Technology area: Semiconductors, Circuits & Optics
22 pending office actions • 15 art units • 22 examiners • 0 of 22 (0%) have an AI response strategy ready • 30 patents granted in the last 365 days
Tong Hsing Electronic Industries Ltd. has 21 pending office actions in Semiconductors, Circuits & Optics. The matters span 21 examiners and 14 art units, making this a widely distributed prosecution docket with substantial assignment breadth.
BIRCH, EKATERINA THOMASA is the busiest examiner, with 1 pending action. The absence of a multi-action examiner concentration means portfolio control depends on disciplined matter-level tracking and consistent internal positions.
The difference between the action count and art-unit count indicates that several matters share art-unit environments even though examiner assignments are distinct. Counsel can organize issue monitoring by art unit, but should not assume that a shared art unit will produce identical examiner treatment.
Based on the USPTO statutory response window for each pending office action. 5 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 5 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §103 only | 13 (59%) |
| Double-patenting only | 1 (5%) |
| Multi-statute (no §101) | 8 (36%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| BIRCH, EKATERINA THOMASA | 1 | — | — |
| PARTHASARATHY, ROHIT | 1 | 90.2% | +13.2% |
| AYCHILLHUM, ANDARGIE M | 1 | 84.3% | +14.7% |
| PLESZCZYNSKA, JOANNA | 1 | 54.5% | +27.7% |
| DEGRASSE, IAN ISAAC | 1 | 81.5% | +3.3% |
| BERRY, PAUL ANTHONY | 1 | 90.6% | -1.3% |
| PATEL, DEVANG R | 1 | 65.6% | +39.0% |
| ZHENG, LOIS L | 1 | 67.6% | +13.0% |
| CHIU, TSZ K | 1 | 79.3% | +11.0% |
| WINTERS, SEAN AYERS | 1 | 88.7% | +17.9% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 2 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18890105 | SENSOR PACKAGE STRUCTURE | PARTHASARATHY, ROHIT | — |
| 18522251 | LIGHT EMITTING DIODE PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | WINTERS, SEAN AYERS | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18895406 | OPTICAL DEVICE | BIRCH, EKATERINA THOMASA | — |
| 18764342 | METHOD FOR MANUFACTURING CONDUCTIVE CIRCUIT BOARD AND CONDUCTIVE CIRCUIT BOARD MADE THEREFROM | AYCHILLHUM, ANDARGIE M | — |
| 18755319 | CERAMIC METAL COMPOSITE SUBSTRATE | PLESZCZYNSKA, JOANNA | — |
| 18678253 | SENSOR PACKAGE STRUCTURE HAVING WIRELESS CONFIGURATION AND MANUFACTURING METHOD THEREOF | DEGRASSE, IAN ISAAC | — |
| 18675154 | POWER CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | BERRY, PAUL ANTHONY | — |
| 18510923 | CHIP PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME | FAYETTE, NATHALIE RENEE | — |
| 18499188 | CIRCUIT BOARD STRUCTURE INCLUDING METAL MATERIALS WITH DIFFERENT THERMAL EXPANSION COEFFICIENTS AND METHOD FOR PRODUCING THE SAME | MAIGA, SIDI MOHAMED | — |
| 17896090 | SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | BENITEZ ROSARIO, JOSHUA | — |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 7 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18657946 | METHOD FOR PRODUCING ACTIVE METAL CERAMIC SUBSTRATE | PATEL, DEVANG R | 61d |
| 18890105 | SENSOR PACKAGE STRUCTURE | PARTHASARATHY, ROHIT | — |
| 18764342 | METHOD FOR MANUFACTURING CONDUCTIVE CIRCUIT BOARD AND CONDUCTIVE CIRCUIT BOARD MADE THEREFROM | AYCHILLHUM, ANDARGIE M | — |
| 18755319 | CERAMIC METAL COMPOSITE SUBSTRATE | PLESZCZYNSKA, JOANNA | — |
| 18432217 | METAL-CERAMIC SUBSTRATE HAVING DOUBLE BRAZING LAYERS AND METHOD FOR MANUFACTURING THE SAME | ZHENG, LOIS L | — |
| 18419517 | SEMICONDUCTOR PACKAGE STRUCTURE | CHIU, TSZ K | — |
| 18522251 | LIGHT EMITTING DIODE PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | WINTERS, SEAN AYERS | — |
| Art Unit | Apps |
|---|---|
| 2818 | 3 |
| 2898 | 3 |
| 2847 | 2 |
| 2812 | 2 |
| 2813 | 2 |
| 2899 | 1 |
| 1783 | 1 |
| 1735 | 1 |
| 1733 | 1 |
| 2892 | 1 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 18895406 | OPTICAL DEVICE | BIRCH, EKATERINA THOMASA | 2818 | §103§112 | Non-Final OA | — | Pending | Sep 25, 2024 |
| 18890105 | SENSOR PACKAGE STRUCTURE | PARTHASARATHY, ROHIT | 2899 | §103 | Non-Final OA | — | Pending | Sep 19, 2024 |
| 18764342 | METHOD FOR MANUFACTURING CONDUCTIVE CIRCUIT BOARD AND CONDUCTIVE CIRCUIT BOARD MADE THEREFROM | AYCHILLHUM, ANDARGIE M | 2847 | §102§103 | Non-Final OA | — | Pending | Jul 04, 2024 |
| 18755319 | CERAMIC METAL COMPOSITE SUBSTRATE | PLESZCZYNSKA, JOANNA | 1783 | §103§112 | Non-Final OA | — | Pending | Jun 26, 2024 |
| 18678253 | SENSOR PACKAGE STRUCTURE HAVING WIRELESS CONFIGURATION AND MANUFACTURING METHOD THEREOF | DEGRASSE, IAN ISAAC | 2818 | §102§103 | Non-Final OA | — | Pending | May 30, 2024 |
| 18675154 | POWER CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | BERRY, PAUL ANTHONY | 2898 | §103§112 | Non-Final OA | — | Pending | May 28, 2024 |
| 18657946 | METHOD FOR PRODUCING ACTIVE METAL CERAMIC SUBSTRATE | PATEL, DEVANG R | 1735 | §103 | Final Rejection | 61d | Pending | May 08, 2024 |
| 18432217 | METAL-CERAMIC SUBSTRATE HAVING DOUBLE BRAZING LAYERS AND METHOD FOR MANUFACTURING THE SAME | ZHENG, LOIS L | 1733 | DP | Non-Final OA | — | Pending | Feb 05, 2024 |
| 18419517 | SEMICONDUCTOR PACKAGE STRUCTURE | CHIU, TSZ K | 2898 | §103 | Final Rejection | — | Pending | Jan 22, 2024 |
| 18522251 | LIGHT EMITTING DIODE PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | WINTERS, SEAN AYERS | 2892 | §103 | Final Rejection | — | Pending | Nov 29, 2023 |
| 18517471 | BONDING STRUCTURE FOR CONNECTING A CHIP AND A METAL MATERIAL AND MANUFACTURING METHOD THEREOF | TRAN, DZUNG | 2893 | §103 | Final Rejection | — | Pending | Nov 22, 2023 |
| 18515167 | OPTICAL DEVICE | DEAN, RAY ALEXANDER | 2872 | §103 | Final Rejection | — | Pending | Nov 20, 2023 |
| 18510923 | CHIP PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME | FAYETTE, NATHALIE RENEE | 2812 | §103§112Other | Final Rejection | — | Pending | Nov 16, 2023 |
| 18499188 | CIRCUIT BOARD STRUCTURE INCLUDING METAL MATERIALS WITH DIFFERENT THERMAL EXPANSION COEFFICIENTS AND METHOD FOR PRODUCING THE SAME | MAIGA, SIDI MOHAMED | 2847 | §102§103 | Final Rejection | — | Pending | Oct 31, 2023 |
| 18484407 | SENSOR PACKAGE STRUCTURE | VALENZUELA, PATRICIA D | 2812 | §103 | Final Rejection | 28d | Pending | Oct 10, 2023 |
| 18474201 | OPTICAL PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | SRINIVASAN, SESHA SAIRAMAN | 2817 | §103 | Final Rejection | 39d | Pending | Sep 25, 2023 |
| 18210165 | CERAMIC METAL COMPOSITE SUBSTRATE | MCDONALD, JASON ANDREW | 2898 | §103 | Final Rejection | — | Pending | Jun 15, 2023 |
| 18206146 | SENSOR PACKAGE STRUCTURE | WEILAND, ADAM DAVID | 2813 | §103 | Final Rejection | 65d | Pending | Jun 06, 2023 |
| 18206153 | SENSOR PACKAGE STRUCTURE | CHAN, CANDICE | 2813 | §103 | Final Rejection | — | Pending | Jun 06, 2023 |
| 18323856 | CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF | EGOAVIL, GUILLERMO J | 3729 | §103 | Non-Final OA | — | Pending | May 25, 2023 |
| 17939981 | PACKAGE SUBSTRATE AND METHOD FOR FABRICATING CHIP ASSEMBLY | TURNER, BRIAN | 2818 | §103 | Final Rejection | 65d | Pending | Sep 08, 2022 |
| 17896090 | SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | BENITEZ ROSARIO, JOSHUA | 2815 | §102§103 | Final Rejection | — | Pending | Aug 26, 2022 |
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Start Free TrialTong Hsing Electronic Industries Ltd. has 22 pending office actions as of October 2026, spread across 15 art units and 22 examiners.
Ekaterina Thomasa Birch has the most, with 1 of Tong Hsing Electronic Industries Ltd.'s pending office actions.
Mostly Semiconductors, Circuits & Optics (USPTO Tech Center 2800), based on where its pending office actions are examined.
