Prosecution Insights
Prosecution Insights
Tech Center 4100 • Art Units: 1713 1714 1718 1759 2893 3652 4100
This examiner grants 58% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18670957 | DEPOSITION APPARATUS AND METHOD OF DEPOSITING SUBSTRATE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18633117 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18541356 | SHOWERHEAD, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND SEMICONDUCTOR FABRICATION METHOD USING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18526132 | APPARATUS AND METHOD FOR MANUFACTURING DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 18133225 | EXPOSURE APPARATUS AND METHOD OF MANUFACTURING DISPLAY DEVICE USING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18235589 | SUBSTRATE SUPPORTING PLATE, APPARATUS INCLUDING THE SUBSTRATE SUPPORTING PLATE, AND METHOD OF USING SAME | Non-Final OA | ASM IP Holding B.V. |
| 18690502 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD | Non-Final OA | Hitachi High-Tech Corporation |
| 18620411 | GROUNDING PLATE FOR STRESS TUNING HIGH DENSITY AND MODULUS FILMS | Non-Final OA | Applied Materials, Inc. |
| 18597543 | SYSTEMS AND METHODS FOR HIGH-THROUGHPUT ANGLED ION PROCESSING | Non-Final OA | Applied Materials, Inc. |
| 18379915 | SHOWERHEAD DESIGN FOR PLASMA-ENHANCED DEPOSITION | Final Rejection | Applied Materials, Inc. |
| 18483965 | COMPACT DYNAMIC LEVELING LIFT MECHANISM | Non-Final OA | Applied Materials, Inc. |
| 18206443 | DIFFERENTIAL SUBSTRATE BACKSIDE COOLING | Non-Final OA | Applied Materials, Inc. |
| 18108407 | OVERLAPPING SUBSTRATE SUPPORTS AND PRE-HEAT RINGS, AND RELATED PROCESS KITS, PROCESSING CHAMBERS, METHODS, AND COMPONENTS | Final Rejection | Applied Materials, Inc. |
| 18083372 | FAST GAS SWITCHING | Non-Final OA | Applied Materials, Inc. |
| 18076234 | THERMAL CHOKE PLATE | Final Rejection | Applied Materials, Inc. |
| 17970451 | PLASMA PROCESSING CHAMBERS CONFIGURED FOR TUNABLE SUBSTRATE AND EDGE SHEATH CONTROL | Non-Final OA | Applied Materials, Inc. |
| 18751991 | ELECTROSTATIC CHUCK, FOCUS RING, SUPPORT BASE, PLASMA PROCESSING APPARATUS, AND PLASMA PROCESSING METHOD | Non-Final OA | Tokyo Electron Limited |
| 18748171 | SUBSTRATE PROCESSING APPARATUS, MIXING METHOD, AND SUBSTRATE PROCESSING METHOD | Final Rejection | Tokyo Electron Limited |
| 18454632 | HARD MASK DEPOSITION USING DIRECT CURRENT SUPERIMPOSED RADIO FREQUENCY PLASMA | Non-Final OA | Tokyo Electron Limited |
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