Prosecution Insights
Last updated: April 19, 2026

Examiner: RAMIREZ, ALEXANDRE XAVIER

Tech Center 2800 • Art Units: 2812

This examiner grants 100% of resolved cases

Performance Statistics

100.0%
Allow Rate
+32.0% vs TC avg
50
Total Applications
+0.0%
Interview Lift
1282
Avg Prosecution Days
Based on 18 resolved cases, 2023–2026

Rejection Statute Breakdown

0%
§101 Eligibility
27.8%
§102 Novelty
51.1%
§103 Obviousness
15.4%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18141313 BACKSIDE CONTACT FORMATION USING PILLAR PATTERNING Final Rejection Samsung Electronics Co., Ltd.
18117864 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING SURFACE TREATMENT PROCESS Final Rejection SAMSUNG ELECTRONICS CO., LTD
18469355 HIGH-SYMMETRICAL SEMICONDUCTOR ARRANGEMENT Non-Final OA HUAWEI TECHNOLOGIES CO., LTD.
18239999 SEMICONDUCTOR DEVICE HAVING NANOSHEET TRANSISTOR AND METHODS OF FABRICATION THEREOF Non-Final OA TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
18351761 HIGH ELECTRON MOBILITY TRANSISTOR WITH HELPING GATE Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
17818377 MEMORY DEVICE WITH BACKSIDE INTERCONNECTION FOR POWER RAIL AND BITLINE AND METHOD OF FORMING THE SAME Final Rejection TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
18361550 THREE-DIMENSIONAL MEMORY DEVICE CONTAINING PERIPHERAL CIRCUIT WITH FIN AND PLANAR FIELD EFFECT TRANSISTORS AND METHOD OF MAKING THEREOF Non-Final OA WESTERN DIGITAL TECHNOLOGIES, INC.,
18349560 THREE-DIMENSIONAL MEMORY DEVICE HAVING CONTROLLED LATERAL ISOLATION TRENCH DEPTH AND METHODS OF FORMING THE SAME Non-Final OA WESTERN DIGITAL TECHNOLOGIES, INC.,
17833050 3D SOURCE AND DRAIN CONTACTS TUNED FOR VERTICALLY STACKED PMOS AND NMOS Final Rejection Intel Corporation
17556737 NON-REACTIVE EPI CONTACT FOR STACKED TRANSISTORS Final Rejection Intel Corporation
18166094 SENSOR Non-Final OA KABUSHIKI KAISHA TOSHIBA
18237174 SEMICONDUCTOR DEVICE CIRCUITRY FORMED THROUGH VOLUMETRIC EXPANSION Non-Final OA Micron Technology, Inc.
18234145 SHALLOW TRENCH ISOLATION RECESS CONTROL Non-Final OA Micron Technology, Inc.
17950418 METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM Final Rejection KOKUSAI ELECTRIC CORPORATION
18205288 Power Diode Device and Method of Manufacturing the Same Non-Final OA Diodes Incorporated
18359664 METHOD OF MAKING HIGH ASPECT RATIO OPENINGS USING MULTIPLE CLADDING MASKS AND APPARATUS FOR IMPLEMENTING THE SAME Non-Final OA SANDISK TECHNOLOGIES LLC

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