Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2823 2891 2897
This examiner grants 88% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18482963 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC SYSTEM INCLUDING THE SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18336477 | SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18316682 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18281247 | Display Substrate and Preparation Method Therefor, and Display Device | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18280679 | Display Substrate, Manufacturing Method and Driving Method Therefor, Display Device and Vehicle Lamp | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18278855 | Display Substrate, Manufacturing Method Therefor and Display Device | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18439685 | DISPLAY DEVICE, METHOD OF MANUFACTURING THE SAME, AND TILED DISPLAY DEVICE HAVING THE SAME | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18230623 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18354884 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18103719 | DISPLAY PANEL AND DISPLAY DEVICE | Non-Final OA | Xiamen Tianma Display Technology Co., Ltd. |
| 18544445 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | AUO Corporation |
| 18366681 | DISPLAY DEVICE | Final Rejection | Magnolia White Corporation |
| 17954291 | NECKED RIBBON FOR BETTER N WORKFUNCTION FILLING AND DEVICE PERFORMANCE | Non-Final OA | Intel Corporation |
| 18548451 | DISPLAY PANEL AND ELECTRONIC DEVICE | Non-Final OA | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| 18385137 | NORMALLY-ON GAN HEMT INTEGRATION ON MONOLITHIC P-GAN INTEGRATED CIRCUITS | Non-Final OA | STMicroelectronics International N.V. |
| 17670049 | MAGNETORESISTIVE DEVICES AND METHODS THEREFOR | Final Rejection | Everspin Technologies, Inc. |
| 18524997 | LATCH-UP PREVENTION WITH WELL-TIE EXTENSION USING SELECTIVE WELL DOPING | Non-Final OA | NXP B.V. |
| 18162493 | SHIELDED WAFER LEVEL CHIP SCALE PACKAGE WITH SHIELD CONNECTED TO GROUND VIA A SEAL RING | Non-Final OA | Skyworks Solutions, Inc. |
| 18550708 | SUBSTRATE FOR SEMICONDUCTOR DEVICE, SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURING SAME | Non-Final OA | THE ROYAL INSTITUTION FOR THE ADVANCEMENT OF LEARNING/MCGILL UNIVERSITY |
| 18368113 | SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF, AND PHOTOMASK LAYOUT | Final Rejection | SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION |
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