Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2893 2899
This examiner grants 100% of resolved cases
Vicente Rolando Gonzales works as an examiner in Tech Center 2800 and Art Unit 2893. The data set for this examiner includes 3 resolved cases. All of these cases resulted in an allowance, which establishes an allowance rate of 100.0 percent for the applications reaching a final disposition. This metric indicates a high frequency of successful outcomes in this specific examination environment.
The interview lift is 0.0 percent. Given that the baseline allowance rate is already 100.0 percent, there is no statistical room for an interview to increase the probability of a grant. This metric indicates that all cases in this sample of 3 resolved cases were successful without the need for an interview lift, suggesting that the current prosecution approach is effective.
The median time to allowance is 1015 days. This pendency figure provides a baseline for the expected duration of the prosecution process from filing to grant. While the data is limited to 3 resolved cases, these metrics offer an initial look at the examiner's outcomes and the timeline for applications in Art Unit 2893, providing a starting point for applicant strategy and expectation management.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18826635 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18807028 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18772412 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18637580 | SEMICONDUCTOR DEVICES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18705532 | Display Substrate, Preparation Method Therefor, and Display Apparatus | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18279398 | DISPLAY APPARATUS, AND DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | Final Rejection | BOE Technology Group Co., Ltd. |
| 18368016 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 18586573 | ELECTRO-OPTICAL DEVICE AND ELECTRONIC APPARATUS | Final Rejection | SEIKO EPSON CORPORATION |
| 18711618 | SEMICONDUCTOR LIGHT EMITTING DEVICE AND SEMICONDUCTOR LIGHT EMITTING MODULE | Non-Final OA | STANLEY ELECTRIC CO., LTD. |
| 18193295 | INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING METAL POSTS THERMALLY COUPLING A DIE TO AN INTERPOSER SUBSTRATE FOR DISSIPATING THERMAL ENERGY OF THE DIE, AND RELATED FABRICATION METHODS | Non-Final OA | QUALCOMM Incorporated |
| 18555694 | DIGITAL DEVICE, METHOD FOR PRODUCING SAME, AND METHOD FOR USING SAME | Final Rejection | TOHOKU UNIVERSITY |
| 18646458 | ADHESION OF A PACKAGE COMPONENT TO A HEAT SINK | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18790083 | SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18465598 | POWER SEMICONDUCTOR DEVICE, MEASUREMENT SYSTEM AND METHOD FOR DETERMINING A CURRENT OF A POWER SEMICONDUCTOR DEVICE | Non-Final OA | Infineon Technologies AG |
| 18815693 | MANUFACTURING METHOD OF ELECTRONIC PACKAGE | Non-Final OA | SILICONWARE PRECISION INDUSTRIES CO., LTD. |
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