Tech Center 2800 • Art Units: 2826 2896 2899
This examiner grants 89% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18497039 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18497027 | VERTICAL MEMORY DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18210134 | SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18296500 | STACK SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18120866 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18577517 | SEMICONDUCTOR LIGHT-EMITTING ELEMENT, VEHICLE LAMP, AND METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT-EMITTING ELEMENT | Non-Final OA | KOITO MANUFACTURING CO., LTD. |
| 18391845 | STACKED TRANSISTOR STRUCTURES WITH ALIGNED CELL BOUNDARIES AND SHIFTED CHANNELS | Non-Final OA | International Business Machines Corporation |
| 18236925 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 18507726 | Semiconductor Package With Thermal Conductive Structure and the Methods of Forming the Same | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18222646 | STACKED CHIP SCALE SEMICONDUCTOR DEVICE | Non-Final OA | Sandisk Technologies, Inc. |
| 18522821 | Backside Illumination Global Shutter Image Sensor with Trench Storage Gate | Non-Final OA | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 18519032 | SEMICONDUCTOR PACKAGE | Non-Final OA | inergy Technology Inc. |
| 18497281 | Multi-Period Patterned Substrate | Non-Final OA | Sensor Electronic Technology, Inc. |
| 18287026 | ORORGANIC LIGHT-EMITTING ELEMENT FOR LIGHTING AND METHOD FOR MANUFACTURING SAME | Non-Final OA | LOTI CO., LTD. |
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