Prosecution Insights
Last updated: May 29, 2026

Tong Hsing Electronic Industries Ltd.

13 pending office actions • 10 art units • 13 examiners • 0 of 13 (0%) have an AI response strategy ready • 21 patents granted in the last 365 days

Portfolio Summary

13
Total Pending OAs
12
Non-Final OAs
1
Final Rejections
0
Advisory / Quayle

Response Deadline Pressure

Based on the USPTO statutory response window for each pending office action. 13 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.

3
Overdue
0
Due this week
4
Due this month
3
Due in next 60 days
3
Due later

Deadline Fire Line

Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 13 of the docket's apps have a known mailing date.

-30dToday30d60d90d120d
Overdue (3)Due ≤ 30 days (4)Due ≤ 60 days (3)Due later (3)

Case Difficulty Mix

Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.

0
Hard (0%)
12
Medium (92%)
0
Easy (0%)
1
Unknown (8%)

Rejection Statute Mix

BucketCases
§103 only12 (92%)
No statute on record1 (8%)

Industry Mix

How the docket's pending cases split across USPTO tech-center bands.

4
Life Sciences
31% of docket
0
Information Tech
0% of docket
0
Communications
0% of docket
9
Semiconductors
69% of docket
0
Mechanical / Eng
0% of docket
0
Business / Other
0% of docket

Time-on-OA Estimate

Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.

130 h
Manual time on pending OAs
26 h
Time saved (low, 20%)
46 h
Time saved (mid, 35%)
1.1 wks
FTE-weeks freed (mid)

Top Examiners on this docket

ExaminerApps on this docketAllow rateInterview lift
PATEL, DEVANG R 1 65.1% +39.3%
WANG, XIAOBEI 1 64.9% +48.4%
CHOWDHARY, NIMARTA KAUR 1
SUN, YU-HSI DAVID 1 77.0% +8.5%
SANDVIK, BENJAMIN P 1 76.7% +5.9%
STILES, JACOB BENJAMIN 1
VALENZUELA, PATRICIA D 1 90.2% +2.1%
SRINIVASAN, SESHA SAIRAMAN 1 70.0% +50.0%
TRAN, TIEN 1 88.2% +16.7%
KHAN, TAHSEEN 1 61.4% +22.1%

Quick Wins (2)

Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 2 ordered by deadline are shown.

App #TitleExaminerDue in
18484407 SENSOR PACKAGE STRUCTURE VALENZUELA, PATRICIA D 28d
18472256 SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF TRAN, TIEN 34d

Interview Candidates (5)

Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 5 ordered by deadline are shown.

App #TitleExaminerDue in
18432234 ACTIVE METAL BRAZING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME WANG, XIAOBEI 2d overdue
18449680 COMPOSITE CERAMIC SUBSTRATE HAVING MULTI-LAYER CONFIGURATION KHAN, TAHSEEN 19d
18472256 SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF TRAN, TIEN 34d
18474201 OPTICAL PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME SRINIVASAN, SESHA SAIRAMAN 39d
18657946 METHOD FOR PRODUCING ACTIVE METAL CERAMIC SUBSTRATE PATEL, DEVANG R 61d

Top Art Units

Art UnitApps
2812 3
2817 2
1735 1
1784 1
2898 1
1733 1
1781 1
2813 1
2847 1
2818 1

Pending Office Actions

App #TitleExaminerArt UnitStatutesStatusDue inAIFiled
18657946 METHOD FOR PRODUCING ACTIVE METAL CERAMIC SUBSTRATE PATEL, DEVANG R 1735 §103 Non-Final OA 61d Pending May 08, 2024
18432234 ACTIVE METAL BRAZING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME WANG, XIAOBEI 1784 §103 Non-Final OA 2d overdue Pending Feb 05, 2024
18526468 IMAGE SENSING MODULE CHOWDHARY, NIMARTA KAUR 2898 §103 Non-Final OA 23d overdue Pending Dec 01, 2023
18526100 CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME SUN, YU-HSI DAVID 2817 Other Non-Final OA 57d Pending Dec 01, 2023
18382572 CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF SANDVIK, BENJAMIN P 2812 §103 Non-Final OA 14d Pending Oct 23, 2023
18379224 ACTIVE METAL BRAZING SUBSTRATE MATERIAL CONTAINING ALUMINUM METAL ELEMENT AND METHOD FOR PRODUCING THE SAME STILES, JACOB BENJAMIN 1733 §103 Non-Final OA 21d Pending Oct 12, 2023
18484407 SENSOR PACKAGE STRUCTURE VALENZUELA, PATRICIA D 2812 §103 Non-Final OA 28d Pending Oct 10, 2023
18474201 OPTICAL PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME SRINIVASAN, SESHA SAIRAMAN 2817 §103 Non-Final OA 39d Pending Sep 25, 2023
18472256 SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF TRAN, TIEN 2812 §103 Non-Final OA 34d Pending Sep 22, 2023
18449680 COMPOSITE CERAMIC SUBSTRATE HAVING MULTI-LAYER CONFIGURATION KHAN, TAHSEEN 1781 §103 Non-Final OA 19d Pending Aug 14, 2023
18206146 SENSOR PACKAGE STRUCTURE WEILAND, ADAM DAVID 2813 §103 Non-Final OA 65d Pending Jun 06, 2023
18314099 CIRCUIT SUBSTRATE HAVING IMPROVED BONDING STRUCTURE WILLIS, TREMESHA S 2847 §103 Final Rejection 72d overdue Pending May 08, 2023
17939981 PACKAGE SUBSTRATE AND METHOD FOR FABRICATING CHIP ASSEMBLY TURNER, BRIAN 2818 §103 Non-Final OA 65d Pending Sep 08, 2022

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