Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 1721 2813
This examiner grants 79% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18578159 | Touch Layer, Touch Display Apparatus, and Manufacturing Method for Touch Layer | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18604297 | SEMICONDUCTOR DEVICE | Non-Final OA | KABUSHIKI KAISHA TOSHIBA |
| 18516159 | VERTICAL GATE DRAM DEVICE | Non-Final OA | Yangtze Memory Technologies Co., Ltd. |
| 18500993 | SEMICONDUCTOR DEVICE | Final Rejection | Mitsubishi Electric Corporation |
| 18751382 | SEMICONDUCTOR STRUCTURE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 18498697 | CFET WITH VIA FUSE STRUCTURE AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18460189 | METHODS AND STRUCTURES FOR HIGH STRENGTH ASYMMETRIC DIELECTRIC IN HYBRID BONDING | Non-Final OA | Applied Materials, Inc. |
| 18489623 | HYBRID POWER CONVERTERS, LATERAL DEVICES, VERTICAL DEVICES, MULTIPLE COPPER CLIPS, REPLICA DEVICES | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18489729 | METHOD FOR MANUFACTURING A DEVICE COMPRISING TWO SEMICONDUCTOR DICE AND A DEVICE THEREOF | Final Rejection | STMICROELECTRONICS S.r.l. |
| 18532556 | GATE TIE-DOWN TO BACKSIDE POWER RAIL | Non-Final OA | International Business Machines Corporation |
| 18366083 | SEMICONDUCTOR DEVICE BACKSIDE ISOLATION FEATURE INTEGRATION | Final Rejection | International Business Machines Corporation |
| 18314684 | INTEGRATED STRUCTURE OF SEMICONDUCTOR DEVICES HAVING SHARED CONTACT PLUG AND MANUFACTURING METHOD THEREOF | Final Rejection | Richtek Technology Corporation |
| 18292031 | NITRIDE SEMICONDUCTOR DEVICE, NITRIDE SEMICONDUCTOR SUBSTRATE, AND METHOD OF MANUFACTURING NITRIDE SEMICONDUCTOR DEVICE | Non-Final OA | NATIONAL UNIVERSITY CORPORATION TOKAI NATIONAL HIGHER EDUCATION AND RESEARCH SYSTEM |
| 18372684 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Final Rejection | UNITED MICROELECTRONICS CORP. |
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