Tech Center 2800 • Art Units: 2812 2816 2897
This examiner grants 85% of resolved cases
Ilker Nmn Ozden serves in Tech Center 2800 and Art Unit 2812, with 39 resolved cases. The examiner has an allowance rate of 84.6 percent. This rate indicates a favorable environment for applicants in this art unit within the 2800 Tech Center. The 84.6 percent allowance rate is a key performance indicator for the 39 resolved cases.
The median days to allowance is 1231. This metric provides a standard for the expected length of the prosecution process. Practitioners can use the 1231-day figure to inform their strategy and set timelines for applications assigned to Art Unit 2812. This median is a primary factor in managing client expectations.
The interview lift is 23.1 percent. This positive lift suggests that interviews can further enhance the probability of success. For the 39 resolved cases, the 23.1 percent increase in allowance probability demonstrates the value of engaging in direct discussion with the examiner to resolve pending issues in Tech Center 2800.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18810729 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18795874 | IMAGE SENSOR AND METHOD OF FABRICATING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18133198 | SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18084837 | QUANTUM DOT LIGHT-EMITTING DEVICE WITH ELECTRON TRANSPORT AND HOLE TRANSPORT LAYERS COMPRISING QUANTUM DOTS AND ELECTRONIC APPARATUS INCLUDING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18464738 | SEMICONDUCTOR DEVICE | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 18814437 | PHOTOELECTRIC CONVERTER AND IMAGE SENSOR | Non-Final OA | Panasonic Intellectual Property Management Co., Ltd. |
| 18745203 | LIGHT-DIRECTING STRUCTURES IN LIGHT-EMITTING DIODE DEVICES AND RELATED METHODS | Non-Final OA | CreeLED, Inc. |
| 18206325 | PATTERNING USING MONOMER BASED SACRIFICIAL MATERIAL LIFTOFF | Non-Final OA | BAE SYSTEMS Information and Electronic Systems Integration Inc. |
| 18739387 | Multilayer Structures and Assemblies | Non-Final OA | KYOCERA AVX Components Corporation |
| 18085421 | THREE-DIMENSIONAL SEMICONDUCTOR DEVICE INCLUDING SEPARATION PATTERNS HAVING DIFFERENT STRUCTURES | Non-Final OA | SK hynix Inc. |
| 18163112 | COMMON ANODE MICRO-LED SYSTEM ARCHITECTURE | Final Rejection | Meta Platforms Technologies, LLC |
| 18657170 | DIE EDGE STRUCTURE FOR MOLDING COMPOUND FILLING AND THE METHODS OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18328207 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18673383 | MOISTURE RESISTANT SEMICONDUTOR DEVICE | Non-Final OA | Microchip Technology Incorporated |
| 18773598 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | UNITED MICROELECTRONICS CORP. |
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