Tech Center 2800 • Art Units: 2898
This examiner grants 100% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18226606 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17862987 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18364578 | DRIVING CHIP ACCOMMODATING CIRCUIT BOARD AND DISPLAY DEVICE HAVING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18226027 | LIGHT EMITTING DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 18315617 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18082815 | ORGANIC PHOTODETECTOR AND ELECTRONIC APPARATUS INCLUDING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 17981761 | LIGHT-EMITTING DEVICE AND ELECTRONIC APPARATUS INCLUDING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18360651 | PHOTOELECTRIC CONVERSION APPARATUS AND EQUIPMENT | Non-Final OA | CANON KABUSHIKI KAISHA |
| 18460216 | Gallium Nitride Power Transistor | Non-Final OA | HUAWEI TECHNOLOGIES CO., LTD. |
| 18041839 | DISPLAY DEVICE, ELECTRONIC DEVICE, AND HEAD-MOUNTED DISPLAY | Final Rejection | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| 17932347 | VERTICAL NAND WITH BACKSIDE STACKING | Non-Final OA | International Business Machines Corporation |
| 17945275 | STRUCTURE HAVING ENHANCED GATE RESISTANCE | Non-Final OA | International Business Machines Corporation |
| 18455211 | REDUCED RESIDUE AT ETCHED STRUCTURE SIDEWALLS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17943354 | TECHNOLOGIES FOR GLASS CORE INDUCTOR | Non-Final OA | Intel Corporation |
| 17710658 | CHASSIS CUSTOMIZATION WITH HIGH THROUGHPUT ADDITIVE MANUFACTURED MODIFICATION STRUCTURES | Non-Final OA | Intel Corporation |
| 18458122 | INTERCONNECTION MEMBER AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 18458196 | SEMICONDUCTOR DEVICE | Non-Final OA | Kioxia Corporation |
| 17857887 | ELECTRONIC PACKAGE WITH A PLURALITY OF CARRIER STRUCTURES AND MANUFACTURING METHOD THEREOF | Non-Final OA | SILICONWARE PRECISION INDUSTRIES CO., LTD. |
| 18359697 | THREE-DIMENSIONAL MEMORY DEVICE WITH BACKSIDE WORD LINE CONTACT VIA STRUCTURES AND METHODS OF FORMING THE SAME | Non-Final OA | SANDISK TECHNOLOGIES LLC |
| 17852989 | METHOD FOR MANUFACTURING A SEMICONDUCTOR STRUCTURE HAVING AIR GAP | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18210165 | CERAMIC METAL COMPOSITE SUBSTRATE | Non-Final OA | TONG HSING ELECTRONIC INDUSTRIES, LTD. |
| 18340022 | Fusion bonding of diamond using thermal SiO2 | Non-Final OA | Phononics Ltd |
| 18010443 | LATERAL GAN TRANSISTOR WITH TRENCH GATE | Non-Final OA | Commissariat á I'Énergie Atomique et aux Énergies Alternatives |
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