Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2811 2815 2818 2894
This examiner grants 95% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18792665 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE INCLUDING THE SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18623666 | SEMICONDUCTOR PACKAGE AND PACKAGE MODULE INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18583006 | SEMICONDUCTOR DEVICE | Final Rejection | Samsung Electronics Co., Ltd. |
| 18433075 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO, LTD. |
| 18179646 | TEMPLATING LAYERS FOR SPIN ORBIT TORQUE ASSISTED SWITCHING OF PERPENDICULARLY MAGNETIZED HEUSLER FILMS | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18613234 | LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING SAME | Non-Final OA | NICHIA CORPORATION |
| 18613363 | DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18092152 | TRANSISTOR WITH CHANNEL MATERIAL IN A STACK WITH INSULATOR MATERIAL SUPPORTS | Non-Final OA | Intel Corporation |
| 18089494 | DIRECT ELECTROPLATING ON MODIFIED POLYMER-GRAPHENE COMPOSITES | Non-Final OA | INTEL CORPORATION |
| 18637391 | SEMICONDUCTOR DEVICE AND POWER CONVERSION APPARATUS | Non-Final OA | Mitsubishi Electric Corporation |
| 18695493 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 18770004 | SEMICONDUCTOR PACKAGE HAVING CHIP STACK STRUCTURE | Non-Final OA | SK hynix Inc. |
| 18737817 | MICROELECTRONIC DEVICES INCLUDING RECESSES IN AN ENCAPSULANT MATERIAL AND ASSOCIATED SYSTEMS AND METHODS | Non-Final OA | Micron Technology, Inc. |
| 18422479 | MEMORY DEVICE WITH FLAT-TOP BOTTOM ELECTRODES AND METHODS FOR FORMING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company Limited |
| 18680075 | MANUFACTURING METHOD OF A HEAT DISSIPATION SUBSTRATE FOR A POWER SEMICONDUCTOR MODULE AND A MANUFACTURING METHOD OF A POWER SEMICONDUCTOR MODULE INCLUDING THE SAME | Non-Final OA | LX SEMICON CO., LTD. |
| 18583082 | BACK END OF THE LINE WIRING BETWEEN DEVICE LAYERS | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18624080 | LIGHT EMITTING DIODE AND LIGHT EMITTING DEVICE | Non-Final OA | Tianjin Sanan Optoelectronics Co., Ltd. |
| 18790871 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | Non-Final OA | SILICONWARE PRECISION INDUSTRIES CO., LTD. |
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