Prosecution Insights
Prosecution Insights
Tech Center 1700 • Art Units: 1711 1712 1713 1716 1718 1792
This examiner grants 30% of resolved cases
Keath T. Chen is an examiner in Tech Center 1700 and Art Unit 1711 with 1157 resolved cases. The allowance rate is 30.2%, which is quite low and indicates a difficult prosecution environment. The median days to allowance is 1356, reflecting a long path to success. This 1356-day timeline requires significant persistence from applicants. The 30.2% rate suggests that many applications face multiple rejections in Art Unit 1711.
The interview lift is 24.7%. This suggests that interviews are a meaningful way to improve the 30.2% allowance rate. In Tech Center 1700, the 1356-day median pendency is a significant factor for practitioners to manage. The 1157 resolved cases provide a very strong statistical basis for these trends. The 24.7% lift indicates that direct communication is a valuable tactic for overcoming hurdles.
Practitioners should prepare for a challenging process given the 30.2% allowance rate. The 24.7% interview lift is a key tool for overcoming rejections. The 1356-day median to allowance is the expected timeline for those who succeed. Overall, the 1157 cases show that persistence and direct engagement are necessary in Art Unit 1711.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18442548 | CHEMICAL LIQUID SUPPLY APPARATUS, AND SUBSTRATE TREATING APPARATUS HAVING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18442991 | SUBSTRATE SUPPORT, THIN FILM PROCESSING DEVICE, AND THIN FILM DEPOSITION CONTROL METHOD USING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18409082 | SUBSTRATE PROCESSING APPARATUS | Final Rejection | Samsung Electronics Co., Ltd. |
| 18696355 | EVAPORATION MASK, EVAPORATION DEVICE, AND EVAPORATION METHOD | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18933462 | DEPOSITION MASK AND DEPOSITION EQUIPMENT INCLUDING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18644599 | ELECTROSTATIC CHUCK, ETCHING APPARATUS, AND METHOD OF MANUFACTURING DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18515267 | ELECTROSTATIC CHUCK, DEPOSITION APPARATUS INCLUDING THE SAME, AND DISPLAY PANEL FABRICATED USING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18504026 | DEPOSITION APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 18366820 | DEPOSITION SOURCE AND DEPOSITION APPARATUS INCLUDING THE SAME | Final Rejection | Samsung Display Co., LTD. |
| 17346347 | SYSTEMS AND METHODS FOR GRAFTING A MOLECULAR CODE ONTO A MATERIAL BY AN ATMOSPHERIC PLASMA TREATMENT | Final Rejection | Illinois Tool Works Inc. |
| 18243173 | SYSTEM AND APPARATUS FOR A LIFT PIN | Non-Final OA | ASM IP Holding B.V. |
| 18442808 | LOCAL PART MASKING FOR IMPROVED UNIFORMITY IN CERAMIC MATRIX COMPOSITES | Final Rejection | RTX Corporation |
| 18113846 | PLASMA PROCESSING APPARATUS | Non-Final OA | Hitachi High-Tech Corporation |
| 18476808 | NOVEL COATING METHOD OF COMPLEX 3D STRUCTURES USING LOW PRESSURE CHEMICAL VAPOR DEPOSITION | Final Rejection | California Institute of Technology |
| 18456614 | PLASMA PROCESSING APPARATUS, PLASMA PROCESSING METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | Final Rejection | Kioxia Corporation |
| 18559485 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD | Non-Final OA | JUSUNG ENGINEERING CO., LTD. |
| 17792706 | SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD | Final Rejection | JUSUNG ENGINEERING CO., LTD. |
| 18493614 | DEPOSITING A CARBON HARDMASK BY HIGH POWER PULSED LOW FREQUENCY RF | Final Rejection | Lam Research Corporation |
| 18035200 | PEDESTAL INCLUDING SEAL | Final Rejection | LAM RESEARCH CORPORATION |
| 18250349 | LOCALIZED PLASMA ARC PREVENTION VIA PURGE RING | Non-Final OA | Lam Research Corporation |
| 17910139 | SUBSTRATE SUPPORTS INCLUDING BONDING LAYERS WITH STUD ARRAYS FOR SUBSTRATE PROCESSING SYSTEMS | Non-Final OA | LAM RESEARCH CORPORATION |
| 18404542 | PLASMA-ASSISTED FILM REMOVAL FOR WAFER FABRICATION | Non-Final OA | Micron Technology, Inc. |
| 17815318 | PLASMA ETCHER EDGE RING WITH A CHAMFER GEOMETRY AND IMPEDANCE DESIGN | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18672918 | INTEGRATED WET PASSIVATION ON CMP FOR HYBRID BONDING POST-CU PAD POLISH CAPPING | Non-Final OA | Applied Materials, Inc. |
| 18663463 | SELECTIVE PERIODIC EDGE DEPOSITION AND ETCH | Non-Final OA | Applied Materials, Inc. |
| 18627065 | PLASMA SHOWERHEAD ASSEMBLY | Final Rejection | Applied Materials, Inc. |
| 18603672 | SEMICONDUCTOR PROCESSING CHAMBER LID AND SEALING MECHANISM | Non-Final OA | Applied Materials, Inc. |
| 18526788 | HARDWARE DESIGN WITH INDEPENDENT CONTROL TO IMPROVE WIW UNIFORMITY | Final Rejection | Applied Materials, Inc. |
| 18523394 | SINGLE WAFER PROCESSING ENVIRONMENTS WITH SPATIAL SEPARATION | Non-Final OA | Applied Materials, Inc. |
| 18198123 | SENSOR FOR MEASUREMENT OF RADICALS | Non-Final OA | Applied Materials, Inc. |
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