Tech Center 2800 • Art Units: 2800 2892
This examiner grants 84% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18604844 | INTEGRATED CIRCUIT DEVICES | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18583947 | FILM PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18584481 | STAGE APPARATUS, LITHOGRAPHY APPARATUS, AND ARTICLE MANUFACTURING METHOD | Non-Final OA | CANON KABUSHIKI KAISHA |
| 18297088 | MOLDED PACKAGE WITH AN INTERCHANGEABLE LEADFRAME | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18407342 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18462151 | INTERCONNECT STRUCTURE INCLUDING CONDUCTIVE FEATURE WITH LOW CONTACT RESISTIVITY | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
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