Prosecution Insights
Last updated: April 19, 2026

Examiner: HOANG, TUAN A

Tech Center 2800 • Art Units: 2822 2896 2898

This examiner grants 73% of resolved cases

Performance Statistics

73.2%
Allow Rate
+5.2% vs TC avg
519
Total Applications
+11.9%
Interview Lift
1050
Avg Prosecution Days
Based on 497 resolved cases, 2023–2026

Rejection Statute Breakdown

0.1%
§101 Eligibility
22.3%
§102 Novelty
51.4%
§103 Obviousness
20.1%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18176430 Reducing Defects In a Polysilicon Overlaid Fin Structure Non-Final OA Texas Instruments Incorporated
18306678 FLOATING GATE BIOSENSOR Non-Final OA International Business Machines Corporation
18360656 PACKAGE WITH FAN-OUT STRUCTURES Non-Final OA TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
18352640 ETCH PROFILE CONTROL OF VIA OPENING Non-Final OA TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
18316146 P-DIPOLE MATERIAL FOR STACKED TRANSISTORS Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
18315232 N-DIPOLE MATERIAL FOR STACKED TRANSISTORS Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
18195351 SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME Non-Final OA TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
18188234 INTEGRATED CIRCUIT STRUCTURE AND MANUFACTURING METHOD THEREOF Non-Final OA TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
18167423 SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME Non-Final OA TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
18166932 SEMICONDUCTOR DEVICE STRUCTURE WITH ISOLATION LAYER AND METHOD FOR FORMING THE SAME Final Rejection Taiwan Semiconductor Manufacturing Company, Ltd.
17850778 INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE POWER STAPLE Non-Final OA Intel Corporation
18232171 Semiconductor Device With Isolation Structures Non-Final OA Taiwan Semiconductor Manufacturing Co., Ltd.
18329472 ETCH PROFILE CONTROL OF GATE CONTACT OPENING Non-Final OA TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
18297807 Interconnect Structures, Packaged Semiconductor Devices, and Methods of Packaging Semiconductor Devices Non-Final OA Taiwan Semiconductor Manufacturing Co., Ltd.
18188314 Crystallization of High-K Dielectric Layer Non-Final OA Taiwan Semiconductor Manufacturing Co., Ltd.
18198338 SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF Non-Final OA Semiconductor Manufacturing International (Beijing) Corporation

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