Prosecution Insights
Prosecution Insights
Tech Center 1700 • Art Units: 1711 1712 1713 1716 1718 1792
This examiner grants 30% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18442991 | SUBSTRATE SUPPORT, THIN FILM PROCESSING DEVICE, AND THIN FILM DEPOSITION CONTROL METHOD USING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18406898 | SEMICONDUCTOR PROCESSING APPARATUS USING PLASMA | Final Rejection | Samsung Electronics Co., Ltd. |
| 17346347 | SYSTEMS AND METHODS FOR GRAFTING A MOLECULAR CODE ONTO A MATERIAL BY AN ATMOSPHERIC PLASMA TREATMENT | Final Rejection | Illinois Tool Works Inc. |
| 18644599 | ELECTROSTATIC CHUCK, ETCHING APPARATUS, AND METHOD OF MANUFACTURING DISPLAY DEVICE | Final Rejection | Samsung Display Co., LTD. |
| 18515267 | ELECTROSTATIC CHUCK, DEPOSITION APPARATUS INCLUDING THE SAME, AND DISPLAY PANEL FABRICATED USING THE SAME | Final Rejection | Samsung Display Co., LTD. |
| 18504026 | DEPOSITION APPARATUS | Final Rejection | Samsung Display Co., Ltd. |
| 18366820 | DEPOSITION SOURCE AND DEPOSITION APPARATUS INCLUDING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18113846 | PLASMA PROCESSING APPARATUS | Non-Final OA | Hitachi High-Tech Corporation |
| 18442808 | LOCAL PART MASKING FOR IMPROVED UNIFORMITY IN CERAMIC MATRIX COMPOSITES | Final Rejection | RTX Corporation |
| 18404542 | PLASMA-ASSISTED FILM REMOVAL FOR WAFER FABRICATION | Final Rejection | Micron Technology, Inc. |
| 17815318 | PLASMA ETCHER EDGE RING WITH A CHAMFER GEOMETRY AND IMPEDANCE DESIGN | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18672918 | INTEGRATED WET PASSIVATION ON CMP FOR HYBRID BONDING POST-CU PAD POLISH CAPPING | Non-Final OA | Applied Materials, Inc. |
| 18663463 | SELECTIVE PERIODIC EDGE DEPOSITION AND ETCH | Non-Final OA | Applied Materials, Inc. |
| 18627065 | PLASMA SHOWERHEAD ASSEMBLY | Non-Final OA | Applied Materials, Inc. |
| 18526788 | HARDWARE DESIGN WITH INDEPENDENT CONTROL TO IMPROVE WIW UNIFORMITY | Non-Final OA | Applied Materials, Inc. |
| 18484232 | CERAMIC RF RETURN KIT DESIGN | Final Rejection | Applied Materials, Inc. |
| 18198123 | SENSOR FOR MEASUREMENT OF RADICALS | Non-Final OA | Applied Materials, Inc. |
| 18094765 | CHAMBERS, METHODS, AND APPARATUS FOR GENERATING ATOMIC RADICALS USING UV LIGHT | Non-Final OA | Applied Materials, Inc. |
| 17046975 | EVAPORATION SOURCE FOR DEPOSITION OF EVAPORATED MATERIAL ON A SUBSTRATE, DEPOSITION APPARATUS, METHOD FOR MEASURING A VAPOR PRESSURE OF EVAPORATED MATERIAL, AND METHOD FOR DETERMINING AN EVAPORATION RATE OF AN EVAPORATED MATERIAL | Final Rejection | Applied Materials, Inc. |
| 18125137 | METAL MASK | Final Rejection | DARWIN PRECISIONS CORPORATION |
| 18456614 | PLASMA PROCESSING APPARATUS, PLASMA PROCESSING METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | Final Rejection | Kioxia Corporation |
| 18589744 | DISTRIBUTOR AND PLASMA PROCESSING APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 18353747 | PLASMA PROCESSING APPARATUS AND PLASMA STATE ESTIMATION METHOD | Final Rejection | TOKYO ELECTRON LIMITED |
| 18205426 | PLASMA PROCESSING APPARATUS, PLASMA PROCESSING METHOD, PRESSURE VALVE CONTROL DEVICE, PRESSURE VALVE CONTROL METHOD, AND PRESSURE REGULATION SYSTEM | Non-Final OA | Tokyo Electron Limited |
| 18159295 | SUBSTRATE PROCESSING APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 18156618 | PLASMA PROCESSING APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 16992550 | FILM FORMING APPARATUS AND FILM FORMING METHOD | Non-Final OA | Tokyo Electron Limited |
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