Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2811 2815 2818 2821 2893 2896
This examiner grants 84% of resolved cases
David C Spalla maintains a high volume of 853 resolved cases within Tech Center 2800 and Art Unit 2811. His allowance rate of 84.4% is notably high, suggesting a relatively smooth path to grant for many applications. This efficiency is further evidenced by a median days to allowance of 844, which indicates a faster resolution timeline compared to many other examiners. The large sample size of 853 cases provides a high degree of statistical reliability for these metrics.
The interview lift of 4.8% provides a modest but positive impact on prosecution outcomes. When added to the base allowance rate of 84.4%, an interview may slightly improve the chances of success, though the high initial rate suggests that many cases proceed to allowance without such intervention. Practitioners can expect a predictable experience in Art Unit 2811, characterized by the 844 days median pendency and a high probability of grant. The 4.8% lift remains a useful tool for complex cases, even if the general trend is already favorable. The 853 resolved cases confirm that this examiner consistently maintains high efficiency and grant rates.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18761826 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18626691 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18601335 | 3D INTEGRATED CIRCUIT (3DIC) STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18687829 | DISPLAY SUBSTRATE AND DISPLAY APPARATUS | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18664321 | DISPLAY DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18601339 | SEMICONDUCTOR DEVICE | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 18522322 | DISPLAY MODULE | Final Rejection | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. |
| 18495832 | BONDING A WAFER WITH A SUBSTRATE TO A WAFER WITH BACKSIDE INTERCONNECT WIRING | Non-Final OA | International Business Machines Corporation |
| 18083994 | STRESS MODULATING PATTERN CONTAINING BONDING DIELECTRIC LAYER | Final Rejection | International Business Machines Corporation |
| 18601215 | SEMICONDUCTOR DEVICE INCLUDING BUMPS AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SK hynix Inc. |
| 18786797 | FIELD-EFFECT TRANSISTOR DEVICE WITH GATE SPACER STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18787005 | POST-FORMATION MENDS OF DIELECTRIC FEATURES | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18780150 | INNER SPACER FEATURES FOR MULTI-GATE TRANSISTORS | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18779444 | Source/Drain Contact with Low-K Contact Etch Stop Layer and Method of Fabricating Thereof | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18601334 | MEMS DEVICE AND MANUFACTURING METHOD FOR MEMS DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18610394 | GATE TRENCH POWER SEMICONDUCTOR DEVICES HAVING TRENCH SHIELDING REGIONS AND METHODS OF FORMING THE SAME | Non-Final OA | Wolfspeed, Inc. |
| 18813074 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | UNITED MICROELECTRONICS CORP. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy