Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2800 2897
This examiner grants 0% of resolved cases
Ethan Alexander Tuttle operates within Tech Center 2800 and Art Unit 2800. The examiner has resolved 1 case, which resulted in an allowance rate of 0.0%. This single resolution also shows an interview lift of 0.0%. The median days to allowance for this examiner is recorded at 1073. With only 1 resolved case, these figures represent a very limited data set for predictive analysis. Practitioners should view the 0.0% allowance rate and 1073-day median as preliminary data points rather than established trends.
The 0.0% interview lift indicates that the single resolved case did not benefit from an interview, or an interview was not conducted. Given the 1073-day median, applicants should be prepared for a significant duration even with a small sample size. Strategy in Art Unit 2800 should remain flexible as more cases are resolved by this examiner. The 1 resolved case provides a starting point for understanding the examiner's process, but the 0.0% allowance rate may not be indicative of future outcomes. Practitioners should monitor this profile for additional data to refine their approach. The 1073-day timeline is the only current benchmark for pendency.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18434122 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18434391 | SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18576036 | ARRAY SUBSTRATE AND DISPLAY APPARATUS | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18434108 | DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 18475026 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18655027 | PACKAGE COMPRISING AN INTERPOSER PACKAGE WITH METALLIZATION PORTIONS, AND A PASSIVE DEVICE AND A BRIDGE BETWEEN THE METALLIZATION PORTIONS | Non-Final OA | QUALCOMM Incorporated |
| 18476868 | SYSTEMS AND METHODS FOR SEMICONDUCTOR DEVICES WITH DIE-TO-DIE INTERFACES | Final Rejection | Avago Technologies International Sales Pte. Limited |
| 18692909 | SEMICONDUCTOR PACKAGE | Non-Final OA | LG INNOTEK CO., LTD. |
| 18653535 | THROUGH-CHIP VIAS EXTENDING THROUGH MULTIPLE CHIPS FOR TOP-DOWN POWER REDISTRIBUTION | Non-Final OA | International Business Machines Corporation |
| 18478798 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | Final Rejection | SK hynix Inc. |
| 18474238 | SEMICONDUCTOR DEVICE AND LAYOUT METHOD OF THE SAME | Non-Final OA | Realtek Semiconductor Corporation |
| 18407800 | FEEDTHROUGH VIA WITH REDUCED RESISTANCE FOR DIRECT CONNECTION TO BACKSIDE METALS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18407705 | RESISTOR STRUCTURE WITH CAPPING STRUCTURE ON TFR LAYER | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18815864 | HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FABRICATING THE SAME | Non-Final OA | UNITED MICROELECTRONICS CORP. |
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