| 19093830 |
PROTECTIVE LAYER FORMING METHOD AND WORKPIECE PROCESSING METHOD |
BERGNER, ERIN FLANAGAN |
1713 |
§102§103 |
Non-Final OA |
— |
Pending |
Mar 28, 2025 |
| 19066492 |
FRAME UNIT FORMING METHOD, FRAME UNIT FORMING APPARATUS, AND METHOD OF FORMING DEVICE CHIPS |
KOSKY, JUSTIN THOMAS |
3655 |
§103 |
Non-Final OA |
— |
Pending |
Feb 28, 2025 |
| 19051429 |
CLEANING APPARATUS AND CLEANING METHOD |
ORTA, LAUREN GRACE |
1711 |
§102 |
Non-Final OA |
— |
Pending |
Feb 12, 2025 |
| 18987473 |
WORKPIECE PROCESSING METHOD |
MARKMAN, MAKENA |
3723 |
§103§112 |
Non-Final OA |
— |
Pending |
Dec 19, 2024 |
| 18953671 |
MEASURING METHOD, MEASURING APPARATUS, AND WORKPIECE PROCESSING METHOD |
DONG, LIANG |
3724 |
§103 |
Non-Final OA |
— |
Pending |
Nov 20, 2024 |
| 18934364 |
PROTECTIVE MEMBER FORMING APPARATUS |
LUK, EMMANUEL S |
1717 |
§103 |
Non-Final OA |
— |
Pending |
Nov 01, 2024 |
| 18929998 |
METHOD FOR PROCESSING LAMINATED WAFER |
SHUM, KENT N |
3723 |
§102§103§112 |
Non-Final OA |
— |
Pending |
Oct 29, 2024 |
| 18894292 |
METHOD OF PROCESSING WORKPIECE |
CRANDALL, JOEL DILLON |
3723 |
§102 |
Non-Final OA |
— |
Pending |
Sep 24, 2024 |
| 18894401 |
WORKPIECE PROCESSING METHOD |
ESKRIDGE, CORY W |
2898 |
§102 |
Non-Final OA |
— |
Pending |
Sep 24, 2024 |
| 18887709 |
METHOD OF PROCESSING WAFER |
RAHMAN, ARIFUR |
2813 |
§103 |
Non-Final OA |
— |
Pending |
Sep 17, 2024 |
| 18823105 |
PROCESSING METHOD |
NEIBAUR, ROBERT F |
3723 |
§102 |
Non-Final OA |
— |
Pending |
Sep 03, 2024 |
| 18820928 |
DEVICE CHIP MANUFACTURING METHOD |
DYKES, LAURA M |
2892 |
§103§112 |
Non-Final OA |
— |
Pending |
Aug 30, 2024 |
| 18816079 |
DIVIDING METHOD |
DONG, LIANG |
3724 |
§103 |
Final Rejection |
27d |
Pending |
Aug 27, 2024 |
| 18812168 |
METHOD OF MANUFACTURING WAFER |
DAS, PINAKI |
2898 |
§103 |
Non-Final OA |
— |
Pending |
Aug 22, 2024 |
| 18809484 |
BREAKING METHOD |
TRAN, BENJAMIN HOANG |
2817 |
§103 |
Non-Final OA |
— |
Pending |
Aug 20, 2024 |
| 18794112 |
METHOD OF PROCESSING CARBON-CONTAINED MONOCRYSTALLINE SUBSTRATE |
QI, HUA |
1714 |
§102§103 |
Non-Final OA |
— |
Pending |
Aug 05, 2024 |
| 18787386 |
METHOD OF GRINDING WAFER |
DO, NHAT CHIEU Q |
3724 |
§102§103§112 |
Non-Final OA |
— |
Pending |
Jul 29, 2024 |
| 18784200 |
PROCESSING METHOD FOR WORKPIECE |
FULL, SIDNEY DANIELLE |
3723 |
§103§112 |
Non-Final OA |
— |
Pending |
Jul 25, 2024 |
| 18765518 |
METHOD OF PROCESSING WORKPIECE |
KNUDSON, BRAD ALLAN |
3724 |
§103 |
Non-Final OA |
— |
Pending |
Jul 08, 2024 |
| 18761626 |
GRINDING METHOD OF WAFER |
ISHAQ, ISHAQ MOHAMED SAID |
3723 |
§103 |
Non-Final OA |
— |
Pending |
Jul 02, 2024 |
| 18753610 |
PROCESSING METHOD OF WAFER |
OMGBA, ESSAMA |
3746 |
§103 |
Non-Final OA |
— |
Pending |
Jun 25, 2024 |
| 18750001 |
WAFER GRINDING METHOD |
REITZ, MICHAEL K. |
3745 |
§103§112 |
Final Rejection |
— |
Pending |
Jun 21, 2024 |
| 18742173 |
WAFER PROCESSING METHOD |
BRECHT, CHARLES MATTHEW |
2817 |
§102§103 |
Non-Final OA |
— |
Pending |
Jun 13, 2024 |
| 18679889 |
CHUCK TABLE AND EDGE TRIMMING APPARATUS |
SAENZ, ALBERTO |
3723 |
§103§112 |
Non-Final OA |
— |
Pending |
May 31, 2024 |
| 18653031 |
PROCESSING TOOL |
NG, DIEGO JESUS |
3723 |
§103 |
Non-Final OA |
— |
Pending |
May 02, 2024 |
| 18625388 |
PROCESSING METHOD AND PROCESSING APPARATUS FOR WORKPIECE |
ROSARIO-APONTE, ALBA T |
3761 |
§102§112 |
Non-Final OA |
— |
Pending |
Apr 03, 2024 |
| 18616457 |
METHOD FOR MANUFACTURING CHIPS |
MACEDA, KRYSTENE NHE BANDONG |
3761 |
§103 |
Non-Final OA |
— |
Pending |
Mar 26, 2024 |
| 18611952 |
METHOD OF AND APPARATUS FOR PROCESSING WORKPIECE |
LASASSO, VICTOR JOSEPH |
4100 |
§102§103 |
Non-Final OA |
— |
Pending |
Mar 21, 2024 |
| 18609620 |
LASER PROCESSING APPARATUS |
BELAY, DILNESSA B |
3761 |
§102§103 |
Non-Final OA |
— |
Pending |
Mar 19, 2024 |
| 18609222 |
WAFER THINNING METHOD |
TRAN, THIEN S |
— |
§102§103 |
Non-Final OA |
— |
Pending |
Mar 19, 2024 |
| 18604676 |
WATER REFINING APPARATUS AND METHOD OF MANUFACTURING WAFER |
KURTZ, BENJAMIN M |
1779 |
§103 |
Non-Final OA |
— |
Pending |
Mar 14, 2024 |
| 18588473 |
POLISHING PAD AND POLISHING METHOD |
JOH, CATHERINE |
3723 |
§103 |
Final Rejection |
— |
Pending |
Feb 27, 2024 |
| 18586818 |
DRESSING MEMBER |
DION, MARCEL T |
3723 |
§103 |
Final Rejection |
— |
Pending |
Feb 26, 2024 |
| 18439028 |
PROTECTIVE FILM, PROTECTIVE FILM AGENT, AND METHOD OF PROCESSING WORKPIECE |
LAOBAK, ANDREW KEELAN |
1713 |
§103 |
Non-Final OA |
6d |
Pending |
Feb 12, 2024 |
| 18437847 |
WAFER, AND FRONT/BACK SURFACE DETERMINATION METHOD FOR WAFER |
MALSAWMA, LALRINFAMKIM HMAR |
2892 |
§102§103§112 |
Final Rejection |
— |
Pending |
Feb 09, 2024 |
| 18429574 |
ADHESIVE AND ADHERING METHOD |
PATWARDHAN, ABHISHEK A |
1746 |
§103 |
Non-Final OA |
28d |
Pending |
Feb 01, 2024 |
| 18405135 |
JIG FOR BEING INTEGRATED WITH INGOT |
NEJAD, MAHDI H |
3723 |
§103 |
Final Rejection |
— |
Pending |
Jan 05, 2024 |
| 18539713 |
LASER PROCESSING APPARATUS |
ECKARDT, ADAM MICHAEL |
3761 |
§103§112 |
Non-Final OA |
— |
Pending |
Dec 14, 2023 |
| 18539676 |
GRINDING WHEEL AND GRINDING METHOD |
NGUYEN, DUSTIN T |
3745 |
§103 |
Final Rejection |
— |
Pending |
Dec 14, 2023 |
| 18517530 |
CHUCK TABLE |
POON, DANA LEE |
3723 |
§103 |
Final Rejection |
19d overdue |
Pending |
Nov 22, 2023 |
| 18513908 |
RESIN MEMBER AND DIVIDING APPARATUS |
KIM, YUNJU |
1742 |
§103 |
Non-Final OA |
— |
Pending |
Nov 20, 2023 |
| 18499723 |
LASER PROCESSING APPARATUS AND PROCESSING METHOD |
TRAN, THIEN S |
3761 |
§103 |
Non-Final OA |
— |
Pending |
Nov 01, 2023 |
| 18492240 |
PROCESSING METHOD OF BONDED WAFER |
MILLER, ALEXANDER MICHAEL |
2898 |
§103 |
Final Rejection |
— |
Pending |
Oct 23, 2023 |
| 18479948 |
METHOD OF PROCESSING WAFER |
PATEL, VISHAL I |
1746 |
§103 |
Non-Final OA |
36d overdue |
Pending |
Oct 03, 2023 |
| 18470857 |
CUTTING APPARATUS AND CUTTING METHOD |
RILEY, JONATHAN G |
3724 |
§103§112 |
Non-Final OA |
— |
Pending |
Sep 20, 2023 |
| 18461077 |
POLISHING LIQUID FOR POLISHING COMPOUND SEMICONDUCTOR SUBSTRATE |
CASE, SARAH CATHERINE |
1731 |
§103§112 |
Non-Final OA |
16d overdue |
Pending |
Sep 05, 2023 |
| 18461214 |
POLISHING LIQUID FOR POLISHING COMPOUND SEMICONDUCTOR SUBSTRATE |
OLADAPO, TAIWO |
1771 |
§103 |
Non-Final OA |
26d |
Pending |
Sep 05, 2023 |
| 18452756 |
LASER PROCESSING MACHINE |
WALTHOUR, SCOTT J |
3741 |
§102§112 |
Final Rejection |
15d overdue |
Pending |
Aug 21, 2023 |
| 18451923 |
DIVIDING METHOD OF WAFER |
VU, HUNG K |
2897 |
§102§103 |
Non-Final OA |
— |
Pending |
Aug 18, 2023 |
| 18363939 |
WORKPIECE PROCESSING METHOD |
CHANG, SUKWOO JAMES |
3723 |
§102§103§112 |
Final Rejection |
— |
Pending |
Aug 02, 2023 |
| 18350164 |
WORKPIECE GRINDING METHOD |
SHUM, KENT N |
3723 |
§103 |
Non-Final OA |
— |
Pending |
Jul 11, 2023 |
| 18348533 |
METHOD AND APPARATUS FOR PROCESSING A SINGLE CRYSTAL BLANK |
SONG, MATTHEW J |
1714 |
§103 |
Non-Final OA |
1d overdue |
Pending |
Jul 07, 2023 |
| 18347723 |
LASER PROCESSING MACHINE |
LESLIE, MICHAEL S |
3745 |
§102§103 |
Non-Final OA |
— |
Pending |
Jul 06, 2023 |
| 18345120 |
CLEANING TOOL AND WORKPIECE PROCESSING METHOD |
COOK, KYLE A |
3722 |
§103§112Other |
Non-Final OA |
24d overdue |
Pending |
Jun 30, 2023 |
| 18342103 |
MANUFACTURING METHOD OF SUBSTRATE |
COLLINS, DANIEL S. |
3745 |
§102 |
Non-Final OA |
— |
Pending |
Jun 27, 2023 |
| 18338866 |
METHOD OF MANUFACTURING WAFER |
QUANDT, MICHAEL M |
3745 |
§103§112 |
Non-Final OA |
— |
Pending |
Jun 21, 2023 |
| 18332920 |
LASER PROCESSING APPARATUS |
WIBLIN, MATTHEW |
3745 |
§102§103 |
Non-Final OA |
— |
Pending |
Jun 12, 2023 |
| 18328988 |
VERIFICATION METHOD FOR DEVICE CHIPS |
PETERSON, ERIK T |
2898 |
§103§112 |
Final Rejection |
8d |
Pending |
Jun 05, 2023 |
| 18324274 |
DEBURRING UNIT AND CUTTING MACHINE |
MARKMAN, MAKENA |
3723 |
§102§103 |
Non-Final OA |
76d |
Pending |
May 26, 2023 |
| 18321411 |
MANUFACTURING METHOD OF CHIPS |
PETERSON, ERIK T |
2898 |
§103 |
Final Rejection |
28d |
Pending |
May 22, 2023 |
| 18317266 |
CUTTING APPARATUS |
FLORES SANCHEZ, OMAR |
3724 |
§103Other |
Non-Final OA |
— |
Pending |
May 15, 2023 |
| 18297102 |
WAFER MANUFACTURING METHOD |
BUI, ANDREW THANH |
3745 |
§103 |
Final Rejection |
— |
Pending |
Apr 07, 2023 |
| 18194785 |
SPINDLE UNIT |
HOLIZNA, CALEB ANDREW |
3723 |
§103 |
Final Rejection |
20d |
Pending |
Apr 03, 2023 |
| 18186323 |
GRINDING METHOD OF WAFER |
SHUM, KENT N |
3723 |
§103 |
Non-Final OA |
35d overdue |
Pending |
Mar 20, 2023 |
| 18178794 |
CHIP MANUFACTURING METHOD |
PETERSON, ERIK T |
2898 |
§103 |
Non-Final OA |
— |
Pending |
Mar 06, 2023 |
| 18176600 |
LASER BEAM APPLYING APPARATUS |
RHUE, ABIGAIL H |
3761 |
§103 |
Non-Final OA |
— |
Pending |
Mar 01, 2023 |
| 18165058 |
SURFACE IRREGULARITY REDUCING METHOD AND SURFACE IRREGULARITY REDUCING APPARATUS |
DION, MARCEL T |
3723 |
§102§103§112 |
Final Rejection |
39d |
Pending |
Feb 06, 2023 |
| 18150414 |
LASER PROCESSING APPARATUS |
AMAR, MARC J |
3741 |
§103§112 |
Final Rejection |
46d |
Pending |
Jan 05, 2023 |
| 17809701 |
METHOD OF PROCESSING WAFER |
ADHIKARI DAWADI, BIPANA |
2898 |
§103 |
Non-Final OA |
— |
Pending |
Jun 29, 2022 |
| 17806832 |
MANUFACTURING METHOD FOR DEVICE CHIP |
NIX, NORA TAYLOR |
2891 |
§103 |
Final Rejection |
— |
Pending |
Jun 14, 2022 |
| 17663744 |
LASER PROCESSING APPARATUS |
ECKARDT, ADAM MICHAEL |
3700 |
§103 |
Final Rejection |
— |
Pending |
May 17, 2022 |
| 17658031 |
CUTTING METHOD OF WAFER |
SRINIVASAN, SESHA SAIRAMAN |
2817 |
§102§103 |
Final Rejection |
49d overdue |
Pending |
Apr 05, 2022 |
| 17652537 |
GRINDING APPARATUS |
SHUM, KENT N |
3723 |
§112 |
Non-Final OA |
20d |
Pending |
Feb 25, 2022 |
