Tech Center 2800 • Art Units: 2898
This examiner grants 67% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18630470 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18437570 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18436267 | IMAGE SENSOR | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18243185 | METHOD FOR MANUFACTURING MASK PATTERN AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE MASK PATTERN | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18361892 | ELECTRO-STATIC DISCHARGE PROTECTION DEVICE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18226606 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 17862987 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17999746 | MAGNETORESISTIVE EFFECT ELEMENT, SEMICONDUCTOR DEVICE, AND ELECTRONIC EQUIPMENT | Final Rejection | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18458122 | INTERCONNECTION MEMBER AND METHOD OF MANUFACTURING THE SAME | Final Rejection | Toshiba Electronic Devices & Storage Corporation |
| 18483857 | PHOTOELECTRIC CONVERSION APPARATUS, METHOD OF DRIVING THE APPARATUS, SEMICONDUCTOR SUBSTRATE, AND EQUIPMENT | Non-Final OA | CANON KABUSHIKI KAISHA |
| 18360651 | PHOTOELECTRIC CONVERSION APPARATUS AND EQUIPMENT | Final Rejection | CANON KABUSHIKI KAISHA |
| 18364578 | DRIVING CHIP ACCOMMODATING CIRCUIT BOARD AND DISPLAY DEVICE HAVING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18226027 | LIGHT EMITTING DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 18315617 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18082815 | ORGANIC PHOTODETECTOR AND ELECTRONIC APPARATUS INCLUDING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 17981761 | LIGHT-EMITTING DEVICE AND ELECTRONIC APPARATUS INCLUDING THE SAME | Final Rejection | Samsung Display Co., Ltd. |
| 18302240 | LIGHT-EMITTING COMPONENT, MULTILAYER SEMICONDUCTOR SUBSTRATE, AND MEASUREMENT APPARATUS | Final Rejection | FUJIFILM Business Innovation Corp. |
| 18589093 | INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING STIFFENER STRUCTURE WITH INTEGRATED CAVITY(IES) TO ENCLOSE AN ELECTRICAL COMPONENT(S), AND RELATED FABRICATION METHODS | Non-Final OA | QUALCOMM Incorporated |
| 17943354 | TECHNOLOGIES FOR GLASS CORE INDUCTOR | Non-Final OA | Intel Corporation |
| 17710658 | CHASSIS CUSTOMIZATION WITH HIGH THROUGHPUT ADDITIVE MANUFACTURED MODIFICATION STRUCTURES | Final Rejection | Intel Corporation |
| 17556750 | WRAP-AROUND CONTACTS FOR STACKED TRANSISTORS | Non-Final OA | Intel Corporation |
| 18519633 | SRAM HAVING CFET STACKS AND METHOD OF MANUFACTURING SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18483739 | MEMORY DEVICES WITH SWITCHABLE POWER DELIVERY PATHS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18483657 | FIELD EFFECT TRANSISTOR WITH ALIGNMENT MARK AND RELATED METHODS | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18458196 | SEMICONDUCTOR DEVICE | Final Rejection | Kioxia Corporation |
| 17864555 | RAM CMOS WITH IMPROVED RELIABILITY | Non-Final OA | Kioxia Corporation |
| 18459938 | THREE-DIMENSIONAL MEMORY DEVICE WITH PILLAR SHAPED TRENCH BRIDGE STRUCTURES AND METHODS OF FORMING THE SAME | Non-Final OA | WESTERN DIGITAL TECHNOLOGIES, INC., |
| 18463752 | THREE-DIMENSIONAL MEMORY DEVICE WITH BACKSIDE WORD LINE CONTACT VIA STRUCTURES AND METHODS OF FORMING THE SAME | Non-Final OA | SANDISK TECHNOLOGIES LLC |
| 18359697 | THREE-DIMENSIONAL MEMORY DEVICE WITH BACKSIDE WORD LINE CONTACT VIA STRUCTURES AND METHODS OF FORMING THE SAME | Final Rejection | SANDISK TECHNOLOGIES LLC |
| 18190234 | THREE-DIMENSIONAL METAL-INSULATOR-METAL CAPACITOR EMBEDDED IN SEAL STRUCTURE | Non-Final OA | International Business Machines Corporation |
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