Tech Center 2800 • Art Units: 2818
This examiner grants 86% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18752950 | INTEGRATED CIRCUIT DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18704476 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18756721 | PHOTOELECTRIC CONVERSION APPARATUS, MANUFACTURING METHOD, AND EQUIPMENT | Non-Final OA | CANON KABUSHIKI KAISHA |
| 18603280 | DISPLAY DEVICE | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 17983226 | BARRIER ENABLED CUF AND MOLD PROCESS FOR MULTI-CHIP PACKAGING | Final Rejection | Intel Corporation |
| 18773250 | SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18632678 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18617303 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE HAVING COMPLEMENTARY FIELD-EFFECT TRANSISTOR STRUCTURE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 17721723 | Semiconductor Structure And Method For Forming The Same | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18582326 | Forming Multiple TSVs with Different Formation Schemes | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17663692 | SEMICONDUCTOR PACKAGE AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18788082 | ORGANIC GATE TFT-TYPE STRESS SENSORS AND METHOD OF MAKING AND USING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18209719 | SYSTEMS AND METHODS FOR IMPROVING MECHANICAL STRENGTH OF LOW DIELECTRIC CONSTANT MATERIALS | Non-Final OA | Applied Materials, Inc. |
| 18147999 | SEMICONDUCTOR DEVICE AND BIDIRECTIONAL ESD PROTECTION DEVICE COMPRISING THE SAME | Non-Final OA | NEXPERIA B.V. |
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