7 pending office actions
| App # | Title | Examiner | Art Unit | Status | Filed |
|---|---|---|---|---|---|
| 19342105 | 3D IC STRUCTURE | GUMEDZOE, PENIEL M | 2899 | Non-Final OA | Sep 26, 2025 |
| 19315804 | SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY WITH EDGE SIDE INTERCONNECTION AND METHOD OF FORMING THE SAME | SOWARD, IDA M | 2898 | Final Rejection | Sep 01, 2025 |
| 19214066 | COWOS IC STRUCTURE WITH EDGE-PAD SEMICONDUCTOR DIE | ZARNEKE, DAVID A | 2891 | Final Rejection | May 21, 2025 |
| 18231408 | SEMICONDUCTOR STRUCTURE | ARORA, AJAY | 2892 | Non-Final OA | Aug 08, 2023 |
| 18231547 | MANUFACTURING METHOD OF DIAMOND COMPOSITE WAFER | ERDEM, FAZLI | 2812 | Final Rejection | Aug 08, 2023 |
| 17969447 | DATA COLLECTION AND ANALYSIS SYSTEM AND DEVICE | DOAN, TRANG T | 2431 | Final Rejection | Oct 19, 2022 |
| 17854489 | COMPOSITE SEMICONDUCTOR WAFER/CHIP FOR ADVANCED ICS AND ADVANCED IC PACKAGES AND THE MANUFACTURE METHOD THEREOF | ZABEL, ANDREW JOHN | 2818 | Non-Final OA | Jun 30, 2022 |
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