Tech Center 2800 • Art Units: 2811 2814 2821 2823 2844 2897
This examiner grants 81% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18402883 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18577470 | WIRING SUBSTRATE, MANUFACTURING METHOD THEREOF, LIGHT-EMITTING SUBSTRATE, AND DISPLAY DEVICE | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 17957352 | SEMICONDUCTOR DIE WITH DISSOLVABLE METAL LAYER | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18561063 | DISPLAY DEVICE, METHOD FOR PRODUCING DISPLAY DEVICE, AND AQUEOUS SOLUTION | Non-Final OA | Sharp Display Technology Corporation |
| 18396713 | SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING A SEMICONDUCTOR STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18524644 | SEMICONDUCTOR DEVICES AND METHODS OF FABRICATION THEREOF | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18524661 | SEMICONDUCTOR DEVICES WITH BACKSIDE GATE CONTACTS AND METHODS OF FABRICATION THEREOF | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18671060 | THIN FILM TRANSISTOR AND DISPLAY DEVICE | Non-Final OA | Magnolia White Corporation |
| 18573116 | LIQUID METAL CONNECTION DEVICE AND METHOD | Non-Final OA | Intel Corporation |
| 18630911 | ASSEMBLY INCLUDING TERMINAL PADS ASSOCIATED WITH CONDUCTIVE TRACES AND HAVING IRREGULAR SURFACE TOPOGRAPHY, AND RELATED METHODS AND ELECTRONIC SYSTEMS | Non-Final OA | Micron Technology, Inc. |
| 18572959 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 18565663 | EPITAXIAL WAFER FOR ULTRAVIOLET RAY EMISSION DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | SHIN-ETSU CHEMICAL CO., LTD. |
| 18402950 | METHODS AND SYSTEMS FOR FORMING STRUCTURES COMPRISING A THRESHOLD VOLTAGE TUNING LAYER | Non-Final OA | ASM IP Holding B.V. |
| 18399098 | ELECTROMAGNETIC SHILEDING FOR LEADLESS SEMICONDUCTOR PACKAGE | Non-Final OA | NXP USA, Inc. |
| 18573297 | POWER MODULE | Non-Final OA | AMOSENSE CO., LTD. |
| 18399064 | SEMICONDUCTOR STRUCTURE WITH BURIED POWER RAILS AND METHOD OF FABRICATING THE SAME | Non-Final OA | WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD. |
| 18525356 | THREE LAYER SYSTEM IN PACKAGE AND A METHOD OF ENABLING THEREOF | Non-Final OA | LightSpeed Photonics Pte Ltd |
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