Prosecution Insights
Prosecution Insights
Tech Center 3700 • Art Units: 1723 1741 2812 2835 2847 2893 2896 3729
This examiner grants 68% of resolved cases
Roshn K. Varghese is an examiner in Art Unit 1723 within Tech Center 3700. The examiner has a total of 772 resolved cases. The data shows an allowance rate of 67.5% for these applications. This 67.5% rate serves as a primary metric for practitioners to evaluate the likelihood of a patent grant. The 772 resolved cases provide a substantial data set for understanding the examiner's historical tendencies.
The median days to allowance for cases assigned to this examiner is 929. This 929-day figure represents the typical duration of the prosecution cycle for successful applications. A key finding in the data is the 20.6% interview lift. This 20.6% lift indicates that the probability of allowance increases when an interview is conducted. Practitioners should consider the 20.6% lift as a reason to engage in direct communication with the examiner. The 929-day median pendency and the 67.5% allowance rate are important factors for strategic planning. By using the 20.6% interview lift, applicants may find a more effective path to allowance than through written responses alone.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18774603 | HYBRID PRINTED CIRCUIT BOARD | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18737959 | MEMORY MODULE AND ELECTRONIC DEVICE ASSEMBLY INCLUDING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18640555 | PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18503138 | MANUFACTURING METHOD OF ELECTRONIC DEVICE AND ELECTRONIC DEVICE | Final Rejection | Innolux Corporation |
| 18522330 | ELECTRONIC DEVICE | Non-Final OA | Commissariat à I'Énergie Atomique et aux Énergies Alternatives |
| 18310324 | SUBSTRATE HAVING ELECTRONIC COMPONENT MOUNTED IN A CAVITY OF A CORE USING A PLUGGING INK AND METHOD FOR MAKING THE SUBSTRATE | Final Rejection | QUALCOMM Incorporated |
| 18765420 | CIRCUIT BOARD AND METHOD OF PRODUCING CIRCUIT BOARD | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18844963 | SUPERCONDUCTING WIRE AND SUPERCONDUCTING DEVICE | Non-Final OA | SUMITOMO ELECTRIC INDUSTRIES, LTD. |
| 18776580 | WIRING BOARD AND MOUNTING STRUCTURE USING SAME | Final Rejection | KYOCERA Corporation |
| 18756756 | ELECTRONIC COMPONENT HOUSING PACKAGE AND ELECTRONIC MODULE | Non-Final OA | KYOCERA Corporation |
| 18458261 | SEMICONDUCTOR STORAGE DEVICE AND INFORMATION PROCESSING SYSTEM | Non-Final OA | Kioxia Corporation |
| 19028195 | PRINTED CIRCUIT BOARD | Non-Final OA | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18592291 | PRINTED CIRCUIT BOARD | Non-Final OA | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18435160 | PRINTED CIRCUIT BOARD | Non-Final OA | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18212863 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME | Final Rejection | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18209616 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF | Non-Final OA | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18441261 | MULTI-MATERIAL THREE-DIMENSIONAL THERMAL CONDUCTIVE TRACES | Final Rejection | MELLANOX TECHNOLOGIES, LTD. |
| 18491374 | SEMICONDUCTOR DEVICE | Final Rejection | ROHM CO., LTD. |
| 18727803 | BUS STRUCTURE SYSTEMS AND METHODS | Non-Final OA | Avery Dennison Retail Information Services LLC |
| 19020536 | GROMMET AND WIRE HARNESS | Non-Final OA | yazaki Corporation |
| 18320953 | CONDUCTIVE MODULE | Non-Final OA | YAZAKI CORPORATION |
| 18605509 | Component Carrier With Continuously Extending Vertical Connection Structure, and Manufacturing Method | Final Rejection | AT&S Austria Technologie & Systemtechnik AG |
| 18138050 | Through Package Vertical Interconnect and Method of Making Same | Non-Final OA | Chipletz, Inc. |
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