Prosecution Insights
Last updated: August 17, 2026

Examiner: CHIN, EDWARD

Tech Center 3700 • Art Units: 2813 2815 2821 2893 3729

This examiner grants 87% of resolved cases

Performance Statistics

87.1%
Allow Rate
+17.1% vs TC avg
704
Total Applications
+6.8%
Interview Lift
888
Avg Prosecution Days
Based on 692 resolved cases, 2023–2026

Rejection Statute Breakdown

0.2%
§101 Eligibility
32.8%
§102 Novelty
58.8%
§103 Obviousness
7.2%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18664850 SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF Non-Final OA Samsung Electronics Co., Ltd.
18629799 SEMICONDUCTOR DEVICE Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18626787 SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME Non-Final OA Samsung Electronics Co., Ltd.
18711075 IMAGE SENSOR, CAMERA COMPACT MODULE, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING PACKAGING STRUCTURE OF IMAGE SENSOR Non-Final OA BOE TECHNOLOGY GROUP CO., LTD.
18388119 DISPLAY DEVICE Non-Final OA LG Display Co., Ltd.
18667362 DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE Non-Final OA Samsung Display Co., Ltd.
18666327 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE Non-Final OA SK hynix Inc.
18731206 INTEGRATED CIRCUIT LASER MARKING SYSTEM Non-Final OA Texas Instruments Incorporated
18623929 MEMORY DEVICE HAVING 2-TRANSISTOR VERTICAL MEMORY CELL AND SHIELD STRUCTURES Non-Final OA Micron Technology, Inc.
17949496 TWO ACCESS DEVICE, ONE STORAGE NODE CELL FOR VERTICAL THREE-DIMENSIONAL MEMORY Final Rejection Micron Technology, Inc.
18783967 METHOD AND APPARATUS FOR COATING PHOTORESIST OVER A SUBSTRATE Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
18435093 SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME Final Rejection TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
18667148 MICROWAVE PLASMA-ENHANCED DEPOSITION OF SILICON OXIDE Non-Final OA Applied Materials, Inc.
18707235 SUBSTRATE TREATMENT SYSTEM AND SUBSTRATE TREATMENT METHOD Non-Final OA Tokyo Electron Limited
18196144 PACKAGES WITH A SHORTEST DISTANCE BETWEEN PACKAGE CONNECTORS AND A SEATING PLANE OF AT LEAST 6 MILS Non-Final OA Microchip Technology Incorporated
18531765 SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME Non-Final OA CHANGXIN MEMORY TECHNOLOGIES, INC.

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