Tech Center 2800 • Art Units: 2826 2896 2899
This examiner grants 90% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18236925 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 18613005 | POWER MODULE | Non-Final OA | Kia Corporation |
| 18752968 | WAFER CENTER MONITOR | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18427207 | IC PACKAGE WITH INTERCONNECT | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18592741 | METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE DEVICE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18651117 | 3D DRAM Access Transistor | Non-Final OA | Applied Materials, Inc. |
| 18709780 | CONFORMAL, CARBON-DOPED SILICON NITRIDE FILMS AND METHODS THEREOF | Non-Final OA | Lam Research Corporation |
| 18582676 | MEMORY DEVICE | Non-Final OA | MACRONIX International Co., Ltd. |
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