Prosecution Insights
Last updated: April 19, 2026

Examiner: SHAMSUZZAMAN, MOHAMMED

Tech Center 2800 • Art Units: 2815 2897

This examiner grants 81% of resolved cases

Performance Statistics

80.7%
Allow Rate
+12.7% vs TC avg
920
Total Applications
+56.6%
Interview Lift
945
Avg Prosecution Days
Based on 892 resolved cases, 2023–2026

Rejection Statute Breakdown

1.7%
§101 Eligibility
6.6%
§102 Novelty
50.0%
§103 Obviousness
33.4%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18530222 ELECTRONIC DEVICE AND DISPLAY PANEL Non-Final OA Samsung Display Co., Ltd.
18409322 PLANARIZATION PROCESS, PLANARIZATION SYSTEM AND METHOD OF MANUFACTURING AN ARTICLE Non-Final OA CANON KABUSHIKI KAISHA
17758579 METHOD OF MANUFACTURING PHOTOELECTRIC CONVERSION DEVICE, AND PHOTOELECTRIC CONVERSION DEVICE Final Rejection SONY SEMICONDUCTOR SOLUTIONS CORPORATION
18463457 TARGETED GAS DELIVERY VIA SIDE GAS INJECTION Non-Final OA Applied Materials, Inc.
17977411 Buffer Layer for Dielectric Protection in Physical Vapor Deposition Metal Liner Applications Non-Final OA Applied Materials, Inc.
18035606 METHOD OF MANUFACTURING DISPLAY PANEL AND THE DISPLAY PANEL Non-Final OA SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
18304393 SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME Non-Final OA TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
18546140 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS Non-Final OA Tokyo Electron Limited
18058245 APPARATUS AND METHOD FOR REPAIRING DEFECT OF SEMICONDUCTOR Final Rejection Tokyo Electron Limited
18153039 METHODS FOR SIMULTANEOUS GENERATION OF A TRAP-RICH LAYER AND A BOX LAYER Non-Final OA Murata Manufacturing Co., Ltd.
18127020 STAGE APPARATUS, CHARGED PARTICLE BEAM APPARATUS, AND OPTICAL INSPECTION APPARATUS Non-Final OA Hitachi High-Tech Corporation
18026217 DIAGNOSTIC DEVICE, SEMICONDUCTOR MANUFACTURING EQUIPMENT SYSTEM, SEMICONDUCTOR EQUIPMENT MANUFACTURING SYSTEM, AND DIAGNOSTIC METHOD Non-Final OA Hitachi High-Tech Corporation
18362649 System Formed Through Package-In-Package Formation Non-Final OA Taiwan Semiconductor Manufacturing Co., Ltd.
18176570 Load Port and Wafer Inspection Method Using the Same Non-Final OA Hsin-Jung Peng

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