Tech Center 2800 • Art Units: 2893 2899
This examiner grants 100% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18637580 | SEMICONDUCTOR DEVICES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18279398 | DISPLAY APPARATUS, AND DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | Final Rejection | BOE Technology Group Co., Ltd. |
| 18711618 | SEMICONDUCTOR LIGHT EMITTING DEVICE AND SEMICONDUCTOR LIGHT EMITTING MODULE | Non-Final OA | STANLEY ELECTRIC CO., LTD. |
| 18192804 | INTERCONNECT BRIDGE CIRCUITRY DESIGNS FOR INTEGRATED CIRCUIT PACKAGE SUBSTRATES | Non-Final OA | Intel Corporation |
| 18567796 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Final Rejection | Mitsubishi Electric Corporation |
| 18047978 | MICROELECTRONIC DEVICES INCLUDING CAPACITORS, AND RELATED ELECTRONIC SYSTEMS AND METHODS | Final Rejection | Micron Technology, Inc. |
| 18368014 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18555694 | DIGITAL DEVICE, METHOD FOR PRODUCING SAME, AND METHOD FOR USING SAME | Final Rejection | TOHOKU UNIVERSITY |
| 18488360 | THREE-DIMENSIONAL MEMORY DEVICE INCLUDING SLOPING WORD LINES FOR STAIRLESS CONTACT AND METHODS OF FORMING THE SAME | Non-Final OA | WESTERN DIGITAL TECHNOLOGIES, INC., |
| 18514089 | ELECTRONIC DEVICE INCLUDING STACKED SEMICONDUCTOR CHIPS AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18488376 | SEMICONDUCTOR POWER DEVICE WITH IMPROVED JUNCTION TERMINATION EXTENSION | Non-Final OA | NEXPERIA B.V. |
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