Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2813 2896
This examiner grants 71% of resolved cases
Daniel M. Luke is an examiner in Art Unit 2813 of Tech Center 2800. With 710 resolved cases, the examiner maintains an allowance rate of 71.4 percent. This rate suggests a strong probability of success for applicants, with more than seven out of ten cases resulting in a grant. Practitioners can use the 71.4 percent figure to benchmark the likelihood of securing a patent in this unit.
The interview lift is 18.6 percent. This data point shows that interviews are an effective tool for moving cases toward an allowance, providing a meaningful boost to the success rate. Practitioners should leverage the 18.6 percent lift to resolve outstanding issues and improve the chances of a grant, as verbal engagement appears to be a productive supplement to written responses.
The median days to allowance is 1022. This timeline provides a clear expectation for the duration of the prosecution cycle, lasting nearly three years. The combination of a 71.4 percent allowance rate and a 1022-day median suggests a reliable and efficient path to allowance. These metrics allow for effective planning and help in managing client expectations regarding the timing of a patent grant.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18519211 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18490063 | CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18613430 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 18370796 | DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 18050010 | STACKED STRUCTURES WITH CAPACITIVE COUPLING CONNECTIONS | Final Rejection | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. |
| 18459398 | MANAGING CONDUCTIVE CONNECTIONS FOR SEMICONDUCTIVE DEVICES | Final Rejection | Yangtze Memory Technologies Co., Ltd. |
| 18592052 | SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE, AND METHOD OF OPERATING THE SEMICONDUCTOR DEVICE | Non-Final OA | SK hynix Inc. |
| 18827181 | BOND PAD WITH MICRO-PROTRUSIONS FOR DIRECT METALLIC BONDING | Non-Final OA | Micron Technology, Inc. |
| 18788979 | LOW-RESISTANCE COPPER INTERCONNECTS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18490081 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18358525 | INTERCONNECT STRUCTURE AND FABRICATION METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18790674 | SEMICONDUCTOR DEVICE WITH CONNECTING STRUCTURE HAVING A DOPED LAYER AND METHOD FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18115561 | SELECTIVE VIA-FILL WITH CONFORMAL SIDEWALL COVERAGE | Non-Final OA | Applied Materials, Inc. |
| 18647287 | SEMICONDUCTOR DEVICE AND POWER CONVERTER | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 17930111 | IMAGE SENSOR PACKAGES AND RELATED METHODS | Final Rejection | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 18767087 | LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SEOUL VIOSYS CO., LTD. |
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