Tech Center 2800 • Art Units: 2819 2822 2898
This examiner grants 85% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18363140 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18542761 | 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY | Final Rejection | Monolithic 3D Inc. |
| 17693282 | 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH REPLACEMENT GATES | Non-Final OA | Monolithic 3D Inc. |
| 17679058 | 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH REPLACEMENT GATES | Final Rejection | Monolithic 3D Inc. |
| 17891923 | INTEGRATED DIPOLE REGION FOR TRANSISTOR | Final Rejection | Applied Materials, Inc. |
| 18352583 | ISOLATION BETWEEN DEVICE AREAS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18197968 | FINFET DEVICE STRUCTURE AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17975720 | LIGHT IRRADIATION TYPE HEAT TREATMENT METHOD AND HEAT TREATMENT APPARATUS | Final Rejection | SCREEN Holdings Co., Ltd. |
| 18261507 | SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND SUBSTRATE MANUFACTURING METHOD | Final Rejection | Tokyo Electron Limited |
| 17496335 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE | Final Rejection | SK hynix Inc. |
| 18329396 | INTERFACE TRAP CHARGE DENSITY REDUCTION | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17882817 | HIGH VOLTAGE DEVICE | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17814725 | Semiconductor Device and Method | Final Rejection | Taiwan Semiconductor Manufacturing Co.,Ltd. |
| 17869558 | Dual Dopant Source/Drain Regions and Methods of Forming Same | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17651099 | SEMICONDUCTOR DEVICE AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17383299 | INTERCONNECTION STRUCTURE WITH SIDEWALL PROTECTION LAYER | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
| 17001056 | SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM | Final Rejection | KOKUSAI ELECTRIC CORPORATION |
| 16388225 | Compositions and Methods Using Same for Deposition of Silicon-Containing Films | Final Rejection | Versum Materials US, LLC |
| 18323481 | Integrated Fan-Out Package with 3D Magnetic Core Inductor | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18275595 | AI BONDING WIRE FOR SEMICONDUCTOR DEVICES | Final Rejection | NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. |
| 17788238 | COMPONENT AND METHOD FOR PRODUCING A COMPONENT | Final Rejection | ams-OSRAM International GmbH |
| 17799267 | WAFER HOLDER AND METHOD FOR OPERATING THE SAME | Non-Final OA | INNOSCIENCE (SUZHOU) SEMICONDUCTOR CO., LTD. |
| 18355656 | COMPOSITE SUBSTRATE, MANUFACTURING METHOD THEREOF AND SEMICONDUCTOR DEVICE | Non-Final OA | Enkris Semiconductor (Wuxi), Ltd. |
| 18319321 | Optical Annealing Apparatus And Method For Forming Semiconductor Structure | Final Rejection | Shanghai Huahong Grace Semiconductor Manufacturing Corporation |
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