Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2813 2896
This examiner grants 71% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18370796 | DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 18470207 | COMPLEMENTARY FIELD EFFECT TRANSISTOR (CFET) CIRCUITS AND METHODS FOR MAKING THE SAME | Non-Final OA | QUALCOMM Incorporated |
| 18050010 | STACKED STRUCTURES WITH CAPACITIVE COUPLING CONNECTIONS | Final Rejection | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. |
| 18459398 | MANAGING CONDUCTIVE CONNECTIONS FOR SEMICONDUCTIVE DEVICES | Final Rejection | Yangtze Memory Technologies Co., Ltd. |
| 17957847 | GALVANIC ISOLATION DEVICE | Non-Final OA | Texas Instruments Incorporated |
| 18788979 | LOW-RESISTANCE COPPER INTERCONNECTS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18583194 | METAL ADHESION LAYER TO PROMOTE METAL PLUG ADHESION | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18358525 | INTERCONNECT STRUCTURE AND FABRICATION METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18790674 | SEMICONDUCTOR DEVICE WITH CONNECTING STRUCTURE HAVING A DOPED LAYER AND METHOD FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18775081 | SELECTIVE DEPOSITION OF LINER LAYER | Non-Final OA | Applied Materials, Inc. |
| 18115561 | SELECTIVE VIA-FILL WITH CONFORMAL SIDEWALL COVERAGE | Non-Final OA | Applied Materials, Inc. |
| 17980850 | METHODS TO FORM METAL LINERS FOR INTERCONNECTS | Final Rejection | Applied Materials, Inc. |
| 17930111 | IMAGE SENSOR PACKAGES AND RELATED METHODS | Final Rejection | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 17575815 | MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE | Non-Final OA | CHANGXIN MEMORY TECHNOLOGIES, INC. |
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