Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2800 2897
This examiner grants 0% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18655027 | PACKAGE COMPRISING AN INTERPOSER PACKAGE WITH METALLIZATION PORTIONS, AND A PASSIVE DEVICE AND A BRIDGE BETWEEN THE METALLIZATION PORTIONS | Non-Final OA | QUALCOMM Incorporated |
| 18692909 | SEMICONDUCTOR PACKAGE | Non-Final OA | LG INNOTEK CO., LTD. |
| 18567729 | SYSTEMS AND METHODS FOR REDUCING STRESS AND IMPROVING SURFACE ADHESION IN A DIE | Non-Final OA | SK Hynix NAND Product Solutions Corp. (dba Solidigm) |
| 18478798 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | Final Rejection | SK hynix Inc. |
| 18474219 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | SK hynix Inc. |
| 18474238 | SEMICONDUCTOR DEVICE AND LAYOUT METHOD OF THE SAME | Non-Final OA | Realtek Semiconductor Corporation |
| 18407800 | FEEDTHROUGH VIA WITH REDUCED RESISTANCE FOR DIRECT CONNECTION TO BACKSIDE METALS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18407705 | RESISTOR STRUCTURE WITH CAPPING STRUCTURE ON TFR LAYER | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18474613 | SEMICONDUCTOR DEVICE INCLUDING INTERCONNECT STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18588091 | SEMICONDUCTOR DEVICE | Non-Final OA | Renesas Electronics Corporation |
| 17848500 | MODULAR POWER TRANSISTOR COMPONENT ASSEMBLIES WITH FLIP CHIP INTERCONNECTIONS | Final Rejection | MACOM Technology Solutions Holdings, Inc. |
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