Technology areas: Semiconductors, Circuits & Optics • Medical Devices & Mechanical Engineering
73 pending office actions • 25 art units • 63 examiners • 0 of 73 (0%) have an AI response strategy ready • 128 patents granted in the last 365 days
DISCO Corporation has 79 pending office actions in Medical Devices & Mechanical Engineering. The docket spans 67 distinct examiners and 27 art units, reflecting broad distribution across both examiner relationships and technical assignments.
SHUM, KENT N is the busiest examiner, with 4 pending matters. This is the clearest examiner-level concentration identified in the profile, although most matters are handled elsewhere.
The scale and dispersion support centralized docket controls, issue coding, and amendment tracking. Counsel should preserve examiner-specific tactics while monitoring recurring medical-device and mechanical-engineering issues across art units.
Based on the USPTO statutory response window for each pending office action. 19 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 19 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §103 only | 37 (51%) |
| §102 only | 5 (7%) |
| §112 only | 1 (1%) |
| Multi-statute (no §101) | 30 (41%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| SHUM, KENT N | 4 | 38.5% | +48.3% |
| PETERSON, ERIK T | 3 | 76.4% | +10.5% |
| MARKMAN, MAKENA | 2 | 59.9% | +38.3% |
| DONG, LIANG | 2 | 53.2% | +32.7% |
| TRAN, THIEN S | 2 | 71.9% | +24.0% |
| DION, MARCEL T | 2 | 40.7% | +36.8% |
| ECKARDT, ADAM MICHAEL | 2 | 65.5% | +38.7% |
| BERGNER, ERIN FLANAGAN | 1 | 76.4% | +30.8% |
| KOSKY, JUSTIN THOMAS | 1 | — | — |
| ORTA, LAUREN GRACE | 1 | 76.1% | +27.3% |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17658031 | CUTTING METHOD OF WAFER | SRINIVASAN, SESHA SAIRAMAN | 49d overdue |
| 18345120 | CLEANING TOOL AND WORKPIECE PROCESSING METHOD | COOK, KYLE A | 24d overdue |
| 18461077 | POLISHING LIQUID FOR POLISHING COMPOUND SEMICONDUCTOR SUBSTRATE | CASE, SARAH CATHERINE | 16d overdue |
| 18452756 | LASER PROCESSING MACHINE | WALTHOUR, SCOTT J | 15d overdue |
| 18328988 | VERIFICATION METHOD FOR DEVICE CHIPS | PETERSON, ERIK T | 8d |
| 18165058 | SURFACE IRREGULARITY REDUCING METHOD AND SURFACE IRREGULARITY REDUCING APPARATUS | DION, MARCEL T | 39d |
| 18150414 | LASER PROCESSING APPARATUS | AMAR, MARC J | 46d |
| 18324274 | DEBURRING UNIT AND CUTTING MACHINE | MARKMAN, MAKENA | 76d |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18186323 | GRINDING METHOD OF WAFER | SHUM, KENT N | 35d overdue |
| 18328988 | VERIFICATION METHOD FOR DEVICE CHIPS | PETERSON, ERIK T | 8d |
| 17652537 | GRINDING APPARATUS | SHUM, KENT N | 20d |
| 18816079 | DIVIDING METHOD | DONG, LIANG | 27d |
| 18321411 | MANUFACTURING METHOD OF CHIPS | PETERSON, ERIK T | 28d |
| 18165058 | SURFACE IRREGULARITY REDUCING METHOD AND SURFACE IRREGULARITY REDUCING APPARATUS | DION, MARCEL T | 39d |
| 18324274 | DEBURRING UNIT AND CUTTING MACHINE | MARKMAN, MAKENA | 76d |
| 19093830 | PROTECTIVE LAYER FORMING METHOD AND WORKPIECE PROCESSING METHOD | BERGNER, ERIN FLANAGAN | — |
| Art Unit | Apps |
|---|---|
| 3723 | 19 |
| 2898 | 7 |
| 3745 | 7 |
| 3724 | 6 |
| 3761 | 6 |
| 2817 | 3 |
| 1713 | 2 |
| 2892 | 2 |
| 1714 | 2 |
| 1746 | 2 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 19093830 | PROTECTIVE LAYER FORMING METHOD AND WORKPIECE PROCESSING METHOD | BERGNER, ERIN FLANAGAN | 1713 | §102§103 | Non-Final OA | — | Pending | Mar 28, 2025 |
| 19066492 | FRAME UNIT FORMING METHOD, FRAME UNIT FORMING APPARATUS, AND METHOD OF FORMING DEVICE CHIPS | KOSKY, JUSTIN THOMAS | 3655 | §103 | Non-Final OA | — | Pending | Feb 28, 2025 |
| 19051429 | CLEANING APPARATUS AND CLEANING METHOD | ORTA, LAUREN GRACE | 1711 | §102 | Non-Final OA | — | Pending | Feb 12, 2025 |
| 18987473 | WORKPIECE PROCESSING METHOD | MARKMAN, MAKENA | 3723 | §103§112 | Non-Final OA | — | Pending | Dec 19, 2024 |
| 18953671 | MEASURING METHOD, MEASURING APPARATUS, AND WORKPIECE PROCESSING METHOD | DONG, LIANG | 3724 | §103 | Non-Final OA | — | Pending | Nov 20, 2024 |
| 18934364 | PROTECTIVE MEMBER FORMING APPARATUS | LUK, EMMANUEL S | 1717 | §103 | Non-Final OA | — | Pending | Nov 01, 2024 |
| 18929998 | METHOD FOR PROCESSING LAMINATED WAFER | SHUM, KENT N | 3723 | §102§103§112 | Non-Final OA | — | Pending | Oct 29, 2024 |
| 18894292 | METHOD OF PROCESSING WORKPIECE | CRANDALL, JOEL DILLON | 3723 | §102 | Non-Final OA | — | Pending | Sep 24, 2024 |
| 18894401 | WORKPIECE PROCESSING METHOD | ESKRIDGE, CORY W | 2898 | §102 | Non-Final OA | — | Pending | Sep 24, 2024 |
| 18887709 | METHOD OF PROCESSING WAFER | RAHMAN, ARIFUR | 2813 | §103 | Non-Final OA | — | Pending | Sep 17, 2024 |
| 18823105 | PROCESSING METHOD | NEIBAUR, ROBERT F | 3723 | §102 | Non-Final OA | — | Pending | Sep 03, 2024 |
| 18820928 | DEVICE CHIP MANUFACTURING METHOD | DYKES, LAURA M | 2892 | §103§112 | Non-Final OA | — | Pending | Aug 30, 2024 |
| 18816079 | DIVIDING METHOD | DONG, LIANG | 3724 | §103 | Final Rejection | 27d | Pending | Aug 27, 2024 |
| 18812168 | METHOD OF MANUFACTURING WAFER | DAS, PINAKI | 2898 | §103 | Non-Final OA | — | Pending | Aug 22, 2024 |
| 18809484 | BREAKING METHOD | TRAN, BENJAMIN HOANG | 2817 | §103 | Non-Final OA | — | Pending | Aug 20, 2024 |
| 18794112 | METHOD OF PROCESSING CARBON-CONTAINED MONOCRYSTALLINE SUBSTRATE | QI, HUA | 1714 | §102§103 | Non-Final OA | — | Pending | Aug 05, 2024 |
| 18787386 | METHOD OF GRINDING WAFER | DO, NHAT CHIEU Q | 3724 | §102§103§112 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18784200 | PROCESSING METHOD FOR WORKPIECE | FULL, SIDNEY DANIELLE | 3723 | §103§112 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18765518 | METHOD OF PROCESSING WORKPIECE | KNUDSON, BRAD ALLAN | 3724 | §103 | Non-Final OA | — | Pending | Jul 08, 2024 |
| 18761626 | GRINDING METHOD OF WAFER | ISHAQ, ISHAQ MOHAMED SAID | 3723 | §103 | Non-Final OA | — | Pending | Jul 02, 2024 |
| 18753610 | PROCESSING METHOD OF WAFER | OMGBA, ESSAMA | 3746 | §103 | Non-Final OA | — | Pending | Jun 25, 2024 |
| 18750001 | WAFER GRINDING METHOD | REITZ, MICHAEL K. | 3745 | §103§112 | Final Rejection | — | Pending | Jun 21, 2024 |
| 18742173 | WAFER PROCESSING METHOD | BRECHT, CHARLES MATTHEW | 2817 | §102§103 | Non-Final OA | — | Pending | Jun 13, 2024 |
| 18679889 | CHUCK TABLE AND EDGE TRIMMING APPARATUS | SAENZ, ALBERTO | 3723 | §103§112 | Non-Final OA | — | Pending | May 31, 2024 |
| 18653031 | PROCESSING TOOL | NG, DIEGO JESUS | 3723 | §103 | Non-Final OA | — | Pending | May 02, 2024 |
| 18625388 | PROCESSING METHOD AND PROCESSING APPARATUS FOR WORKPIECE | ROSARIO-APONTE, ALBA T | 3761 | §102§112 | Non-Final OA | — | Pending | Apr 03, 2024 |
| 18616457 | METHOD FOR MANUFACTURING CHIPS | MACEDA, KRYSTENE NHE BANDONG | 3761 | §103 | Non-Final OA | — | Pending | Mar 26, 2024 |
| 18611952 | METHOD OF AND APPARATUS FOR PROCESSING WORKPIECE | LASASSO, VICTOR JOSEPH | 4100 | §102§103 | Non-Final OA | — | Pending | Mar 21, 2024 |
| 18609620 | LASER PROCESSING APPARATUS | BELAY, DILNESSA B | 3761 | §102§103 | Non-Final OA | — | Pending | Mar 19, 2024 |
| 18609222 | WAFER THINNING METHOD | TRAN, THIEN S | — | §102§103 | Non-Final OA | — | Pending | Mar 19, 2024 |
| 18604676 | WATER REFINING APPARATUS AND METHOD OF MANUFACTURING WAFER | KURTZ, BENJAMIN M | 1779 | §103 | Non-Final OA | — | Pending | Mar 14, 2024 |
| 18588473 | POLISHING PAD AND POLISHING METHOD | JOH, CATHERINE | 3723 | §103 | Final Rejection | — | Pending | Feb 27, 2024 |
| 18586818 | DRESSING MEMBER | DION, MARCEL T | 3723 | §103 | Final Rejection | — | Pending | Feb 26, 2024 |
| 18439028 | PROTECTIVE FILM, PROTECTIVE FILM AGENT, AND METHOD OF PROCESSING WORKPIECE | LAOBAK, ANDREW KEELAN | 1713 | §103 | Non-Final OA | 6d | Pending | Feb 12, 2024 |
| 18437847 | WAFER, AND FRONT/BACK SURFACE DETERMINATION METHOD FOR WAFER | MALSAWMA, LALRINFAMKIM HMAR | 2892 | §102§103§112 | Final Rejection | — | Pending | Feb 09, 2024 |
| 18429574 | ADHESIVE AND ADHERING METHOD | PATWARDHAN, ABHISHEK A | 1746 | §103 | Non-Final OA | 28d | Pending | Feb 01, 2024 |
| 18405135 | JIG FOR BEING INTEGRATED WITH INGOT | NEJAD, MAHDI H | 3723 | §103 | Final Rejection | — | Pending | Jan 05, 2024 |
| 18539713 | LASER PROCESSING APPARATUS | ECKARDT, ADAM MICHAEL | 3761 | §103§112 | Non-Final OA | — | Pending | Dec 14, 2023 |
| 18539676 | GRINDING WHEEL AND GRINDING METHOD | NGUYEN, DUSTIN T | 3745 | §103 | Final Rejection | — | Pending | Dec 14, 2023 |
| 18517530 | CHUCK TABLE | POON, DANA LEE | 3723 | §103 | Final Rejection | 19d overdue | Pending | Nov 22, 2023 |
| 18513908 | RESIN MEMBER AND DIVIDING APPARATUS | KIM, YUNJU | 1742 | §103 | Non-Final OA | — | Pending | Nov 20, 2023 |
| 18499723 | LASER PROCESSING APPARATUS AND PROCESSING METHOD | TRAN, THIEN S | 3761 | §103 | Non-Final OA | — | Pending | Nov 01, 2023 |
| 18492240 | PROCESSING METHOD OF BONDED WAFER | MILLER, ALEXANDER MICHAEL | 2898 | §103 | Final Rejection | — | Pending | Oct 23, 2023 |
| 18479948 | METHOD OF PROCESSING WAFER | PATEL, VISHAL I | 1746 | §103 | Non-Final OA | 36d overdue | Pending | Oct 03, 2023 |
| 18470857 | CUTTING APPARATUS AND CUTTING METHOD | RILEY, JONATHAN G | 3724 | §103§112 | Non-Final OA | — | Pending | Sep 20, 2023 |
| 18461077 | POLISHING LIQUID FOR POLISHING COMPOUND SEMICONDUCTOR SUBSTRATE | CASE, SARAH CATHERINE | 1731 | §103§112 | Non-Final OA | 16d overdue | Pending | Sep 05, 2023 |
| 18461214 | POLISHING LIQUID FOR POLISHING COMPOUND SEMICONDUCTOR SUBSTRATE | OLADAPO, TAIWO | 1771 | §103 | Non-Final OA | 26d | Pending | Sep 05, 2023 |
| 18452756 | LASER PROCESSING MACHINE | WALTHOUR, SCOTT J | 3741 | §102§112 | Final Rejection | 15d overdue | Pending | Aug 21, 2023 |
| 18451923 | DIVIDING METHOD OF WAFER | VU, HUNG K | 2897 | §102§103 | Non-Final OA | — | Pending | Aug 18, 2023 |
| 18363939 | WORKPIECE PROCESSING METHOD | CHANG, SUKWOO JAMES | 3723 | §102§103§112 | Final Rejection | — | Pending | Aug 02, 2023 |
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Start Free TrialDISCO Corporation has 73 pending office actions as of October 2026, spread across 25 art units and 63 examiners.
Kent N Shum has the most, with 4 of DISCO Corporation's pending office actions.
Mostly Medical Devices & Mechanical Engineering (USPTO Tech Center 3700), based on where its pending office actions are examined.
