Prosecution Insights
Prosecution Insights
8 pending office actions • 7 art units • 8 examiners • 0 of 8 (0%) have an AI response strategy ready • 9 patents granted in the last 365 days
Based on the USPTO statutory response window for each pending office action. 5 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 5 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §103 only | 2 (25%) |
| Multi-statute (no §101) | 6 (75%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| MAHMUD, GOLAM | 1 | 60.5% | +29.0% |
| MANN, WILLIAM ROBERT | 1 | — | — |
| LEE, PETE T | 1 | 75.2% | +10.4% |
| GREEN, TELLY D | 1 | 81.9% | +3.9% |
| PHAN, STEVE QUOC | 1 | — | — |
| CHEN, YU | 1 | 68.0% | +29.7% |
| STARK, JARRETT J | 1 | 70.5% | +11.3% |
| BAIG, ANEESA RIAZ | 1 | 92.7% | +8.8% |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 6 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18226782 | CHIP PACKAGE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING LAYER AND METHOD OF MANUFACTURING THE SAME | CHEN, YU | 25d overdue |
| 18207658 | CHIP PACKAGE | STARK, JARRETT J | 1d overdue |
| 18206591 | BUMP OF CHIP PACKAGE WITH HIGHER BEARING CAPACITY IN WIRE BONDING | BAIG, ANEESA RIAZ | 61d |
| 18419573 | EMBEDDED DUAL IN-LINE MEMORY MODULE | LEE, PETE T | 71d |
| 18647133 | Metaverse Implementation Method | MAHMUD, GOLAM | — |
| 18504172 | CHIP PACKAGE WITH METAL SHIELDING LAYER AND METHOD OF MANUFACTURING THE SAME | GREEN, TELLY D | — |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 4 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18226782 | CHIP PACKAGE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING LAYER AND METHOD OF MANUFACTURING THE SAME | CHEN, YU | 25d overdue |
| 18207658 | CHIP PACKAGE | STARK, JARRETT J | 1d overdue |
| 18419573 | EMBEDDED DUAL IN-LINE MEMORY MODULE | LEE, PETE T | 71d |
| 18647133 | Metaverse Implementation Method | MAHMUD, GOLAM | — |
| Art Unit | Apps |
|---|---|
| 2898 | 2 |
| 2458 | 1 |
| 2897 | 1 |
| 2824 | 1 |
| 2817 | 1 |
| 2896 | 1 |
| 2814 | 1 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 18647133 | Metaverse Implementation Method | MAHMUD, GOLAM | 2458 | §103§112 | Non-Final OA | — | Pending | Apr 26, 2024 |
| 18419576 | CHIP PACKAGE UNIT WITH OUTER PROTECTIVE LAYER AND METHOD OF MANUFACTUIRNG THE SAME | MANN, WILLIAM ROBERT | 2897 | §103 | Non-Final OA | — | Pending | Jan 23, 2024 |
| 18419573 | EMBEDDED DUAL IN-LINE MEMORY MODULE | LEE, PETE T | 2824 | §102§103 | Non-Final OA | 71d | Pending | Jan 23, 2024 |
| 18504172 | CHIP PACKAGE WITH METAL SHIELDING LAYER AND METHOD OF MANUFACTURING THE SAME | GREEN, TELLY D | 2898 | §102§112 | Final Rejection | — | Pending | Nov 08, 2023 |
| 18368217 | ANTI-ELECTROMAGNETIC INTERFERENCE WAFER STRUCTURE | PHAN, STEVE QUOC | 2817 | §103 | Non-Final OA | 46d overdue | Pending | Sep 14, 2023 |
| 18226782 | CHIP PACKAGE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING LAYER AND METHOD OF MANUFACTURING THE SAME | CHEN, YU | 2896 | §102§103 | Final Rejection | 25d overdue | Pending | Jul 27, 2023 |
| 18207658 | CHIP PACKAGE | STARK, JARRETT J | 2898 | §102§103§112 | Non-Final OA | 1d overdue | Pending | Jun 08, 2023 |
| 18206591 | BUMP OF CHIP PACKAGE WITH HIGHER BEARING CAPACITY IN WIRE BONDING | BAIG, ANEESA RIAZ | 2814 | §103§112 | Non-Final OA | 61d | Pending | Jun 06, 2023 |
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