Tech Center 2800 • Art Units: 1723 2835 2847 2896
This examiner grants 66% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18640555 | PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18683615 | FLEXIBLE PRINTED CIRCUIT BOARD HAVING OVERCURRENT PROTECTION FUNCTION | Final Rejection | LG ENERGY SOLUTION, LTD. |
| 18710331 | METHODS AND APPARATUS FOR MANUFACTURING AN ELECTRONIC APPARATUS | Non-Final OA | CORNING INCORPORATED |
| 18740065 | MOUNTING BOARD | Non-Final OA | Panasonic Automotive Systems Co., Ltd. |
| 18675802 | INSULATED WIRE, COIL, ROTATING ELECTRICAL MACHINE, AND ELECTRICAL OR ELECTRONIC EQUIPMENT | Non-Final OA | DENSO CORPORATION |
| 18175149 | SEMICONDUCTOR APPARATUS | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18138050 | Through Package Vertical Interconnect and Method of Making Same | Final Rejection | Chipletz, Inc. |
| 17770334 | CIRCUIT BOARD AND DISPLAY MODULE | Non-Final OA | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| 18310324 | SUBSTRATE HAVING ELECTRONIC COMPONENT MOUNTED IN A CAVITY OF A CORE USING A PLUGGING INK AND METHOD FOR MAKING THE SUBSTRATE | Non-Final OA | QUALCOMM Incorporated |
| 18601196 | SIGNAL VIA OFFSET ARRANGEMENT FOR PRINTED CIRCUIT BOARD | Non-Final OA | Cisco Technology, Inc. |
| 18591294 | VIA ASSEMBLY FOR PRINTED CIRCUIT BOARD | Non-Final OA | Cisco Technology, Inc. |
| 18417844 | MULTI-LAMINATION STRUCTURE THAT ELIMINATES MICRO CAVITY RESONANCE | Final Rejection | Cisco Technology, Inc. |
| 18320953 | CONDUCTIVE MODULE | Non-Final OA | YAZAKI CORPORATION |
| 18435160 | PRINTED CIRCUIT BOARD | Final Rejection | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18232119 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME | Non-Final OA | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18741418 | COMMON MODE REDUCTION IN HIGH SPEED DIFFERENTIAL TRACES | Non-Final OA | DELL PRODUCTS L.P. |
| 18390351 | SLOT GROUND FOR IMPROVED SIGNAL INTEGRITY | Final Rejection | NVIDIA Corporation |
| 18197146 | BURIED SKIP VIAS FOR IMPROVED SIGNAL AND POWER INTEGRITY | Final Rejection | NVIDIA Corporation |
| 18433841 | IN-LINE CAPACITOR MODULE | Final Rejection | NOKIA SOLUTIONS AND NETWORKS OY |
| 18236889 | CAMERA MODULE PACKAGING STRUCTURE AND ELECTRONIC DEVICE HAVING THE SAME | Final Rejection | TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD. |
| 18677147 | POLE CAPS AND POLE PROTECTION SYSTEMS | Non-Final OA | Hexion Inc. |
| 18661198 | PRINTED WIRING BOARD | Non-Final OA | IBIDEN CO., LTD. |
| 18613202 | WIRING SUBSTRATE | Non-Final OA | IBIDEN CO., LTD. |
| 18324278 | WIRING SUBSTRATE | Non-Final OA | IBIDEN CO., LTD. |
| 18661747 | ACTIVE PANEL COVER AND LAMP WITH PANEL COVER | Non-Final OA | Guangzhou Jiguang Lighting Co., Ltd. |
| 18439530 | SYSTEMS AND METHODS FOR FORMING STUBLESS PLATED THROUGH HOLES HAVING WRAPPING STRUCTURES IN PRINTED CIRCUIT BOARDS | Non-Final OA | TTM TECHNOLOGIES INC. |
| 18684051 | FLAT FLEXIBLE PRINTED CIRCUIT | Final Rejection | Samkee Ev Co., Ltd. |
| 18279735 | DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD OF SAME | Final Rejection | Meiko Electronics Co., Ltd. |
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