Tech Center 2800 • Art Units: 2812 2898
This examiner grants 86% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 17975379 | DISPLAY PANEL AND DISPLAY DEVICE INCLUDING THE SAME | Non-Final OA | LG Display Co., Ltd. |
| 18479966 | DEPOSITION MASK, AND METHOD FOR PRODUCING ORGANIC LIGHT-EMITTING ELEMENT | Non-Final OA | CANON KABUSHIKI KAISHA |
| 18437551 | LIGHT EMITTING DEVICE AND DISPLAY DEVICE INCLUDING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18039202 | METHOD OF FORMING A THIN FILM | Final Rejection | Microsoft Technology Licensing, LLC |
| 18480254 | SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 18410645 | SYSTEM AND METHOD FOR ESTIMATING JUNCTION TEMPERATURE OF SEMICONDUCTOR POWER MODULE | Non-Final OA | Ford Global Technologies, LLC |
| 18642992 | Content Addressable Memory Cells | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18661935 | MICRO-ELECTROMECHANICAL SYSTEM DEVICE INCLUDING A PRECISION PROOF MASS ELEMENT AND METHODS FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18480260 | CANTILEVER-BASED OPTO-ELECTROMECHANICAL SYSTEMS AND FABRICATION METHODS | Non-Final OA | City University of Hong Kong |
| 18471777 | SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THEREOF | Final Rejection | Infineon Technologies AG |
| 18480195 | SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING A CAVITY IN A TRENCH | Final Rejection | Infineon Technologies Austria AG |
| 17977137 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE | Non-Final OA | STMicroelectronics S.r.l. |
| 18045181 | FORMING SOURCE/DRAIN REGION IN STACKED FET STRUCTURE | Final Rejection | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18581806 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18430890 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 17953336 | SEMICONDUCTOR STRUCTURE AND FABRICATING METHOD OF THE SAME | Final Rejection | UNITED MICROELECTRONICS CORP. |
| 18602261 | IMAGE SENSOR PACKAGES AND RELATED METHODS | Non-Final OA | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
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