Prosecution Insights
Prosecution Insights
Tech Center 3700 • Art Units: 2817 2895 3645 3724
This examiner grants 86% of resolved cases
Brad Allan Knudson is an examiner in Tech Center 3700 and Art Unit 2817. The examiner has 111 resolved cases. The allowance rate is 85.6%. This baseline rate suggests a favorable environment for applicants, with a high frequency of successful outcomes. The 111 resolved cases provide a robust data set for understanding the examiner's typical timelines and decision-making patterns.
The median days to allowance is 1188. This 1188-day median reflects the typical timeframe for successful applications. Practitioners should factor this duration into their planning when their cases are assigned to Art Unit 2817.
The interview lift is 17.7%. This lift indicates that interviews are associated with a higher probability of success compared to the 85.6% allowance rate. Practitioners can use interviews as an effective tool to resolve any remaining issues and secure an allowance more efficiently than through written responses alone.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18734052 | SEMICONDUCTOR DEVICES INCLUDING THROUGH-PLUGS | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18705995 | Display Substrate and Display Apparatus | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18676874 | DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18466918 | DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 18652631 | DISPLAY DEVICE | Non-Final OA | LG Display Co., Ltd. |
| 18216325 | INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE SOURCE OR DRAIN CONTACT DIFFERENTIATED ACCESS | Non-Final OA | Intel Corporation |
| 17851967 | INTEGRATED CIRCUIT STRUCTURES HAVING MEMORY WITH BACKSIDE DRAM AND POWER DELIVERY | Final Rejection | Intel Corporation |
| 18394558 | BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT | Non-Final OA | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. |
| 18090380 | THREE-DIMENSIONAL MEMORY DEVICE HAVING A SELECT CHANNEL STRUCTURE INCLUDING A BLOCK LAYER, MANUFACTURING METHOD THEREOF, AND MEMORY SYSTEM | Non-Final OA | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 18717558 | LIGHT EMITTING DEVICE AND ELECTRONIC APPARATUS | Non-Final OA | SONY GROUP CORPORATION |
| 18770882 | SOLID-STATE IMAGING ELEMENT AND ELECTRONIC DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18332793 | PHASE CHANGE MEMORY CELL | Non-Final OA | International Business Machines Corporation |
| 18217504 | SEMICONDUCTOR PACKAGE WITH COVERED MAGNETIC MOLD COMPOUND | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18648903 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 17754038 | CHEMICAL MECHANICAL PLANARIZATION POLISHING COMPOSITIONS FOR IMPROVING WITH-IN DIE NON-UNIFORMITIES | Final Rejection | Versum Materials US, LLC |
| 17596680 | METHOD FOR TRANSFERRING LEDS AND LIGHT-EMITTING BASE PLATE | Non-Final OA | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| 18765518 | METHOD OF PROCESSING WORKPIECE | Non-Final OA | DISCO CORPORATION |
| 18530329 | SEMICONDUCTOR DIE, SEMICONDUCTOR DEVICE AND METHOD FOR FORMING SEMICONDUCTOR DEVICE | Final Rejection | CHANGXIN MEMORY TECHNOLOGIES, INC. |
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