Prosecution Insights
Prosecution Insights
8 pending office actions • 6 art units • 8 examiners • 0 of 8 (0%) have an AI response strategy ready • 16 patents granted in the last 365 days
Based on the USPTO statutory response window for each pending office action. 4 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 4 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §101 + other | 1 (12%) |
| §103 only | 3 (38%) |
| Multi-statute (no §101) | 4 (50%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| ZARNEKE, DAVID A | 1 | 70.8% | +10.8% |
| LEE, CHUN KUAN | 1 | 68.3% | +3.8% |
| WALL, VINCENT | 1 | 62.2% | +24.3% |
| HUTSON, NICHOLAS LELAND | 1 | 60.0% | +16.7% |
| PROSTOR, ANDREW VICTOR | 1 | 97.2% | +4.0% |
| ERDEM, FAZLI | 1 | 85.3% | +16.0% |
| DOAN, TRANG T | 1 | 82.9% | +16.9% |
| ZABEL, ANDREW JOHN | 1 | 85.3% | +21.7% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 1 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18231547 | MANUFACTURING METHOD OF DIAMOND COMPOSITE WAFER | ERDEM, FAZLI | 7d |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 5 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17969447 | DATA COLLECTION AND ANALYSIS SYSTEM AND DEVICE | DOAN, TRANG T | 5d overdue |
| 18542032 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME | WALL, VINCENT | 75d |
| 18473999 | SEMICONDUCTOR PACKAGE STRUCTURE FOR ENHANCED COOLING | HUTSON, NICHOLAS LELAND | — |
| 18471670 | SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY WITH EDGE SIDE INTERCONNECTION AND METHOD OF FORMING THE SAME | PROSTOR, ANDREW VICTOR | — |
| 17854489 | COMPOSITE SEMICONDUCTOR WAFER/CHIP FOR ADVANCED ICS AND ADVANCED IC PACKAGES AND THE MANUFACTURE METHOD THEREOF | ZABEL, ANDREW JOHN | — |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 6 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17969447 | DATA COLLECTION AND ANALYSIS SYSTEM AND DEVICE | DOAN, TRANG T | 5d overdue |
| 18231547 | MANUFACTURING METHOD OF DIAMOND COMPOSITE WAFER | ERDEM, FAZLI | 7d |
| 18542032 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME | WALL, VINCENT | 75d |
| 19214066 | COWOS IC STRUCTURE WITH EDGE-PAD SEMICONDUCTOR DIE | ZARNEKE, DAVID A | 86d |
| 18473999 | SEMICONDUCTOR PACKAGE STRUCTURE FOR ENHANCED COOLING | HUTSON, NICHOLAS LELAND | — |
| 17854489 | COMPOSITE SEMICONDUCTOR WAFER/CHIP FOR ADVANCED ICS AND ADVANCED IC PACKAGES AND THE MANUFACTURE METHOD THEREOF | ZABEL, ANDREW JOHN | — |
| Art Unit | Apps |
|---|---|
| 2818 | 2 |
| 2812 | 2 |
| 2891 | 1 |
| 2181 | 1 |
| 2898 | 1 |
| 2431 | 1 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 19214066 | COWOS IC STRUCTURE WITH EDGE-PAD SEMICONDUCTOR DIE | ZARNEKE, DAVID A | 2891 | §103 | Non-Final OA | 86d | Pending | May 21, 2025 |
| 19008669 | MEMORY CHIP AND MEMORY SYSTEM WITH THE SAME | LEE, CHUN KUAN | 2181 | §103Other | Non-Final OA | — | Pending | Jan 03, 2025 |
| 18542032 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME | WALL, VINCENT | 2898 | §102§103 | Non-Final OA | 75d | Pending | Dec 15, 2023 |
| 18473999 | SEMICONDUCTOR PACKAGE STRUCTURE FOR ENHANCED COOLING | HUTSON, NICHOLAS LELAND | 2818 | §102§103 | Final Rejection | — | Pending | Sep 25, 2023 |
| 18471670 | SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY WITH EDGE SIDE INTERCONNECTION AND METHOD OF FORMING THE SAME | PROSTOR, ANDREW VICTOR | 2812 | §102§103§112 | Non-Final OA | — | Pending | Sep 21, 2023 |
| 18231547 | MANUFACTURING METHOD OF DIAMOND COMPOSITE WAFER | ERDEM, FAZLI | 2812 | §103 | Non-Final OA | 7d | Pending | Aug 08, 2023 |
| 17969447 | DATA COLLECTION AND ANALYSIS SYSTEM AND DEVICE | DOAN, TRANG T | 2431 | §101§103§112Other | Final Rejection | 5d overdue | Pending | Oct 19, 2022 |
| 17854489 | COMPOSITE SEMICONDUCTOR WAFER/CHIP FOR ADVANCED ICS AND ADVANCED IC PACKAGES AND THE MANUFACTURE METHOD THEREOF | ZABEL, ANDREW JOHN | 2818 | §102§103 | Final Rejection | — | Pending | Jun 30, 2022 |
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