Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 1723 1741 2812 2835 2847 2893 2896
This examiner grants 67% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18774603 | HYBRID PRINTED CIRCUIT BOARD | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18640555 | PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 17770334 | CIRCUIT BOARD AND DISPLAY MODULE | Non-Final OA | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| 18391651 | CERAMIC SINTERED COMPACT SUBSTRATE, LIGHT-EMITTING DEVICE, AND METHODS FOR MANUFACTURING CERAMIC SINTERED COMPACT SUBSTRATE AND LIGHT-EMITTING DEVICE | Non-Final OA | NICHIA CORPORATION |
| 18310324 | SUBSTRATE HAVING ELECTRONIC COMPONENT MOUNTED IN A CAVITY OF A CORE USING A PLUGGING INK AND METHOD FOR MAKING THE SUBSTRATE | Final Rejection | QUALCOMM Incorporated |
| 18503138 | MANUFACTURING METHOD OF ELECTRONIC DEVICE AND ELECTRONIC DEVICE | Final Rejection | Innolux Corporation |
| 18580365 | CIRCUIT BOARD | Non-Final OA | LG INNOTEK CO., LTD. |
| 18675802 | INSULATED WIRE, COIL, ROTATING ELECTRICAL MACHINE, AND ELECTRICAL OR ELECTRONIC EQUIPMENT | Final Rejection | DENSO CORPORATION |
| 18776580 | WIRING BOARD AND MOUNTING STRUCTURE USING SAME | Final Rejection | KYOCERA Corporation |
| 18756756 | ELECTRONIC COMPONENT HOUSING PACKAGE AND ELECTRONIC MODULE | Non-Final OA | KYOCERA Corporation |
| 18592291 | PRINTED CIRCUIT BOARD | Non-Final OA | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18435160 | PRINTED CIRCUIT BOARD | Non-Final OA | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18212863 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME | Final Rejection | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18417844 | MULTI-LAMINATION STRUCTURE THAT ELIMINATES MICRO CAVITY RESONANCE | Non-Final OA | Cisco Technology, Inc. |
| 18458261 | SEMICONDUCTOR STORAGE DEVICE AND INFORMATION PROCESSING SYSTEM | Non-Final OA | Kioxia Corporation |
| 18765420 | CIRCUIT BOARD AND METHOD OF PRODUCING CIRCUIT BOARD | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18848010 | WIRE MOVABLE PATH REGULATING COMPONENT AND PATH REGULATING WIRE HARNESS | Non-Final OA | SUMITOMO WIRING SYSTEMS, LTD. |
| 18441261 | MULTI-MATERIAL THREE-DIMENSIONAL THERMAL CONDUCTIVE TRACES | Non-Final OA | MELLANOX TECHNOLOGIES, LTD. |
| 18727803 | BUS STRUCTURE SYSTEMS AND METHODS | Non-Final OA | Avery Dennison Retail Information Services LLC |
| 18320953 | CONDUCTIVE MODULE | Final Rejection | YAZAKI CORPORATION |
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