Prosecution Insights
Prosecution Insights
7 pending office actions • 7 art units • 7 examiners • 0 of 7 (0%) have an AI response strategy ready • 8 patents granted in the last 365 days
Based on the USPTO statutory response window for each pending office action. 7 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 7 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §103 only | 7 (100%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| LEE, PETE T | 1 | 75.0% | +10.5% |
| SANDVIK, BENJAMIN P | 1 | 76.7% | +5.9% |
| PHAN, STEVE QUOC | 1 | — | — |
| SURVILLO, OLEG | 1 | 72.2% | +28.0% |
| CHEN, YU | 1 | 67.7% | +29.9% |
| STARK, JARRETT J | 1 | 70.3% | +11.2% |
| BAIG, ANEESA RIAZ | 1 | 94.1% | +7.4% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 1 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18206591 | BUMP OF CHIP PACKAGE WITH HIGHER BEARING CAPACITY IN WIRE BONDING | BAIG, ANEESA RIAZ | 61d |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 4 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18226782 | CHIP PACKAGE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING LAYER AND METHOD OF MANUFACTURING THE SAME | CHEN, YU | 25d overdue |
| 18207658 | CHIP PACKAGE | STARK, JARRETT J | 1d overdue |
| 18368065 | METHOD FOR HIGH-SECURITY NETWORK MESSAGE TRANSMISSION | SURVILLO, OLEG | 14d |
| 18419573 | EMBEDDED DUAL IN-LINE MEMORY MODULE | LEE, PETE T | 71d |
| Art Unit | Apps |
|---|---|
| 2824 | 1 |
| 2812 | 1 |
| 2817 | 1 |
| 2457 | 1 |
| 2896 | 1 |
| 2898 | 1 |
| 2814 | 1 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 18419573 | EMBEDDED DUAL IN-LINE MEMORY MODULE | LEE, PETE T | 2824 | §103 | Non-Final OA | 71d | Pending | Jan 23, 2024 |
| 18393633 | CHIP PACKAGE WITH HEAT DISSIPATION AND ELECTROMAGNETIC PROTECTION | SANDVIK, BENJAMIN P | 2812 | §103 | Non-Final OA | 34d | Pending | Dec 21, 2023 |
| 18368217 | ANTI-ELECTROMAGNETIC INTERFERENCE WAFER STRUCTURE | PHAN, STEVE QUOC | 2817 | §103 | Non-Final OA | 46d overdue | Pending | Sep 14, 2023 |
| 18368065 | METHOD FOR HIGH-SECURITY NETWORK MESSAGE TRANSMISSION | SURVILLO, OLEG | 2457 | §103 | Final Rejection | 14d | Pending | Sep 14, 2023 |
| 18226782 | CHIP PACKAGE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING LAYER AND METHOD OF MANUFACTURING THE SAME | CHEN, YU | 2896 | §103 | Non-Final OA | 25d overdue | Pending | Jul 27, 2023 |
| 18207658 | CHIP PACKAGE | STARK, JARRETT J | 2898 | §103 | Non-Final OA | 1d overdue | Pending | Jun 08, 2023 |
| 18206591 | BUMP OF CHIP PACKAGE WITH HIGHER BEARING CAPACITY IN WIRE BONDING | BAIG, ANEESA RIAZ | 2814 | §103 | Final Rejection | 61d | Pending | Jun 06, 2023 |
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