Tech Center 2800 • Art Units: 2897
This examiner grants 88% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18046139 | SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18396314 | THIN FILM TRANSISTOR ARRAY SUBSTRATE INCLUDING OXIDE SEMICONDUCTOR PATTERN AND DISPLAY DEVICE INCLUDING SAME | Non-Final OA | LG Display Co., Ltd. |
| 17982159 | DISPLAY DEVICE | Non-Final OA | LG Display Co., Ltd. |
| 18493733 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18295880 | DISPLAY DEVICE | Final Rejection | Samsung Display Co., LTD. |
| 18519652 | SEMICONDUCTOR MODULE AND WIRING MEMBER | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18484470 | SELF-ALIGNED TOPVIA AND METAL LINE WITH INCREASED HEIGHT | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18472427 | FRONT-END-OF-LINE (FEOL) CAPACITOR STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18150903 | THERMAL BARRIER STRUCTURE IN PHASE CHANGE MATERIAL DEVICE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17862372 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17547745 | OXIDE AND CARBON LAYERS AT A SURFACE OF A SUBSTRATE FOR HYBRID BONDING | Final Rejection | Intel Corporation |
| 18464268 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | SK hynix Inc. |
| 18215350 | EVALUATION METHOD, SEARCH METHOD, AND SEARCH SYSTEM | Non-Final OA | HITACHI HIGH-TECH CORPORATION |
| 18445460 | Method of designing four junction metamorphic multijunction solar cells for space applications | Non-Final OA | SolAero Technologies Corp. |
| 18150211 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | Final Rejection | MACRONIX INTERNATIONAL CO., LTD. |
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