Tech Center 2800 • Art Units: 2893
This examiner grants 100% of resolved cases
Jaime Lynn Sprenger is an examiner in Art Unit 2893 within Tech Center 2800. Her profile shows a sample size of 2 resolved cases. Both of these cases were granted, resulting in an allowance rate of 100.0%. This rate indicates that all applications reaching a final disposition under her review have been successful so far.
The median days to allowance for these cases is 976. The interview lift is recorded at 0.0%, though the limited number of 2 resolved cases makes this figure less predictive for future prosecution strategies. While the 100.0% allowance rate is present in the data, the 976 day timeline suggests that applications require a significant period to reach issuance. Practitioners should note that the 0.0% lift reflects the outcomes of the cases resolved to date. As the examiner handles more cases in Art Unit 2893, these metrics may shift to reflect a broader range of prosecution outcomes beyond the initial 2 resolved cases.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18772193 | LIGHT-EMITTING DEVICE PACKAGES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18668920 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18606081 | INTERGRATED CIRCUIT DEVICES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18437865 | SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18157994 | BOARD WITH SUFFICIENT ADHESION STRENGTH BETWEEN INSULATING LAYER AND METAL LAYER | Final Rejection | TOYOTA JIDOSHA KABUSHIKI KAISHA |
| 18402185 | DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 18407933 | MULTILAYER CORELESS SUBSTRATE FORMED FROM STACKED EMBEDDED TRACE SUBSTRATES | Final Rejection | QUALCOMM Incorporated |
| 18660882 | SEMICONDUCTOR DEVICES AND FABRICATING METHODS THEREOF | Non-Final OA | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 18559444 | IMAGING ELEMENT AND METHOD OF MANUFACTURING IMAGING ELEMENT | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18533234 | PRINTED CIRCUIT BOARD ASSEMBLY WITH REDUCED TOTAL HEIGHT | Final Rejection | MEDIATEK INC. |
| 18624743 | SOURCE/DRAIN REGION WITH PROTECTIVE LINER LAYER | Non-Final OA | International Business Machines Corporation |
| 18463296 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | Non-Final OA | SK hynix Inc. |
| 18640921 | SEMICONDUCTOR DEVICE INCLUDING MEMORY STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18466004 | MAGNETIC TUNNEL JUNCTION (MTJ) STRUCTURE AND MEMORY CELL | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18401846 | PACKAGES WITH DTCS ON OTHER DEVICE DIES AND METHODS OF FORMING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18533278 | DISPLAY PANELS AND DISPLAY TERMINALS | Final Rejection | Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. |
| 18467739 | TRANSISTOR STRUCTURE | Non-Final OA | United Microelectronics Corp. |
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