4 pending office actions
| App # | Title | Examiner | Art Unit | Status | Filed |
|---|---|---|---|---|---|
| 18368217 | ANTI-ELECTROMAGNETIC INTERFERENCE WAFER STRUCTURE | PHAN, STEVE QUOC | 2817 | Non-Final OA | Sep 14, 2023 |
| 18368065 | METHOD FOR HIGH-SECURITY NETWORK MESSAGE TRANSMISSION | SURVILLO, OLEG | 2457 | Final Rejection | Sep 14, 2023 |
| 18226782 | CHIP PACKAGE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING LAYER AND METHOD OF MANUFACTURING THE SAME | CHEN, YU | 2896 | Non-Final OA | Jul 27, 2023 |
| 18207658 | CHIP PACKAGE | STARK, JARRETT J | 2898 | Non-Final OA | Jun 08, 2023 |
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