Tech Center 2800 • Art Units: 2811 2815 2818 2821 2893 2896
This examiner grants 84% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18761826 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18626691 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18601335 | 3D INTEGRATED CIRCUIT (3DIC) STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18531883 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18687829 | DISPLAY SUBSTRATE AND DISPLAY APPARATUS | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18601339 | SEMICONDUCTOR DEVICE | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 18664321 | DISPLAY DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18709968 | DISPLAY DEVICE | Non-Final OA | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| 18601215 | SEMICONDUCTOR DEVICE INCLUDING BUMPS AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SK hynix Inc. |
| 18787005 | POST-FORMATION MENDS OF DIELECTRIC FEATURES | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18782473 | PARTIAL DIRECTIONAL ETCH METHOD AND RESULTING STRUCTURES | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18774296 | Backside Vias in Semiconductor Device | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18510493 | ELECTRONIC DEVICE | Non-Final OA | Advanced Semiconductor Engineering, Inc. |
| 18610394 | GATE TRENCH POWER SEMICONDUCTOR DEVICES HAVING TRENCH SHIELDING REGIONS AND METHODS OF FORMING THE SAME | Non-Final OA | Wolfspeed, Inc. |
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