Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2811 2823 2899
This examiner grants 77% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18585978 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18393837 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD |
| 18535339 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18381744 | INTEGRATED CIRCUIT DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18532865 | Thin Film Transistor and Display Device | Non-Final OA | LG Display Co., Ltd. |
| 18326096 | DISPLAY DEVICE | Final Rejection | Samsung Display Co., LTD. |
| 18316513 | LIGHT EMITTING ELEMENT, DISPLAY DEVICE INCLUDING THE SAME, AND METHOD OF FABRICATING LIGHT EMITTING ELEMENT | Non-Final OA | Samsung Display Co., LTD. |
| 18232042 | SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGE FOR DISPLAY PIXEL AND DISPLAY DEVICE INCLUDING THE SAME | Final Rejection | LG ELECTRONICS INC. |
| 18273739 | DISPLAY DEVICE USING SEMICONDUCTOR LIGHT-EMITTING ELEMENT | Final Rejection | LG ELECTRONICS INC. |
| 18036358 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME | Non-Final OA | LG ELECTRONICS INC. |
| 17699650 | Back Side to Front Side Alignment on a Semiconductor Wafer with Special Structures | Non-Final OA | Infineon Technologies AG |
| 18524362 | SUBPIXEL DESIGNS FOR DISPLAY DEVICE WITH UNDER DISPLAY CAMERA | Non-Final OA | Microsoft Technology Licensing, LLC |
| 18334657 | ELECTRONIC DEVICE | Final Rejection | InnoLux Corporation |
| 17898104 | METHODS FOR FORMING SEMICONDUCTOR DEVICES WITH ISOLATION STRUCTURES | Non-Final OA | Tokyo Electron Limited |
| 18325323 | TRANSPARENT DISPLAY DEVICE, LAMINATED GLASS, AND MANUFACTURING METHOD OF TRANSPARENT DISPLAY DEVICE | Final Rejection | AGC Inc. |
| 18473582 | SEMICONDUCTOR DEVICE | Non-Final OA | LAPIS Technology Co., Ltd. |
| 18393221 | MICRO-ELECTRONIC COMPONENT COMBINING POWER DELIVERY AND COOLING FROM THE BACK SIDE | Non-Final OA | IMEC vzw |
| 18524355 | Method for Forming a Semiconductor Device | Non-Final OA | IMEC VZW |
| 18208353 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | EPISTAR CORPORATION |
| 17550449 | SEMICONDUCTOR STRUCTURE | Non-Final OA | EPISTAR CORPORATION |
| 18388272 | INCORPORATING CONSTRICTION JOSEPHSON JUNCTIONS IN SUPERCONDUCTING QUBITS FOR A SINGLE PATTERNING STEP FABRICATION | Non-Final OA | U.S. Department of Energy |
| 18356490 | LIGHT-EMITTING STRUCTURE | Final Rejection | ENKRIS SEMICONDUCTOR, INC. |
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