Tech Center 2800 • Art Units: 1723 1741 2812 2835 2847 2893 2896
This examiner grants 67% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18640555 | PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18230444 | FLEXIBLE CIRCUIT BOARD AND FOLDABLE ELECTRONIC DEVICE COMPRISING SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18683615 | FLEXIBLE PRINTED CIRCUIT BOARD HAVING OVERCURRENT PROTECTION FUNCTION | Final Rejection | LG ENERGY SOLUTION, LTD. |
| 18710331 | METHODS AND APPARATUS FOR MANUFACTURING AN ELECTRONIC APPARATUS | Non-Final OA | CORNING INCORPORATED |
| 18491637 | FILTERING STRUCTURE AND ELECTRONIC DEVICE | Non-Final OA | HUAWEI TECHNOLOGIES CO., LTD. |
| 18591294 | VIA ASSEMBLY FOR PRINTED CIRCUIT BOARD | Final Rejection | Cisco Technology, Inc. |
| 18417844 | MULTI-LAMINATION STRUCTURE THAT ELIMINATES MICRO CAVITY RESONANCE | Final Rejection | Cisco Technology, Inc. |
| 18391651 | CERAMIC SINTERED COMPACT SUBSTRATE, LIGHT-EMITTING DEVICE, AND METHODS FOR MANUFACTURING CERAMIC SINTERED COMPACT SUBSTRATE AND LIGHT-EMITTING DEVICE | Non-Final OA | NICHIA CORPORATION |
| 17770334 | CIRCUIT BOARD AND DISPLAY MODULE | Non-Final OA | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| 18320953 | CONDUCTIVE MODULE | Non-Final OA | YAZAKI CORPORATION |
| 18595697 | BOARD AND ELECTRONIC DEVICE | Final Rejection | KABUSHIKI KAISHA TOSHIBA |
| 18592291 | PRINTED CIRCUIT BOARD | Final Rejection | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18435160 | PRINTED CIRCUIT BOARD | Final Rejection | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18232119 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME | Non-Final OA | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18390351 | SLOT GROUND FOR IMPROVED SIGNAL INTEGRITY | Final Rejection | NVIDIA Corporation |
| 18441261 | MULTI-MATERIAL THREE-DIMENSIONAL THERMAL CONDUCTIVE TRACES | Non-Final OA | MELLANOX TECHNOLOGIES, LTD. |
| 18433841 | IN-LINE CAPACITOR MODULE | Final Rejection | NOKIA SOLUTIONS AND NETWORKS OY |
| 18677147 | POLE CAPS AND POLE PROTECTION SYSTEMS | Non-Final OA | Hexion Inc. |
| 18661198 | PRINTED WIRING BOARD | Non-Final OA | IBIDEN CO., LTD. |
| 18324278 | WIRING SUBSTRATE | Non-Final OA | IBIDEN CO., LTD. |
| 18661211 | SUBSTRATE WITH EMBEDDED ELEMENTS AND MANUFACTURING METHOD OF THE SAME | Non-Final OA | Absolics Inc. |
| 18605509 | Component Carrier With Continuously Extending Vertical Connection Structure, and Manufacturing Method | Non-Final OA | AT&S Austria Technologie & Systemtechnik AG |
| 18279735 | DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD OF SAME | Final Rejection | Meiko Electronics Co., Ltd. |
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