Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2818
This examiner grants 84% of resolved cases
Andrew John Zabel has 38 resolved cases in Art Unit 2818 of Technology Center 2800. The allowance rate is 84.2 percent. The interview lift is 24.0 percent, and the median days to allowance is 1230. The allowance rate of 84.2 percent suggests the environment for applicants. With 38 cases resolved, the 24.0 percent interview lift indicates that direct communication is effective at securing grants.
The 1230-day median pendency is the timeline metric for this examiner. Practitioners should note that the 84.2 percent allowance rate provides a baseline for success. The 24.0 percent lift is a tool for overcoming initial rejections. The 1230-day timeline is the duration for the 2800 technology center. This data suggests that the examiner is open to granting patents and responsive to technical arguments made during interviews. These figures provide a benchmark for prosecution in Art Unit 2818.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18427977 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18197847 | DISPLAY MODULE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18131548 | SEMICONDUCTOR DEVICE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18682458 | METAL OXIDE THIN FILM TRANSISTOR AND METHOD FOR MANUFACTURING SAME, AND DISPLAY PANEL | Non-Final OA | BOE Technology Group Co., Ltd. |
| 17949358 | DISPLAY DEVICE | Final Rejection | Samsung Display Co., LTD. |
| 18593362 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 18594219 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE | Non-Final OA | KABUSHIKI KAISHA TOSHIBA |
| 18681773 | SEMICONDUCTOR-SUPERCONDUCTOR HYBRID DEVICE HAVING SIDE JUNCTIONS | Non-Final OA | Microsoft Technology Licensing LLC |
| 18434903 | BACKSIDE TO FRONTSIDE CONNECTION BETWEEN DIFFERENT METAL TRACKS | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18171795 | SUBTRACTIVE METAL VIA WITH METAL BRIDGE | Final Rejection | International Business Machines Corporation |
| 17890368 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MANUFACTURING APPARATUS | Final Rejection | Kioxia Corporation |
| 18594210 | RESISTOR | Non-Final OA | STMicroelectronics International N.V. |
| 18586596 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING A SEMICONDUCTOR DEVICE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 18411620 | Static Random-Access Memory Device with Enhanced Isolation Structure and Increased Packing Density | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18320398 | PACKAGE STRUCTURE WITH OPTICAL ELEMENTS AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18318865 | INTEGRATED CIRCUIT STRUCTURE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18303551 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 17887490 | TRANSISTOR, INTEGRATED CIRCUIT, AND MANUFACTURING METHOD OF TRANSISTOR | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18609870 | SEMICONDUCTOR STRUCTURE WITH STRESS RELIEF LAYER AND THE METHODS FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18405526 | FIELD EFFECT TRANSISTOR WITH ISOLATED SOURCE/DRAINS AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18433936 | BARRIER AND LINER TREATMENT USING DUAL RADIO FREQUENCY CAPACITIVE COUPLE PLASMA FOR METAL INTERCONNECTS | Non-Final OA | Applied Materials, Inc. |
| 18044386 | LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD | Non-Final OA | Tokyo Electron Limited |
| 18580580 | SANDWICHED MULTI-LAYER STRUCTURE FOR COOLING HIGH POWER ELECTRONICS | Final Rejection | Tesla, Inc. |
| 18608113 | SEMICONDUCTOR DEVICE | Final Rejection | Socionext Inc. |
| 18646424 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18683042 | TEMPORARILY BONDED WAFER AND METHOD FOR MANUFACTURING THE WAFER | Non-Final OA | SHIN-ETSU HANDOTAI CO., LTD. |
| 18143076 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | UNITED MICROELECTRONICS CORP. |
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