROTECTION LAYERS FOR ENVIRONMENTALLY SENSITIVE SUBSTRATES | Final Rejection | Lam Research Corporation |
| 18380930 | SEMICONDUCTOR DEVICE WITH CAPPING LAYER AND METHOD FOR FABRICATING THE SAME | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18380893 | SEMICONDUCTOR DEVICE STRUCTURE WITH DIELECTRIC LINER PORTIONS AND METHOD FOR PREPARING THE SAME | Final Rejection | NANYA TECHNOLOGY CORPORATION |
| 18105340 | SEMICONDUCTOR DEVICE STRUCTURE WITH DIELECTRIC LINER PORTIONS AND METHOD FOR PREPARING THE SAME | Final Rejection | NANYA TECHNOLOGY CORPORATION |
| 18449373 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR | Non-Final OA | Magnachip Semiconductor, Ltd. |
| 18501295 | CAPACITORS WITH FLOATING METAL LAYERS | Non-Final OA | GlobalFoundries Singapore Pte. Ltd. |
| 18149200 | BACK GATE ION-SENSITIVE FIELD EFFECT TRANSISTOR SENSING WITH STACKED HIGH-K NANOSHEETS | Non-Final OA | GlobalFoundries Singapore Pte. Ltd. |
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