Tech Center 2800 • Art Units: 2812
This examiner grants 95% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18739690 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18738701 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18677106 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18453682 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME | Final Rejection | Toshiba Electronic Devices & Storage Corporation |
| 18137731 | BACKSIDE CONDUCTIVE STRUCTURES EXTENDING THROUGH INTEGRATED CIRCUIT TO MEET FRONTSIDE CONTACTS | Non-Final OA | Intel Corporation |
| 18755626 | BACKSIDE SUBSTRATE DIELECTRIC BREAK | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18237174 | SEMICONDUCTOR DEVICE CIRCUITRY FORMED THROUGH VOLUMETRIC EXPANSION | Final Rejection | Micron Technology, Inc. |
| 19286970 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18673792 | SEMICONDUCTOR ISOLATION STRUCTURE FOR INJECTION SUPPRESSION AND METHOD OF MAKING THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18239999 | SEMICONDUCTOR DEVICE HAVING NANOSHEET TRANSISTOR AND METHODS OF FABRICATION THEREOF | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18469351 | SEMICONDUCTOR DEVICE | Final Rejection | ROHM CO., LTD. |
| 18680085 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | Non-Final OA | MIRISE Technologies Corporation |
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