Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 1713 1714 1718 1759 2893
This examiner grants 58% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18670957 | DEPOSITION APPARATUS AND METHOD OF DEPOSITING SUBSTRATE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18377885 | GAS INLET TUBE ASSEMBLY FOR AN IMPROVED GAS MIXTURE IN A SUBSTRATE PROCESSING APPARATUS | Non-Final OA | ASM IP Holding B.V. |
| 17962009 | SYSTEMS AND METHODS FOR PURGING REACTOR LOWER CHAMBERS WITH ETCHANTS DURING FILM DEPOSITION | Non-Final OA | ASM IP Holding B.V. |
| 18653097 | FAST RESPONSE PEDESTAL ASSEMBLY FOR SELECTIVE PRECLEAN | Non-Final OA | Applied Materials, Inc. |
| 18379915 | SHOWERHEAD DESIGN FOR PLASMA-ENHANCED DEPOSITION | Non-Final OA | Applied Materials, Inc. |
| 18122484 | INJECTORS, LINERS, PROCESS KITS, PROCESSING CHAMBERS, AND RELATED METHODS FOR GAS FLOW IN BATCH PROCESSING OF SEMICONDUCTOR MANUFACTURING | Non-Final OA | Applied Materials, Inc. |
| 18108407 | OVERLAPPING SUBSTRATE SUPPORTS AND PRE-HEAT RINGS, AND RELATED PROCESS KITS, PROCESSING CHAMBERS, METHODS, AND COMPONENTS | Non-Final OA | Applied Materials, Inc. |
| 18076234 | THERMAL CHOKE PLATE | Non-Final OA | Applied Materials, Inc. |
| 17970451 | PLASMA PROCESSING CHAMBERS CONFIGURED FOR TUNABLE SUBSTRATE AND EDGE SHEATH CONTROL | Non-Final OA | Applied Materials, Inc. |
| 18454632 | HARD MASK DEPOSITION USING DIRECT CURRENT SUPERIMPOSED RADIO FREQUENCY PLASMA | Non-Final OA | Tokyo Electron Limited |
| 17889632 | PLASMA PROCESSING APPARATUS AND ETCHING METHOD | Final Rejection | Tokyo Electron Limited |
| 18279755 | PLASMA PROCESSING APPARATUS AND HEATING APPARATUS | Non-Final OA | Hitachi High-Tech Corporation |
| 18182862 | SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM | Non-Final OA | Kokusai Electric Corporation |
| 17903499 | SUBSTRATE PROCESSING APPARATUS, SUBSTRATE MOUNTING TABLE COVER, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER READABLE RECORDING MEDIUM | Final Rejection | Kokusai Electric Corporation |
| 18987741 | VACUUM TREATMENT APPARATUS AND VACUUM TREATMENT METHOD | Non-Final OA | ULVAC, INC. |
| 18767915 | RF POWER COMPENSATION TO REDUCE DEPOSITION OR ETCH RATE CHANGES IN RESPONSE TO SUBSTRATE BULK RESISTIVITY VARIATIONS | Non-Final OA | Lam Research Corporation |
| 18002289 | MULTI-STATION PROCESSING TOOLS WITH STATION-VARYING SUPPORT FEATURES FOR BACKSIDE PROCESSING | Non-Final OA | Lam Research Corporation |
| 17477055 | SiC EPITAXIAL GROWTH APPARATUS | Final Rejection | NuFlare Technology, Inc. |
| 18266176 | Method and Device for Producing a SiC Solid Material | Non-Final OA | Zadient Technologies SAS |
| 17953817 | SHOWERHEAD AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME | Non-Final OA | EUGENE TECHNOLOGY CO., LTD. |
| 17717679 | Rotating Disk Reactor with Split Substrate Carrier | Final Rejection | Veeco Instruments, Inc. |
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