Tech Center 2800 • Art Units: 2813 2896
This examiner grants 70% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18232894 | INTEGRATED CIRCUIT DEVICE INCLUDING INTERCONNECTION STRUCTURE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18556850 | ELECTROLUMINESCENT DEVICE AND DISPLAY APPARATUS | Non-Final OA | BOE Technology Group Co., Ltd. |
| 17914038 | IMAGING ELEMENT AND METHOD FOR MANUFACTURING IMAGING ELEMENT | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18054798 | SURFACE DEPASSIVATION WITH THERMAL ETCH AFTER NITROGEN RADICAL TREATMENT | Non-Final OA | Applied Materials, Inc. |
| 17479660 | SELF ALIGNED QUADRUPLE PATTERNING INTERCONNECTS | Final Rejection | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18265905 | SEMICONDUCTOR MODULE COMPRISING AT LEAST ONE SEMICONDUCTOR ELEMENT | Non-Final OA | Siemens Aktiengesellschaft |
| 18583194 | METAL ADHESION LAYER TO PROMOTE METAL PLUG ADHESION | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18490081 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18366096 | SEMICONDUCTOR STRUCTURE INCLUDING LINES OF DIFFERENT HEIGHT | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18358525 | INTERCONNECT STRUCTURE AND FABRICATION METHOD THEREOF | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18369860 | ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND DISPLAY PANEL | Non-Final OA | Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. |
| 18610778 | DISPLAY PANEL HAVING IMPROVED LIGHT-EMITTING STRUCTURE | Non-Final OA | Hefei Visionox Technology Co., Ltd. |
| 18459398 | MANAGING CONDUCTIVE CONNECTIONS FOR SEMICONDUCTIVE DEVICES | Non-Final OA | Yangtze Memory Technologies Co., Ltd. |
| 17930111 | IMAGE SENSOR PACKAGES AND RELATED METHODS | Final Rejection | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 18104341 | STRUCTURE WITH ISOLATED WELL | Non-Final OA | GlobalFoundries U.S. Inc. |
| 18203655 | Barrier Layers for Interconnects in Bonded Wafers | Final Rejection | UNITED MICROELECTRONICS CORP. |
| 18118093 | SEMICONDUCTOR PATTERN AND METHOD OF ROUNDING THE SAME | Final Rejection | UNITED MICROELECTRONICS CORP. |
| 18050010 | STACKED STRUCTURES WITH CAPACITIVE COUPLING CONNECTIONS | Non-Final OA | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. |
| 18332147 | CAVITY WITH BOTTOM HAVING DIELECTRIC LAYER PORTION OVER GATE BODY WITHOUT ETCH STOP LAYER AND RELATED METHOD | Final Rejection | GlobalFoundries Singapore Pte. Ltd. |
| 18514907 | EDRAM AND METHOD FOR MAKING SAME | Non-Final OA | Hangzhou HFC Semiconductor Co. |
| 18290010 | Organic Electroluminescent Device | Non-Final OA | GU AN YEOLIGHT TECHNOLOGY CO., LTD. |
| 18489844 | 3D MEMORY CELLS AND ARRAY STRUCTURES | Non-Final OA | NEO Semiconductor, Inc. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy