Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2892
This examiner grants 84% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18297088 | MOLDED PACKAGE WITH AN INTERCHANGEABLE LEADFRAME | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18088543 | INTEGRATED CIRCUIT STRUCTURES HAVING BACKSIDE POWER DELIVERY AND SIGNAL ROUTING FOR FRONT SIDE DRAM | Non-Final OA | Intel Corporation |
| 17957637 | POROUS POLYMER DIELECTRIC LAYER ON CORE | Non-Final OA | Intel Corporation |
| 18231408 | SEMICONDUCTOR STRUCTURE | Non-Final OA | ETRON TECHNOLOGY, INC. |
| 18276907 | THROUGH VIA SUBSTRATE | Non-Final OA | DAI NIPPON PRINTING CO., LTD. |
| 18243080 | SEMICONDUCTOR DEVICE | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 18456071 | SEMICONDUCTOR DEVICE | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 18274056 | ELECTRONIC ELEMENT MOUNTING SUBSTRATE | Non-Final OA | KYOCERA Corporation |
| 18457816 | POWER SEMICONDUCTOR DEVICE | Non-Final OA | Samsung SDI Co., Ltd. |
| 18125689 | REMOVAL OF WIRES FROM PACKAGING SUBSTRATES | Final Rejection | SKYWORKS SOLUTIONS, INC. |
| 18126526 | EMBEDDED HEAT SLUG IN A SUBSTRATE | Non-Final OA | Qorvo US, Inc. |
| 18187804 | DIE-COAT MATERIAL CONFIGURED TO ENHANCE DEVICE RELIABILITY AND DEVICES AND PROCESSES IMPLEMENTING THE SAME | Non-Final OA | WOLFSPEED INC. |
| 18022978 | Al WIRING MATERIAL FOR SEMICONDCUTOR DEVICE | Final Rejection | NIPPON STEEL Chemical & Material Co., Ltd. |
| 18374149 | PACKAGING STRUCTURE AND PACKAGING METHOD | Non-Final OA | Semiconductor Manufacturing International (Shanghai) Corporation |
| 17945231 | FABRICATION OF EMBEDDED DIE PACKAGING COMPRISING LASER DRILLED VIAS | Non-Final OA | GaN Systems Inc. |
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