Tech Center 2800 • Art Units: 2819 2822 2898
This examiner grants 85% of resolved cases
Mary A. Wilczewski serves as an examiner in Art Unit 2819, which is part of Tech Center 2800. She has managed 838 resolved cases, providing a robust statistical foundation for her profile. His allowance rate is 84.8 percent, indicating that a strong majority of applications she reviews reach a grant. This 84.8 percent rate suggests a favorable environment for applicants in this art unit.
The data shows an interview lift of 10.2 percent for this examiner. This positive lift indicates that direct communication is a beneficial tool for advancing applications and resolving outstanding issues. Practitioners should utilize the 10.2 percent lift to improve their chances of success, as it represents a significant advantage over standard written prosecution. The 838 resolved cases demonstrate the effectiveness of this strategy.
The median time to allowance is 961 days. This 961-day timeframe serves as a benchmark for the expected duration of the prosecution process. By analyzing the 84.8 percent allowance rate and the 961-day median, attorneys can develop effective strategies and manage client expectations. These metrics provide a comprehensive view of the examination trends in Art Unit 2819.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18340419 | MEMORY DEVICES INCLUDING VERTICAL STACK STRUCTURE, METHODS OF MANUFACTURING AND OPERATING THE SAME, AND ELECTRONIC APPARATUSES INCLUDING MEMORY DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18108125 | SEMICONDUCTOR DEVICES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18665907 | DISPLAY DEVICE AND MANUFACTURING METHOD OF DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18781527 | LIGHT EMITTING DISPLAY APPARATUS | Non-Final OA | LG Display Co., Ltd. |
| 17798828 | DISPLAY DEVICE | Non-Final OA | SHARP KABUSHIKI KAISHA |
| 18496081 | SEMICONDUCTOR PROCESSING CHAMBER WITH FILAMENT LAMPS HAVING NONUNIFORM HEAT OUTPUT | Final Rejection | ASM IP Holding B.V. |
| 17788238 | COMPONENT AND METHOD FOR PRODUCING A COMPONENT | Non-Final OA | ams-OSRAM International GmbH |
| 18897128 | SEMICONDUCTOR DEVICE | Non-Final OA | IDEMITSU KOSAN CO., LTD. |
| 18365241 | ANNEALING APPARATUS AND METHOD OF OPERATING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 18352583 | ISOLATION BETWEEN DEVICE AREAS | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18321844 | METHOD FOR PERFORMING TRENCH ISOLATION PROCESS | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18197968 | FINFET DEVICE STRUCTURE AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18786886 | INTERFACE TRAP CHARGE DENSITY REDUCTION | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18782214 | EMBEDDED STRESSORS IN EPITAXY SOURCE/DRAIN REGIONS | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18782255 | Dual Dopant Source/Drain Regions and Methods of Forming Same | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18783352 | SYSTEMS AND METHODS FOR PROCESSING A SUBSTRATE | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18447149 | SILICON-GERMANIUM FINS AND METHODS OF PROCESSING THE SAME IN FIELD-EFFECT TRANSISTORS | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18363444 | SEMICONDUCTOR DEVICE AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18363554 | FINFET DEVICE AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18329396 | INTERFACE TRAP CHARGE DENSITY REDUCTION | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17814725 | Semiconductor Device and Method | Non-Final OA | Taiwan Semiconductor Manufacturing Co.,Ltd. |
| 17813700 | MITIGATION OF TIME DEPENDENT DIELECTRIC BREAKDOWN | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17383299 | INTERCONNECTION STRUCTURE WITH SIDEWALL PROTECTION LAYER | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
| 17150044 | FINFET DEVICE AND METHOD | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17891923 | INTEGRATED DIPOLE REGION FOR TRANSISTOR | Non-Final OA | Applied Materials, Inc. |
| 18738371 | Transistor and Method for Manufacturing Same | Non-Final OA | Microchip Technology Incorporated |
| 16388225 | Compositions and Methods Using Same for Deposition of Silicon-Containing Films | Non-Final OA | Versum Materials US, LLC |
| 17611418 | ORGANIC LIGHT-EMITTING MATERIAL CONTAINING TETRAPHENYLBENZENE, PREPARATION,AND APPLICATION | Non-Final OA | South China University of Technology |
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