Prosecution Insights
Last updated: April 19, 2026

Examiner: SARKER-NAG, AKHEE

Tech Center 2800 • Art Units: 2893

This examiner grants 82% of resolved cases

Performance Statistics

81.7%
Allow Rate
+13.7% vs TC avg
88
Total Applications
+9.2%
Interview Lift
1322
Avg Prosecution Days
Based on 60 resolved cases, 2023–2026

Rejection Statute Breakdown

0%
§101 Eligibility
21.5%
§102 Novelty
64.8%
§103 Obviousness
13.7%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18116107 SEMICONDUCTOR DEVICE Final Rejection SAMSUNG ELECTRONICS CO., LTD.
18283346 ULTRAVIOLET LIGHT EMITTING ELEMENT Non-Final OA ASAHI KASEI KABUSHIKI KAISHA
18509311 DISPLAY DEVICE Non-Final OA Samsung Display Co., LTD.
18500042 METHOD OF MANUFACTURING LIGHT EMITTING DIODE Non-Final OA Samsung Display Co., LTD.
18334968 SEMICONDUCTOR APPARATUS, METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS, EQUIPMENT, AND SUBSTRATE Non-Final OA CANON KABUSHIKI KAISHA
17708915 Multi-Device Stack Structure Final Rejection Arm Limited
17691213 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE Final Rejection SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
18363889 BACKSIDE POWER RAIL TO BACKSIDE CONTACT CONNECTION Non-Final OA International Business Machines Corporation
17994487 SEPARATE EPITAXY IN MONOLITHIC STACKED AND STEPPED NANOSHEETS Non-Final OA INTERNATIONAL BUSINESS MACHINES CORPORATION
17482094 MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF Final Rejection Taiwan Semiconductor Manufacturing Company, Ltd.
18486467 SIP-TYPE ELECTRONIC DEVICE AND METHOD FOR MAKING SUCH A DEVICE Non-Final OA COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
18249862 ELECTRONIC COMPONENT EMBEDDED SUBSTRATE Final Rejection TDK Corporation
17821039 Interband Cascade Infrared Photodetectors and Methods of Use Final Rejection The Board of Regents of the University of Oklahoma
18567964 SEMICONDUCTOR DEVICE, DISPLAY PANEL AND CHIP Non-Final OA WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
18497810 METHODS AND STRUCTURES EMPLOYING METAL OXIDE FOR DIRECT METAL BONDING Non-Final OA ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
17809841 CONTROL OF SURFACE MORPHOLOGY OF SPALLED (110) III-V SUBSTRATE SURFACES Final Rejection Colorado School of Mines

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