Prosecution Insights
Last updated: August 17, 2026

Examiner: MILLER, JAMI VALENTINE

Tech Center 2800 • Art Units: 2811 2815 2818 2894

This examiner grants 95% of resolved cases

Performance Statistics

94.9%
Allow Rate
+26.9% vs TC avg
1,106
Total Applications
+3.9%
Interview Lift
724
Avg Prosecution Days
Based on 1092 resolved cases, 2023–2026

Rejection Statute Breakdown

0.5%
§101 Eligibility
41.7%
§102 Novelty
31.0%
§103 Obviousness
25.2%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18792665 SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE INCLUDING THE SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE Non-Final OA Samsung Electronics Co., Ltd.
18623666 SEMICONDUCTOR PACKAGE AND PACKAGE MODULE INCLUDING THE SAME Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18583006 SEMICONDUCTOR DEVICE Final Rejection Samsung Electronics Co., Ltd.
18433075 SEMICONDUCTOR PACKAGE Non-Final OA SAMSUNG ELECTRONICS CO, LTD.
18179646 TEMPLATING LAYERS FOR SPIN ORBIT TORQUE ASSISTED SWITCHING OF PERPENDICULARLY MAGNETIZED HEUSLER FILMS Non-Final OA Samsung Electronics Co., Ltd.
18613234 LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING SAME Non-Final OA NICHIA CORPORATION
18613363 DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME Non-Final OA Samsung Display Co., Ltd.
18092152 TRANSISTOR WITH CHANNEL MATERIAL IN A STACK WITH INSULATOR MATERIAL SUPPORTS Non-Final OA Intel Corporation
18089494 DIRECT ELECTROPLATING ON MODIFIED POLYMER-GRAPHENE COMPOSITES Non-Final OA INTEL CORPORATION
18637391 SEMICONDUCTOR DEVICE AND POWER CONVERSION APPARATUS Non-Final OA Mitsubishi Electric Corporation
18695493 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Non-Final OA Mitsubishi Electric Corporation
18770004 SEMICONDUCTOR PACKAGE HAVING CHIP STACK STRUCTURE Non-Final OA SK hynix Inc.
18737817 MICROELECTRONIC DEVICES INCLUDING RECESSES IN AN ENCAPSULANT MATERIAL AND ASSOCIATED SYSTEMS AND METHODS Non-Final OA Micron Technology, Inc.
18422479 MEMORY DEVICE WITH FLAT-TOP BOTTOM ELECTRODES AND METHODS FOR FORMING THE SAME Final Rejection Taiwan Semiconductor Manufacturing Company Limited
18583082 BACK END OF THE LINE WIRING BETWEEN DEVICE LAYERS Non-Final OA INTERNATIONAL BUSINESS MACHINES CORPORATION

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