Prosecution Insights
Last updated: May 29, 2026

Examiner: VARGHESE, ROSHN K

Tech Center 2800 • Art Units: 1723 1741 2812 2835 2847 2893 2896

This examiner grants 67% of resolved cases

Performance Statistics

66.9%
Allow Rate
-1.1% vs TC avg
786
Total Applications
+20.5%
Interview Lift
928
Avg Prosecution Days
Based on 746 resolved cases, 2023–2026

Rejection Statute Breakdown

0%
§101 Eligibility
5.4%
§102 Novelty
90.9%
§103 Obviousness
2.9%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18640555 PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME Non-Final OA Samsung Electronics Co., Ltd.
18230444 FLEXIBLE CIRCUIT BOARD AND FOLDABLE ELECTRONIC DEVICE COMPRISING SAME Final Rejection SAMSUNG ELECTRONICS CO., LTD.
18683615 FLEXIBLE PRINTED CIRCUIT BOARD HAVING OVERCURRENT PROTECTION FUNCTION Final Rejection LG ENERGY SOLUTION, LTD.
18710331 METHODS AND APPARATUS FOR MANUFACTURING AN ELECTRONIC APPARATUS Non-Final OA CORNING INCORPORATED
18491637 FILTERING STRUCTURE AND ELECTRONIC DEVICE Non-Final OA HUAWEI TECHNOLOGIES CO., LTD.
18591294 VIA ASSEMBLY FOR PRINTED CIRCUIT BOARD Final Rejection Cisco Technology, Inc.
18417844 MULTI-LAMINATION STRUCTURE THAT ELIMINATES MICRO CAVITY RESONANCE Final Rejection Cisco Technology, Inc.
18391651 CERAMIC SINTERED COMPACT SUBSTRATE, LIGHT-EMITTING DEVICE, AND METHODS FOR MANUFACTURING CERAMIC SINTERED COMPACT SUBSTRATE AND LIGHT-EMITTING DEVICE Non-Final OA NICHIA CORPORATION
17770334 CIRCUIT BOARD AND DISPLAY MODULE Non-Final OA WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
18320953 CONDUCTIVE MODULE Non-Final OA YAZAKI CORPORATION
18595697 BOARD AND ELECTRONIC DEVICE Final Rejection KABUSHIKI KAISHA TOSHIBA
18592291 PRINTED CIRCUIT BOARD Final Rejection SAMSUNG ELECTRO-MECHANICS CO., LTD.
18435160 PRINTED CIRCUIT BOARD Final Rejection SAMSUNG ELECTRO-MECHANICS CO., LTD.
18232119 PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME Non-Final OA SAMSUNG ELECTRO-MECHANICS CO., LTD.
18390351 SLOT GROUND FOR IMPROVED SIGNAL INTEGRITY Final Rejection NVIDIA Corporation
18441261 MULTI-MATERIAL THREE-DIMENSIONAL THERMAL CONDUCTIVE TRACES Non-Final OA MELLANOX TECHNOLOGIES, LTD.
18433841 IN-LINE CAPACITOR MODULE Final Rejection NOKIA SOLUTIONS AND NETWORKS OY
18677147 POLE CAPS AND POLE PROTECTION SYSTEMS Non-Final OA Hexion Inc.
18661198 PRINTED WIRING BOARD Non-Final OA IBIDEN CO., LTD.
18324278 WIRING SUBSTRATE Non-Final OA IBIDEN CO., LTD.
18661211 SUBSTRATE WITH EMBEDDED ELEMENTS AND MANUFACTURING METHOD OF THE SAME Non-Final OA Absolics Inc.
18605509 Component Carrier With Continuously Extending Vertical Connection Structure, and Manufacturing Method Non-Final OA AT&S Austria Technologie & Systemtechnik AG
18279735 DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD OF SAME Final Rejection Meiko Electronics Co., Ltd.

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