Prosecution Insights
Prosecution Insights
Technology areas: Chemistry & Materials • Semiconductors, Circuits & Optics
19 pending office actions • 11 art units • 19 examiners • 0 of 19 (0%) have an AI response strategy ready • 29 patents granted in the last 365 days
Tong Hsing Electronic Industries Ltd. is currently navigating 19 pending office actions. These matters are situated in the Semiconductors, Circuits & Optics technology area. A notable feature of this portfolio is that it involves 19 distinct examiners, meaning each pending matter is being handled by a different person. This distribution of examiners for the pending actions suggests a very broad distribution of work across the patent office.
The pending workload is spread across 11 distinct art units. This involvement in 11 art units indicates that the company's semiconductor and optical innovations fall under many different examination specialties. PARTHASARATHY, ROHIT is listed as the busiest examiner, though they are responsible for 1 pending office action. Because no examiner handles more than 1 pending action, the workload is distributed. This lack of concentration may require the company to manage many different examiner styles simultaneously.
Based on the USPTO statutory response window for each pending office action. 8 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 8 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §103 only | 13 (68%) |
| Double-patenting only | 1 (5%) |
| Multi-statute (no §101) | 5 (26%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| PARTHASARATHY, ROHIT | 1 | 89.6% | +13.9% |
| PLESZCZYNSKA, JOANNA | 1 | 54.4% | +28.0% |
| BERRY, PAUL ANTHONY | 1 | 90.2% | -1.3% |
| LEE, EUGENE | 1 | 81.9% | +5.8% |
| PATEL, DEVANG R | 1 | 65.6% | +39.2% |
| ZHENG, LOIS L | 1 | 67.6% | +13.0% |
| CHIU, TSZ K | 1 | 79.3% | +11.0% |
| CHOWDHARY, NIMARTA KAUR | 1 | 100.0% | +0.0% |
| TRAN, DZUNG | 1 | 83.6% | +5.7% |
| STILES, JACOB BENJAMIN | 1 | 0.0% | +0.0% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 3 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18890105 | SENSOR PACKAGE STRUCTURE | PARTHASARATHY, ROHIT | — |
| 18666844 | POWER CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | LEE, EUGENE | — |
| 18517471 | BONDING STRUCTURE FOR CONNECTING A CHIP AND A METAL MATERIAL AND MANUFACTURING METHOD THEREOF | TRAN, DZUNG | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 6 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18526468 | IMAGE SENSING MODULE | CHOWDHARY, NIMARTA KAUR | 23d overdue |
| 18379224 | ACTIVE METAL BRAZING SUBSTRATE MATERIAL CONTAINING ALUMINUM METAL ELEMENT AND METHOD FOR PRODUCING THE SAME | STILES, JACOB BENJAMIN | 21d |
| 18472256 | SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | TRAN, TIEN | 34d |
| 18755319 | CERAMIC METAL COMPOSITE SUBSTRATE | PLESZCZYNSKA, JOANNA | — |
| 18675154 | POWER CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | BERRY, PAUL ANTHONY | — |
| 17896090 | SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | BENITEZ ROSARIO, JOSHUA | — |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 5 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18657946 | METHOD FOR PRODUCING ACTIVE METAL CERAMIC SUBSTRATE | PATEL, DEVANG R | 61d |
| 18890105 | SENSOR PACKAGE STRUCTURE | PARTHASARATHY, ROHIT | — |
| 18755319 | CERAMIC METAL COMPOSITE SUBSTRATE | PLESZCZYNSKA, JOANNA | — |
| 18432217 | METAL-CERAMIC SUBSTRATE HAVING DOUBLE BRAZING LAYERS AND METHOD FOR MANUFACTURING THE SAME | ZHENG, LOIS L | — |
| 18419517 | SEMICONDUCTOR PACKAGE STRUCTURE | CHIU, TSZ K | — |
| Art Unit | Apps |
|---|---|
| 2898 | 3 |
| 1733 | 2 |
| 2812 | 2 |
| 2813 | 2 |
| 1783 | 1 |
| 1735 | 1 |
| 2893 | 1 |
| 2817 | 1 |
| 3729 | 1 |
| 2818 | 1 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 18890105 | SENSOR PACKAGE STRUCTURE | PARTHASARATHY, ROHIT | — | §103 | Non-Final OA | — | Pending | Sep 19, 2024 |
| 18755319 | CERAMIC METAL COMPOSITE SUBSTRATE | PLESZCZYNSKA, JOANNA | 1783 | §103§112 | Non-Final OA | — | Pending | Jun 26, 2024 |
| 18675154 | POWER CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | BERRY, PAUL ANTHONY | — | §103§112 | Non-Final OA | — | Pending | May 28, 2024 |
| 18666844 | POWER CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | LEE, EUGENE | — | §103 | Non-Final OA | — | Pending | May 17, 2024 |
| 18657946 | METHOD FOR PRODUCING ACTIVE METAL CERAMIC SUBSTRATE | PATEL, DEVANG R | 1735 | §103 | Final Rejection | 61d | Pending | May 08, 2024 |
| 18432217 | METAL-CERAMIC SUBSTRATE HAVING DOUBLE BRAZING LAYERS AND METHOD FOR MANUFACTURING THE SAME | ZHENG, LOIS L | 1733 | DP | Non-Final OA | — | Pending | Feb 05, 2024 |
| 18419517 | SEMICONDUCTOR PACKAGE STRUCTURE | CHIU, TSZ K | 2898 | §103 | Final Rejection | — | Pending | Jan 22, 2024 |
| 18526468 | IMAGE SENSING MODULE | CHOWDHARY, NIMARTA KAUR | 2898 | §102§103 | Final Rejection | 23d overdue | Pending | Dec 01, 2023 |
| 18517471 | BONDING STRUCTURE FOR CONNECTING A CHIP AND A METAL MATERIAL AND MANUFACTURING METHOD THEREOF | TRAN, DZUNG | 2893 | §103 | Final Rejection | — | Pending | Nov 22, 2023 |
| 18379224 | ACTIVE METAL BRAZING SUBSTRATE MATERIAL CONTAINING ALUMINUM METAL ELEMENT AND METHOD FOR PRODUCING THE SAME | STILES, JACOB BENJAMIN | 1733 | §103 | Final Rejection | 21d | Pending | Oct 12, 2023 |
| 18484407 | SENSOR PACKAGE STRUCTURE | VALENZUELA, PATRICIA D | 2812 | §103 | Final Rejection | 28d | Pending | Oct 10, 2023 |
| 18474201 | OPTICAL PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | SRINIVASAN, SESHA SAIRAMAN | 2817 | §103 | Final Rejection | 39d | Pending | Sep 25, 2023 |
| 18472256 | SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | TRAN, TIEN | 2812 | §102§103§112 | Final Rejection | 34d | Pending | Sep 22, 2023 |
| 18210165 | CERAMIC METAL COMPOSITE SUBSTRATE | MCDONALD, JASON ANDREW | 2898 | §103 | Final Rejection | — | Pending | Jun 15, 2023 |
| 18206146 | SENSOR PACKAGE STRUCTURE | WEILAND, ADAM DAVID | 2813 | §103 | Final Rejection | 65d | Pending | Jun 06, 2023 |
| 18206153 | SENSOR PACKAGE STRUCTURE | CHAN, CANDICE | 2813 | §103 | Final Rejection | — | Pending | Jun 06, 2023 |
| 18323856 | CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF | EGOAVIL, GUILLERMO J | 3729 | §103 | Non-Final OA | — | Pending | May 25, 2023 |
| 17939981 | PACKAGE SUBSTRATE AND METHOD FOR FABRICATING CHIP ASSEMBLY | TURNER, BRIAN | 2818 | §103 | Final Rejection | 65d | Pending | Sep 08, 2022 |
| 17896090 | SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | BENITEZ ROSARIO, JOSHUA | 2815 | §102§103 | Final Rejection | — | Pending | Aug 26, 2022 |
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