Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812 2815 2819 2829
This examiner grants 87% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18755008 | STACKED INTEGRATED CIRCUIT DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18631231 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18494183 | SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18381905 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18262404 | LIGHT-EMITTING SUBSTRATE, DISPLAY APPARATUS AND TILED DISPLAY APPARATUS | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 17558545 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | LG DISPLAY CO., LTD. |
| 17558547 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | LG DISPLAY CO., LTD. |
| 18364551 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Samsung Display Co., LTD. |
| 18383109 | SUBSTRATE PROCESSING METHOD | Final Rejection | ASM IP Holding B.V. |
| 18618163 | DISPLAY PANEL | Non-Final OA | Electronics and Telecommunications Research Institute |
| 18649388 | MEMORY CHIP AND MANUFACTURING METHOD OF THE MEMORY CHIP | Non-Final OA | SK hynix Inc. |
| 18320930 | SOLID-STATE TRANSDUCER ASSEMBLIES WITH REMOTE CONVERTER MATERIAL FOR IMPROVED LIGHT EXTRACTION EFFICIENCY AND ASSOCIATED SYSTEMS AND METHODS | Final Rejection | Micron Technology, Inc. |
| 18750097 | ELECTROSTATIC DISCHARGE CIRCUIT AND METHOD OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18627561 | PACKAGE ASSEMBLY WITH BACK PLATE COMPRESSION | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18741756 | ANTENNA DEVICE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
| 18305852 | HIGH-DENSITY MICRO-LED ARRAYS WITH REFLECTIVE SIDEWALLS | Final Rejection | Applied Materials, Inc. |
| 18603584 | ETCHING METHOD, PLASMA PROCESSING APPARATUS, AND SUBSTRATE PROCESSING SYSTEM | Non-Final OA | Tokyo Electron Limited |
| 18679667 | FORKSHEET STRUCTURE WITH FLEXIBLE CELL HEIGHT AND FLEXIBLE CHANNEL CONFIGURATION | Non-Final OA | International Business Machines Corporation |
| 18755366 | SEMICONDUCTOR DEVICE PACKAGE WITH CLIP INTERCONNECT AND DUAL SIDE COOLING | Non-Final OA | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 18380131 | METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE CAP | Non-Final OA | InvenSense, Inc. |
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