Tech Center 2800 • Art Units: 2815 2897
This examiner grants 81% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18782661 | SEMICONDUCTOR DEVICE INCLUDING GATE-CUT STRUCTURE FORMED AT EARLY STEP OF MANUFACTURING PROCESS | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18640576 | SEMICONDUCTOR PACKAGE COMPRISING DAM AND MULTI-LAYERED UNDER-FILL LAYER | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18544560 | INTEGRATED CIRCUIT DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18236664 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18658369 | METHOD FOR TRANSFERRING LIGHT-EMITTING ELEMENT AND METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE | Non-Final OA | NICHIA CORPORATION |
| 18144613 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18181598 | FABRICATION OF NANORIBBON-BASED TRANSISTORS USING PATTERNED FOUNDATION | Non-Final OA | Intel Corporation |
| 18307082 | SEMICONDUCTOR DEVICE WITH RIGID-FLEX SUB-ASSEMBLY AND METHOD THEREFOR | Final Rejection | NXP USA, INC. |
| 18127020 | STAGE APPARATUS, CHARGED PARTICLE BEAM APPARATUS, AND OPTICAL INSPECTION APPARATUS | Final Rejection | Hitachi High-Tech Corporation |
| 18478226 | SEMICONDUCTOR PACKAGE WITH AN INSULATION LAYER | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18409915 | METHODS FOR SELECTIVE METAL CAP FORMATION | Non-Final OA | Taiwan Semiconductor Manufacturing Company, LTD. |
| 18409839 | SEMICONDUCTOR STRUCTURE INCLUDING MEMORY UNIT AND MANUFACTURING METHOD THEREOF | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 18362649 | System Formed Through Package-In-Package Formation | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18058245 | APPARATUS AND METHOD FOR REPAIRING DEFECT OF SEMICONDUCTOR | Final Rejection | Tokyo Electron Limited |
| 18697972 | WAVELENGTH CONVERSION SHEET-USE FILM, WAVELENGTH CONVERSION SHEET, BACKLIGHT, AND DISPLAY DEVICE | Non-Final OA | DAI NIPPON PRINTING CO., LTD. |
| 18630689 | HIGH REFRACTIVE INDEX STRUCTURED COATING FOR EFFICIENT LIGHT EXTRACTION FROM LEDS AND PCLEDS | Non-Final OA | Lumileds LLC |
| 18624320 | HEAT SINK FASTENED ON THE SUBSTRATE OF A PACKAGE OF INTEGRATED CIRCUITS | Final Rejection | STMicroelectronics International N.V. |
| 18543468 | LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | TIANJIN SANAN OPTOELECTRONICS CO., LTD. |
| 18392194 | Nonlinear Gate Vertical Transistor | Non-Final OA | NEXPERIA B.V. |
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