Tech Center 2800 • Art Units: 2812
This examiner grants 95% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18739690 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18738701 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18236024 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17964677 | 3D-STACKED SEMICONDUCTOR DEVICE INCLUDING GATE STRUCTURE FORMED OF POLYCRYSTALLINE SILICON OR POLYCRYSTALLINE SILICON INCLUDING DOPANTS | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18693532 | LIGHT-EMITTING DEVICE AND DISPLAY PANEL | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18453682 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME | Final Rejection | Toshiba Electronic Devices & Storage Corporation |
| 18389613 | STACKED MICROELECTRONIC PACKAGE WITH STACK MOUNTED COMPONENTS AND RELATED METHODS, DEVICES, AND SYSTEMS | Non-Final OA | Micron Technology, Inc. |
| 18237174 | SEMICONDUCTOR DEVICE CIRCUITRY FORMED THROUGH VOLUMETRIC EXPANSION | Final Rejection | Micron Technology, Inc. |
| 18234145 | SHALLOW TRENCH ISOLATION RECESS CONTROL | Non-Final OA | Micron Technology, Inc. |
| 18396150 | THREE-DIMENSIONAL MEMORY DEVICE CONTAINING PERIPHERAL CIRCUIT WITH FIN FIELD EFFECT TRANSISTORS AND METHOD OF MAKING THE SAME | Non-Final OA | WESTERN DIGITAL TECHNOLOGIES, INC., |
| 18349560 | THREE-DIMENSIONAL MEMORY DEVICE HAVING CONTROLLED LATERAL ISOLATION TRENCH DEPTH AND METHODS OF FORMING THE SAME | Final Rejection | WESTERN DIGITAL TECHNOLOGIES, INC., |
| 18533747 | CONTACT EXTENSION FOR ADDITIONAL WIRING PATHS | Non-Final OA | International Business Machines Corporation |
| 18490777 | SEMICONDUCTOR DEVICE HAVING CAPACITOR ARRAY AND METHOD OF FORMING THE SAME | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
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