Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2898
This examiner grants 57% of resolved cases
Jason Andrew McDonald is an examiner in Tech Center 2800 and Art Unit 2898. The data is based on 7 resolved cases, which is a small sample size. Within these cases, the allowance rate is 57.1%. This suggests a moderately favorable approach to applications, though the limited number of resolutions means this rate may fluctuate as more cases are completed. Applicants in Art Unit 2898 should view this 57.1% rate as a positive but preliminary indicator of the examiner's tendencies.
The interview lift is a very high 80.0%, indicating that in the few cases resolved, interviews were exceptionally effective at moving applications toward allowance. The median days to allowance is 1313, which is a standard duration for the prosecution cycle. This 1313-day figure indicates that cases reaching allowance do so in a predictable timeframe. For practitioners, the 80.0% interview lift is the most striking data point, even with only 7 resolved cases. It suggests that direct engagement is a primary strategy for overcoming rejections and improving the 57.1% baseline allowance rate. Early interviews may be particularly useful given the 1313-day median pendency in Tech Center 2800.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18634101 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18630470 | SEMICONDUCTOR PACKAGE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18437570 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18436267 | IMAGE SENSOR | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18239454 | DIE BONDING APPARATUS | Final Rejection | Samsung Electronics Co., Ltd. |
| 18361892 | ELECTRO-STATIC DISCHARGE PROTECTION DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18226606 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 17981761 | LIGHT-EMITTING DEVICE AND ELECTRONIC APPARATUS INCLUDING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18302240 | LIGHT-EMITTING COMPONENT, MULTILAYER SEMICONDUCTOR SUBSTRATE, AND MEASUREMENT APPARATUS | Final Rejection | FUJIFILM Business Innovation Corp. |
| 18458122 | INTERCONNECTION MEMBER AND METHOD OF MANUFACTURING THE SAME | Final Rejection | Toshiba Electronic Devices & Storage Corporation |
| 18460216 | Gallium Nitride Power Transistor | Non-Final OA | HUAWEI TECHNOLOGIES CO., LTD. |
| 18483857 | PHOTOELECTRIC CONVERSION APPARATUS, METHOD OF DRIVING THE APPARATUS, SEMICONDUCTOR SUBSTRATE, AND EQUIPMENT | Non-Final OA | CANON KABUSHIKI KAISHA |
| 18360651 | PHOTOELECTRIC CONVERSION APPARATUS AND EQUIPMENT | Final Rejection | CANON KABUSHIKI KAISHA |
| 18589093 | INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING STIFFENER STRUCTURE WITH INTEGRATED CAVITY(IES) TO ENCLOSE AN ELECTRICAL COMPONENT(S), AND RELATED FABRICATION METHODS | Non-Final OA | QUALCOMM Incorporated |
| 17972975 | INTEGRATED INDUCTOR OVER TRANSISTOR LAYER | Final Rejection | Intel Corporation |
| 17972923 | COPPER FILL FOR HEAT MANAGEMENT IN INTEGRATED CIRCUIT DEVICE | Final Rejection | Intel Corporation |
| 17710658 | CHASSIS CUSTOMIZATION WITH HIGH THROUGHPUT ADDITIVE MANUFACTURED MODIFICATION STRUCTURES | Final Rejection | Intel Corporation |
| 17999746 | MAGNETORESISTIVE EFFECT ELEMENT, SEMICONDUCTOR DEVICE, AND ELECTRONIC EQUIPMENT | Final Rejection | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18646016 | THREE-DIMENSIONAL MEMORY DEVICE WITH PILLAR SHAPED TRENCH BRIDGE STRUCTURES AND METHODS OF FORMING THE SAME | Non-Final OA | WESTERN DIGITAL TECHNOLOGIES, INC., |
| 18190234 | THREE-DIMENSIONAL METAL-INSULATOR-METAL CAPACITOR EMBEDDED IN SEAL STRUCTURE | Non-Final OA | International Business Machines Corporation |
| 18067710 | SELF-ALIGNED GATE METAL WITH TOP-DIELECTRIC ISOLATION | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 17974047 | TRANSISTORS WITH ASYMMETRIC SOURCE/DRAIN REGIONS | Non-Final OA | International Business Machines Corporation |
| 18049301 | VIRTUAL POWER SUPPLY THROUGH WAFER BACKSIDE | Final Rejection | International Business Machines Corporation |
| 17945275 | STRUCTURE HAVING ENHANCED GATE RESISTANCE | Non-Final OA | International Business Machines Corporation |
| 17932347 | VERTICAL NAND WITH BACKSIDE STACKING | Non-Final OA | International Business Machines Corporation |
| 17643594 | PILLAR MEMORY TOP CONTACT LANDING | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 17643434 | TOP VIA INTERCONNECT STRUCTURE WITH TEXTURE SUPPRESSION LAYERS | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 19111130 | METHOD FOR PRODUCING A SEMICONDUCTOR BODY, SEMICONDUCTOR BODY AND POWER SEMICONDUCTOR DEVICE | Final Rejection | Hitachi Energy Ltd |
| 18457948 | SEMICONDUCTOR DEVICE INCLUDING BACKSIDE TRANSISTORS | Final Rejection | SK hynix Inc. |
| 18458196 | SEMICONDUCTOR DEVICE | Final Rejection | Kioxia Corporation |
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