13 pending office actions • 10 art units • 13 examiners • 0 of 13 (0%) have an AI response strategy ready • 21 patents granted in the last 365 days
Based on the USPTO statutory response window for each pending office action. 13 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 13 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §103 only | 12 (92%) |
| No statute on record | 1 (8%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| PATEL, DEVANG R | 1 | 65.1% | +39.3% |
| WANG, XIAOBEI | 1 | 64.9% | +48.4% |
| CHOWDHARY, NIMARTA KAUR | 1 | — | — |
| SUN, YU-HSI DAVID | 1 | 77.0% | +8.5% |
| SANDVIK, BENJAMIN P | 1 | 76.7% | +5.9% |
| STILES, JACOB BENJAMIN | 1 | — | — |
| VALENZUELA, PATRICIA D | 1 | 90.2% | +2.1% |
| SRINIVASAN, SESHA SAIRAMAN | 1 | 70.0% | +50.0% |
| TRAN, TIEN | 1 | 88.2% | +16.7% |
| KHAN, TAHSEEN | 1 | 61.4% | +22.1% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 2 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18484407 | SENSOR PACKAGE STRUCTURE | VALENZUELA, PATRICIA D | 28d |
| 18472256 | SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | TRAN, TIEN | 34d |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 5 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18432234 | ACTIVE METAL BRAZING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME | WANG, XIAOBEI | 2d overdue |
| 18449680 | COMPOSITE CERAMIC SUBSTRATE HAVING MULTI-LAYER CONFIGURATION | KHAN, TAHSEEN | 19d |
| 18472256 | SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | TRAN, TIEN | 34d |
| 18474201 | OPTICAL PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | SRINIVASAN, SESHA SAIRAMAN | 39d |
| 18657946 | METHOD FOR PRODUCING ACTIVE METAL CERAMIC SUBSTRATE | PATEL, DEVANG R | 61d |
| Art Unit | Apps |
|---|---|
| 2812 | 3 |
| 2817 | 2 |
| 1735 | 1 |
| 1784 | 1 |
| 2898 | 1 |
| 1733 | 1 |
| 1781 | 1 |
| 2813 | 1 |
| 2847 | 1 |
| 2818 | 1 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 18657946 | METHOD FOR PRODUCING ACTIVE METAL CERAMIC SUBSTRATE | PATEL, DEVANG R | 1735 | §103 | Non-Final OA | 61d | Pending | May 08, 2024 |
| 18432234 | ACTIVE METAL BRAZING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME | WANG, XIAOBEI | 1784 | §103 | Non-Final OA | 2d overdue | Pending | Feb 05, 2024 |
| 18526468 | IMAGE SENSING MODULE | CHOWDHARY, NIMARTA KAUR | 2898 | §103 | Non-Final OA | 23d overdue | Pending | Dec 01, 2023 |
| 18526100 | CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME | SUN, YU-HSI DAVID | 2817 | Other | Non-Final OA | 57d | Pending | Dec 01, 2023 |
| 18382572 | CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | SANDVIK, BENJAMIN P | 2812 | §103 | Non-Final OA | 14d | Pending | Oct 23, 2023 |
| 18379224 | ACTIVE METAL BRAZING SUBSTRATE MATERIAL CONTAINING ALUMINUM METAL ELEMENT AND METHOD FOR PRODUCING THE SAME | STILES, JACOB BENJAMIN | 1733 | §103 | Non-Final OA | 21d | Pending | Oct 12, 2023 |
| 18484407 | SENSOR PACKAGE STRUCTURE | VALENZUELA, PATRICIA D | 2812 | §103 | Non-Final OA | 28d | Pending | Oct 10, 2023 |
| 18474201 | OPTICAL PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | SRINIVASAN, SESHA SAIRAMAN | 2817 | §103 | Non-Final OA | 39d | Pending | Sep 25, 2023 |
| 18472256 | SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | TRAN, TIEN | 2812 | §103 | Non-Final OA | 34d | Pending | Sep 22, 2023 |
| 18449680 | COMPOSITE CERAMIC SUBSTRATE HAVING MULTI-LAYER CONFIGURATION | KHAN, TAHSEEN | 1781 | §103 | Non-Final OA | 19d | Pending | Aug 14, 2023 |
| 18206146 | SENSOR PACKAGE STRUCTURE | WEILAND, ADAM DAVID | 2813 | §103 | Non-Final OA | 65d | Pending | Jun 06, 2023 |
| 18314099 | CIRCUIT SUBSTRATE HAVING IMPROVED BONDING STRUCTURE | WILLIS, TREMESHA S | 2847 | §103 | Final Rejection | 72d overdue | Pending | May 08, 2023 |
| 17939981 | PACKAGE SUBSTRATE AND METHOD FOR FABRICATING CHIP ASSEMBLY | TURNER, BRIAN | 2818 | §103 | Non-Final OA | 65d | Pending | Sep 08, 2022 |
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