Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2835
This examiner grants 79% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18373449 | POWER MODULE AND METHOD OF MANUFACTURING SAME | Non-Final OA | HYUNDAI MOBIS CO., LTD. |
| 18650286 | COMPLIANT BOARD COMPONENT-LEVEL COLD PLATE | Non-Final OA | Dell Products L.P. |
| 17986568 | HEAT SINK FOR POWER ELECTRONICS DEVICES | Final Rejection | Carrier Corporation |
| 18630893 | MINI PC HAVING ACTIVE COOLING | Non-Final OA | Frore Systems Inc. |
| 18602604 | POWER ELECTRONICS MODULE WITH INTEGRATED HEAT SINK | Non-Final OA | Caterpillar Inc. |
| 18498499 | Thermal Interface for Electronic Control Unit | Non-Final OA | Aptiv Technologies AG |
| 18506151 | MOLDED ELECTRONIC ASSEMBLY | Non-Final OA | Industrial Technology Research Institute |
| 18367094 | DIRECT CONTACT HEAT TRANSFER COUPLINGS FOR PLUGGABLE NETWORK INTERFACE DEVICES | Non-Final OA | MELLANOX TECHNOLOGIES, LTD. |
| 18682670 | METAL-CERAMIC BONDED SUBSTRATE AND MANUFACTURING METHOD THEREOF | Non-Final OA | DOWA METALTECH CO., LTD. |
| 18641872 | COOLING SYSTEM AND COMMUNICATION APPARATUSES INCLUDING THE SYSTEM | Non-Final OA | Wistron Corporation |
| 18513650 | PACKAGE STRUCTURE | Non-Final OA | TMY Technology Inc. |
| 18417295 | Thermal Management Enhancement of Electronic Components | Non-Final OA | Wolfspeed, Inc. |
| 18628750 | UNIFORM TEMPERATURE PLATE AND ELECTRONIC EQUIPMENT EMPLOYING PLATE | Non-Final OA | Foxconn Technology Co., Ltd. |
| 18628057 | Load Shedding For Portable Generator | Non-Final OA | J. D. North America Corp. |
| 18440127 | INVERTER ASSEMBLY FOR ELECTRIC VEHICLES | Non-Final OA | Strelar, Inc. |
| 18246933 | SUBSTRATE FOR AN ELECTRONIC CHIP | Non-Final OA | Université de Chambéry - Université Savoie Mont Blanc |
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