Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2835 2841
This examiner grants 79% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18373449 | POWER MODULE AND METHOD OF MANUFACTURING SAME | Non-Final OA | HYUNDAI MOBIS CO., LTD. |
| 18792470 | POWER SUPPLY ASSEMBLY WITH FAN ASSEMBLY FOR ELECTRONIC DEVICE | Non-Final OA | Magic Leap, Inc. |
| 18758041 | HYBRID COOLING SYSTEM AND ELECTROMAGNETIC INTERFERENCE SHIELD | Non-Final OA | Intel Corporation |
| 18565880 | DIMM COOLING ASSEMBLIES | Final Rejection | Intel Corporation |
| 18689584 | Heat Sink Fixing Structure and Heat Dissipation Apparatus | Non-Final OA | ZTE Corporation |
| 18650286 | COMPLIANT BOARD COMPONENT-LEVEL COLD PLATE | Final Rejection | Dell Products L.P. |
| 18656195 | POWER-SUPPLY BOX FOR VEHICLE | Non-Final OA | Yazaki Corporation |
| 18641872 | COOLING SYSTEM AND COMMUNICATION APPARATUSES INCLUDING THE SYSTEM | Final Rejection | Wistron Corporation |
| 18788151 | POWER CONVERSION APPARATUS | Non-Final OA | FUJI ELECTRIC CO., LTD. |
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