Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2819 2822 2898
This examiner grants 85% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18363140 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18340419 | MEMORY DEVICES INCLUDING VERTICAL STACK STRUCTURE, METHODS OF MANUFACTURING AND OPERATING THE SAME, AND ELECTRONIC APPARATUSES INCLUDING MEMORY DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18108125 | SEMICONDUCTOR DEVICES | Final Rejection | Samsung Electronics Co., Ltd. |
| 18781527 | LIGHT EMITTING DISPLAY APPARATUS | Non-Final OA | LG Display Co., Ltd. |
| 18432208 | DISPLAY DEVICE | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 17798828 | DISPLAY DEVICE | Non-Final OA | SHARP KABUSHIKI KAISHA |
| 18365241 | ANNEALING APPARATUS AND METHOD OF OPERATING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 18352583 | ISOLATION BETWEEN DEVICE AREAS | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18321844 | METHOD FOR PERFORMING TRENCH ISOLATION PROCESS | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18170845 | Interconnect Structure for Improving Memory Performance and/or Logic Performance | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18783352 | SYSTEMS AND METHODS FOR PROCESSING A SUBSTRATE | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18782214 | EMBEDDED STRESSORS IN EPITAXY SOURCE/DRAIN REGIONS | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18501653 | PATTERNING METHOD AND STRUCTURES RESULTING THEREFROM | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18447149 | SILICON-GERMANIUM FINS AND METHODS OF PROCESSING THE SAME IN FIELD-EFFECT TRANSISTORS | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18363444 | SEMICONDUCTOR DEVICE AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18329396 | INTERFACE TRAP CHARGE DENSITY REDUCTION | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18324894 | SYSTEM AND METHOD FOR HEATING SEMICONDUCTOR WAFERS | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17882817 | HIGH VOLTAGE DEVICE | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17651099 | SEMICONDUCTOR DEVICE AND METHOD | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17383299 | INTERCONNECTION STRUCTURE WITH SIDEWALL PROTECTION LAYER | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
| 17150044 | FINFET DEVICE AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18323481 | Integrated Fan-Out Package with 3D Magnetic Core Inductor | Final Rejection | Taiwan Semiconductor Manufacturing Company Limited |
| 17891923 | INTEGRATED DIPOLE REGION FOR TRANSISTOR | Non-Final OA | Applied Materials, Inc. |
| 18738371 | Transistor and Method for Manufacturing Same | Non-Final OA | Microchip Technology Incorporated |
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